OUTPUT CURRENT DETECTION IN HIGH-SIDE SWITCH

Abstract

In an example, a system includes a first power stage including a first power field effect transistor (FET) and a first sense transistor coupled to the first power FET. The system also includes a second power stage including a second power FET and a second sense transistor coupled to the second power FET, where the second power stage is smaller than the first power stage. The system includes a first switch coupled to a gate and a drain of the first power FET and a second switch coupled to the first power stage and the second power stage. The system also includes a sense amplifier coupled to the second switch, where the first power stage, the second power stage, and the sense amplifier are coupled to a load terminal.

Description

BACKGROUND

A high-side switch in an automotive or industrial application may couple to a power supply and provide power for downstream circuitry from the main power supply. The high-side switch may include diagnostic and protection circuitry. A cable or other connection may connect the high-side switch to the downstream circuitry. Wire-break detection detects a disconnection between the high-side switch and the downstream circuitry.

SUMMARY

In at least one example of the description, a system includes a first power stage including a first power field effect transistor (FET) and a first sense transistor coupled to the first power FET. The system also includes a second power stage including a second power FET and a second sense transistor coupled to the second power FET, where the second power stage is smaller than the first power stage. The system includes a first switch coupled to a gate and a drain of the first power FET and a second switch coupled to the first power stage and the second power stage. The system also includes a sense amplifier coupled to the second switch, where the first power stage, the second power stage, and the sense amplifier are coupled to a load terminal.

In at least one example of the description, a system includes a first power stage including a first power FET and a first sense transistor coupled to the first power FET, where the first power stage is configured to provide a first current to a load terminal. The system also includes a second power stage including a second power FET and a second sense transistor coupled to the second power FET, where the second power stage is smaller than the first power stage, and where the second power stage is configured to provide a second current to the load terminal. The system includes a first switch coupled to a gate and a drain of the first power FET, where the first switch is configured to connect the gate to the drain of the first power FET. The system also includes a second switch coupled to the first power stage and the second power stage, where the second switch is configured to connect the first power stage or the second power stage to a sense amplifier.

In at least one example of the description, a method includes providing a first current to a load with a first power stage in a first mode of operation, where the first power stage includes a first power FET and a first sense transistor. The method includes switching to a second mode of operation. Responsive to switching to the second mode of operation, the method includes providing a second current to the load with a second power stage, where the second power stage includes a second power FET and a second sense transistor. The method also includes connecting the first power FET in a diode connected configuration. The method includes coupling the second sense transistor to a sense amplifier.

In at least one example of the description, a system includes a first transistor configured to provide a first current to a load terminal in a first mode of operation. The system also includes a second transistor configured to provide a second current to the load terminal in a second mode of operation. The system includes a switch coupled to a gate and a drain of the first transistor and configured to place the first transistor in a diode-connected configuration during the second mode of operation. The system also includes a comparator having a comparator output, a first comparator input, and a second comparator input, where the first comparator input is coupled to a voltage supply terminal, the second comparator input is coupled to the load terminal, and the comparator is configured to provide a signal to exit the second mode of operation based on a comparison between a supply voltage and a voltage at the load terminal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a circuit diagram of a high-side switch in various examples.

FIG. 1B is a circuit diagram of a high-side switch in various examples.

FIG. 2A is collection of graphs showing wire break mode and detection in various examples.

FIG. 2B is collection of graphs showing wire break mode and detection in various examples.

FIG. 3 is block diagram of a high-side switch in various examples.

FIG. 4 is block diagram of a system with a high-side switch in various examples.

FIG. 5 is a flow diagram of a method for low power mode output current detection in a high-side switch in various examples.

FIG. 6 is a circuit diagram of a low-power-mode channel driver in various examples.

DETAILED DESCRIPTION

A high-side switch may include a main power field effect transistor (FET) that couples power from a power supply to a load, such as downstream circuitry. The high-side switch may include additional diagnostic and protection circuitry coupled to the high-side switch. The high-side switch may include a sense FET coupled to the power FET to sense the current provided to the load by the power FET. The sense current is useful for controlling the current output of the power FET. The sense current may also be useful for detecting whether a wire break has occurred between the power FET and the load. A wire break may be detected by the output current dropping below a wire break threshold.

In some cases, the high-side switch includes sense circuitry that detects the output current provided to the load, where the output current may range from several hundred milliamps to as high as 40 Amps. However, the sense circuitry may be unable to accurately sense the output current if the output current is in the range of 300 microamps to a few milliamps. This smaller range is useful for detecting whether a wire break has occurred between the high-side switch and the load.

In examples herein, additional circuitry is included in the high-side switch that allows the high-side switch to accurately sense both high load currents and much smaller currents for wire break detection. In a normal mode of operation, a sense FET coupled to the power FET provides a sense current to a sense amplifier, and the sense current is useful for controlling the output current of the power FET. Responsive to the output current falling below a wire break detection threshold, a second mode of operation called a wire break mode is enabled. In the wire break mode, a controller disables part of the circuitry in the high-side switch and enables additional circuitry in the high-side switch to accurately measure the lower output current range to determine whether a wire break has occurred. In the wire break mode, a gate of the power FET is connected to a drain of the power FET to create a diode-connected power FET. Also, a p-channel metal oxide semiconductor (PMOS) power stage with a PMOS sense FET is turned on and coupled to the load (or a load terminal) and to the sense amplifier. The transistors in the PMOS power stage are smaller than the power FET and are capable of accurately sensing smaller output currents. The PMOS power stage provides a sense current, based on the output current, to the sense amplifier. A comparator determines whether this sense current is below a wire break threshold. Responsive to the sense current falling below the wire break threshold, a wire break fault is triggered.

In examples herein, the PMOS power stage improves current sense accuracy for wire break detection in parallel with the sense circuitry of the power FET. The existing sense amplifier of the high-side switch is useful for the wire break mode, so no additional amplifier is added to the circuit, which saves area. Multiple thresholds may be enabled for entering/exiting the wire break mode and for detecting a wire break. Also, by connecting the power FET in a diode-connected configuration during the wire break mode, the output voltage drop may be limited during a sudden output load current increase, which may otherwise be unsupported by the smaller PMOS power stage.

FIGS. 1A and 1B are circuit diagrams of a high-side switch with wire break detection in various examples herein. FIG. 1A shows a normal mode of operation for the high-side switch, while FIG. 1B shows a wire break mode of operation. Some circuitry may be enabled or disabled responsive to switching from the normal mode to the wire break mode and vice versa, as described herein.

FIG. 1A is a circuit diagram of a high-side switch 100 in the normal mode of operation in various examples herein. In the normal mode of operation, some wire break detection circuitry is disabled as described below. Also, in the normal mode of operation shown in FIG. 1A, a current sensing loop detects the output current with a sense current and controls the output current provided by the power FET. In this example, high-side switch 100 includes a main power stage 102. Main power stage 102 includes a power FET 104 and a sense FET 106 (e.g., a sense transistor). Power FET 104 and sense FET 106 are n-channel devices in this example, such as an n-channel metal oxide semiconductor (NMOS) transistor, but other types of transistors are useful in other examples. Power FET 104 and sense FET 106 have a size ratio of M:1 in one example. Power FET 104 includes a gate 108, a source 110, and a drain 112. The gate 108 is coupled to a charge pump 114. Charge pump 114 includes a pull-up current source 116 coupled to a charge pump voltage source V_CP 118. Charge pump 114 also includes a pull-down current source 120 coupled to gate 108 and source 110 of power FET 104. Drain 112 of power FET 104 is coupled to a supply voltage V_S at node 122, which may be a voltage supply terminal. In one example, V_S is approximately 13 V.

Sense FET 106 has a gate 124 coupled to gate 108 of power FET 104. Sense FET 106 has a drain 126 coupled to node 122 and a source 128 coupled to switch 130. Switch 130 couples sense FET 106 to sense amplifier 132. Sense amplifier has a first amplifier input 134, a second amplifier input 136, and an amplifier output 138. First amplifier input 134 is coupled to switch 130. Second amplifier input 136 is coupled to load 140 (or to a load terminal). Amplifier output 138 is coupled to transistor 142. Transistor 142 is coupled to resistor R3144, which is coupled to ground 146. Resistor R3 and transistor 142 are also coupled to current sense amplifier 148. Current sense amplifier 148 has a first current sense amplifier input 150 coupled to a voltage reference V_REF. Current sense amplifier 148 has a second current sense amplifier input 152 coupled to resistor R3144. Current sense amplifier 148 has a current sense amplifier output 154 coupled to charge pump 114.

High-side switch 100 also includes wire break detection circuitry that is disabled during the normal mode of operation. The wire break detection circuitry includes switch 160 and PMOS power stage 162 in this example. Switch 160 is configured to connect power FET 104 in a diode-connected configuration during the wire break mode. Switch 160 includes transistors 164 and 166, resistor R1168, and current source 170. Transistors 164 and 166 may be PMOS transistors in one example. Switch 160 is coupled between gate 108 of power FET 104 and drain 112 of power FET 104. As described below, switch 160 connects power FET 104 in a diode-connected configuration during a wire break detection mode.

PMOS power stage 162 includes a PMOS power FET 172, a PMOS sense FET 174, resistor R2176, and current source 178. PMOS power FET 172 and PMOS sense FET 174 have a size ratio of N:1 in one example. PMOS power FET 172 is coupled to a supply voltage V_S at node 180 and to load 140 responsive to PMOS power stage 162 being enabled. PMOS power stage 162 is coupled to sense amplifier 132 via switch 130 during the wire break detection mode, which is described below with respect to FIG. 1B. In this example, PMOS power stage 162 includes PMOS transistors, but this power stage may have other types of transistors in other examples.

FIG. 1A also includes an output current I_OUT 182 and a sense current I_SNS 184. FIG. 1A also includes a controller 186. Controller 186 controls some of the operations of high-side switch 100. For example, controller 186 is a digital controller that controls switches that allow high-side switch 100 to switch from normal operation mode to wire break detection mode, and vice versa. During normal operation mode, switch 130 connects sense FET 106 to sense amplifier 132. During wire break detection mode, controller 186 switches switch 130 to connect PMOS power stage 162 to sense amplifier 132. During wire break detection mode, controller 186 also disables charge pump 114 and connects switch 160 to power FET 104. The operations of wire break detection mode are described below with respect to FIG. 1B.

Referring again to FIG. 1A, in the normal operation mode switch 160 and PMOS power stage 162 are disabled. Power FET 104 provides an output current I_OUT 182 to drive load 140, and produce an output voltage V_OUT at load 140. Sense FET 106 senses the current provided by power FET 104 with an M:1 ratio, and mirrors the output current I_OUT 182 to provide the sense current I_SNS 184. Sense current I_SNS 184 travels through resistor R3144, which creates a voltage V_SNS that is then provided to second current sense amplifier input 152. Current sense amplifier 148 and transistor 142 provide a current loop that receives sense current I_SNS 184. The output of current sense amplifier 148 at current sense amplifier output 154 controls the pull-up current source 116 and pull-down current source 120 in charge pump 114. Charge pump 114 in turn controls the amount of output current I_OUT 182 provided by power FET 104 to load 140. Therefore, the sense FET 106 provides the sense current I_SNS 184 to the current loop to control the operation of power FET 104 during the normal operation mode, as shown in FIG. 1A.

The normal operation mode may accurately sense current from several hundred milliamps to as high as 40 Amps, which is a 40× to 100× or more range of current detection. However, the sense circuitry that is enabled during the normal operation mode may be unable to accurately sense the output current if the output current is in the range of 300 microamps to a few milliamps, which may be the current range during a wire break condition. Detecting current from 300 microamps all the way to 40 Amps is a range of more than 100,000×, which is difficult to detect with a single current sensing loop.

In examples herein, for wire break detection, a separate current sensing loop is useful for detecting the smaller range of output current. The separate current sensing loop includes activating switch 160 and activating PMOS power stage 162 via switch 130 during a wire break detection mode. The wire break detection mode is described below with respect to FIG. 1B.

FIG. 1B is a circuit diagram of a high-side switch 100 in the wire break detection mode in various examples herein. The components shown in FIG. 1B are similar to the components shown in FIG. 1A, and like numerals denote like components. In the wire break detection mode, charge pump 114 is disabled, and sense FET 106 is disconnected from sense amplifier 132 by switch 130. Also, in wire break detection mode, switch 160 is activated, which places power FET 104 in a diode-connected configuration. PMOS power stage 162 is activated in wire break detection mode. In this mode, PMOS power stage 162 therefore provides the output current I_OUT 182 to load 140 and provides the sense current I_SNS 184 to sense amplifier 132. In FIG. 1B, power FET 104 may also provide an auxiliary current 188 to load 140 in some circumstances, as described below.

In operation, during the wire break detection mode, power FET 104 is configured into a diode connected configuration via switch 160. Responsive to entering wire break detection mode, controller 186 enables switch 160, and switch 160 couples gate 108 to drain 112 of power FET 104. Charge pump 114 is disconnected from power FET 104 and/or disabled. Responsive to entering wire break detection mode, sense FET 106 is disabled by switching switch 130. Responsive to entering wire break detection mode, PMOS power stage 162 is enabled and switch 130 connects PMOS power stage 162 to sense amplifier 132. Enabling PMOS power stage 162 couples PMOS power FET 172 to load 140 and to second amplifier input 136. Responsive to entering wire break detection mode, current sense amplifier output 154 is disconnected from charge pump 114. The coupling, decoupling, connecting, and disconnecting actions responsive to wire break detection mode may be controlled by controller 186 in some examples. Any type of circuitry is useful for connecting and disconnecting various circuit components responsive to switching operating modes as described herein, such as switches, transistors, etc.

Switch 160, after enabled, reconfigures power FET 104 as a diode connected FET. Connecting power FET 104 in a diode configuration allows power FET 104 to provide current to load 140 responsive to a large load current increase. In some examples, PMOS power stage 162 is smaller than main power stage 102. If a large load current increase occurs, the voltage V_OUT at load 140 may not be able to be maintained by PMOS power stage 162 alone. As one example, the impedance across PMOS power FET 172 may be 25 to 50 Ohms, while the impedance across power FET 104 may be 10-100 milliohms. For a 100 milliamp load current, PMOS power FET 172 may create a 2.5 to 5 V voltage drop at load 140. However, it is useful to keep the voltage V_OUT at load 140 near the supply voltage V_S of 13 V during operation in some examples. The voltage at V_OUT may be maintained with the diode configured power FET 104.

In this example, the power FET 104 is a large FET and is configured as a diode. If V_OUT drops more than the threshold voltage V_Threshold of the diode configured power FET 104 (about 1 V in one example), power FET 104 will turn on. Power FET 104 turns on because the voltage at gate 108 is V_S (e.g., about 13 V), and the voltage at source 110 has dropped by about 1 V or more in this example, which is the threshold voltage for turning on power FET 104. For example, if V_S−V_OUT>V_Threshold, then power FET 104 turns on. Power FET 104 provides additional current to load 140 if it is turned on, above the current that PMOS power stage 162 can provide to the load. The additional current provided by power FET 104 is shown as auxiliary current 188 in FIG. 1B. The power FET 104 in the diode configuration therefore limits the voltage drop at V_OUT during sudden load current changes in this example by providing additional auxiliary current 188. If V_OUT remains near V_S, then the gate-to-source voltage of power FET 104 remains below V_Threshold, and power FET 104 remains off in the wire break detection mode.

In the wire break detection mode, sense FET 106 is disconnected via switch 130. Therefore, PMOS power stage 162 provides current sensing via PMOS sense FET 174. The ratio of PMOS power FET 172 and PMOS sense FET 174 is N:1, which may be on the order of 10:1 in one example. Because PMOS power FET 172 and PMOS sense FET 174 are smaller than power FET 104, they can sense currents several magnitudes smaller than the normal current sensing loop in FIG. 1A. In one example, wire break detection requires current sensing from about 300 microamps to a few milliamps. The normal current sensing loop may not be this sensitive, but the PMOS power stage 162 can sense currents this small.

In the wire break detection mode, PMOS sense FET 174 mirrors the output current I_OUT 182 at a ratio of N:1 and provides sense current I_SNS 184. Sense current I_SNS 184 passes through resistor R3144, and produces a voltage V_SNS The voltage V_SNS is provided to a comparator 190. Comparator 190 includes a first comparator input 192, a second comparator input 194, and a comparator output 196. Comparator output 196 is coupled to a wire break fault node WB_fault 198. The V_SNS voltage is provided to second comparator input 194. A wire break reference voltage V_WB is provided to first comparator input 192. If the V_SNS voltage is less than the V_WB voltage, a wire break fault is reported at WB_fault 198. Therefore, as shown in FIG. 1B, wire break faults can be determined in the wire break detection mode during low output current situations, while still maintaining output voltage V_OUT responsive to changes in the output current.

FIGS. 2A and 2B are collection of graphs showing wire break mode and detection in various examples herein. In FIG. 2A, graph 200 shows one example of output current versus time, and includes the status of a wire break detection mode and of a wire break fault. In FIG. 2B, graph 250 shows another example of output current versus time, where the output current is noisy and may cause glitching issues.

Referring again to FIG. 2A, graph 200 shows I_OUT as waveform 202. Graph 200 shows two thresholds for I_OUT: on wire break detection (ON_WB_DET) threshold 204 and wire break fault (WB_fault) threshold 206. If waveform 202 falls below ON_WB_DET 204, wire break detection mode turns on. Waveform 208 shows the status of wire break detection mode. If waveform 208 is low, wire break detection mode is off (e.g., high-side switch 100 is in normal operation mode). If waveform 208 is high, wire break detection mode is on. As shown in graph 200, waveform 202 (I_OUT) falls below ON_WB_DET 204 at time t₁. Responsive to waveform 202 falling below ON_WB_DET 204, waveform 208 goes from low to high. Therefore, at time t₁, high-side switch 100 enters wire break detection mode. In this example, high-side switch 100 remains in wire break detection mode until waveform 202 rises above ON_WB_DET 204. Waveform 202 rises above ON_WB_DET 204 at time t₄. Therefore, at time t₄, waveform 208 goes from high to low, and high-side switch 100 exits wire break detection mode.

As described above, high-side switch 100 enters and exits wire break detection mode based on the value of I_OUT. FIG. 1B shows the circuitry that is enabled and disabled during wire break detection mode. Controller 186 or other digital circuity may enable and disable certain circuit components during wire break detection mode. Also, controller 186 may monitor I_OUT to determine whether to enter wire break detection mode, such as time t₁ in graph 200.

If high-side switch 100 is in wire break detection mode, a wire break fault is not detected until I_OUT falls below the wire break fault threshold. The threshold for wire break fault 206 is shown in graph 200. The threshold for wire break fault threshold 206 is below the threshold for on wire break detection (ON_WB_DET) 204. Therefore, high-side switch 100 enters wire break detection mode if I_OUT falls below the threshold for wire break detection (ON_WB_DET) 204. While in wire break detection mode, a wire break fault is detected if I_OUT falls below wire break fault threshold 206. As shown in graph 200, I_OUT falls below wire break fault threshold 206 at time t₂. Therefore, at time t₂, a wire break is detected. Waveform 210 shows the wire break fault detection. At time t₂, wire break fault detection goes from low to high, and a wire break fault is indicated. The wire break fault indication continues until waveform 202 goes above wire break fault threshold 206. At time t₃, I_OUT goes above wire break fault threshold 206. Therefore, at time t₃, the wire break fault indicator goes from high to low.

FIG. 2A shows that a high-side switch 100 may enter a wire break detection mode based on a value of I_OUT falling below a first threshold. If the value of I_OUT falls below a second threshold, a wire break is indicated. The second threshold is below the first threshold. In one example, the first threshold may be approximately 4 mA. The second threshold may be 300 microamps to 2 mA in one example. The first threshold allows high-side switch 100 to operate in normal mode as long as I_OUT remains above the first threshold. If I_OUT falls below the first threshold, high-side switch 100 enters wire break detection mode and monitors I_OUT for a wire break at the second threshold.

FIG. 2B shows a graph 250 of output current versus time, where the output current is noisy and may cause glitching issues. Graph 250 shows I_OUT as waveform 252. Graph 250 shows two thresholds for I_OUT: on wire break detection (ON_WB_DET) threshold 254 and wire break fault (WB_fault) threshold 256. These two thresholds operate as described above with respect to FIG. 2A.

Graph 250 also shows waveform 258, which is the status of wire break detection mode. Waveform 260 is the status of the wire break fault WB_fault. Waveform 252 shows that at time t₁, high-side switch 100 enters wire break detection mode (e.g., waveform 258 goes high), because I_OUT falls below (ON_WB_DET) threshold 254. At time t₂, high-side switch 100 exits wire break detection mode (e.g., waveform 258 goes low). At time t₃, high-side switch 100 again enters wire break detection mode (e.g., waveform 258 goes high).

Because high-side switch 100 jumps in and out of wire break detection mode in this manner, waveform 258 is glitchy in area 262 of graph 250, shown as waveform 258 jumping between on and off states. Similarly, at time t₄, high-side switch 100 detects a wire break fault because waveform 252 (e.g., I_OUT) falls below threshold 256. Waveform 260 goes high at time t₄ to indicate a wire break. At time t₅, waveform 252 rises above threshold 256, and the wire break fault is released (e.g., waveform 260 goes low). At time t₆, high-side switch 100 again detects a wire break fault because waveform 252 falls below threshold 256. Then, at time t₇, waveform 252 rises above threshold 256, and the wire break fault is released (e.g., waveform 260 goes low) again. Waveform 260 is therefore also glitchy in area 264 because waveform 252 crosses threshold 256 repeatedly in a short period of time.

Deglitching may be performed to remove the glitches at areas 262 and 264. Any suitable deglitching processes are useful. For example, hysteresis may be added to the system to prevent high-side switch 100 from jumping in and out of wire break detection mode quickly, and to prevent wire break faults from turning on and off as shown in graph 250. In another example, digital control circuitry could be implemented that performs deglitching, such as a digital state machine.

FIG. 3 is a block diagram of a high-side switch 300 in various examples herein. The components in high-side switch 300 are described above with respect to FIGS. 1A and 1B, and like numerals denote like components. High-side switch 300 shows the major components of a high-side switch, including a load 140. The components shown in high-side switch 300 may be implemented with any suitable digital or analog circuitry. FIGS. 1A and 1B show example circuity for these components, but other circuitry is useful in other examples. For example, switch 160 is a PMOS switch in FIGS. 1A and 1B, but any circuitry constituting a switch is useful in other examples. As another example, main power stage 102 includes an NMOS power FET in FIGS. 1A and 1B, but other circuitry is useful for creating main power stage 102 in other examples. Controller 186 may be any type of digital controller, digital circuitry, microcontroller, processor, or other suitable component.

FIG. 4 is a block diagram of a system 400 with a high-side switch in various examples herein. System 400 includes an integrated circuit (“chip”) 401. System 400 is useful for automotive or industrial application in some examples. System 400 is one example system that may include wire break detection, but wire break circuitry as described herein may be included in other systems in other examples. In this example, chip 401 includes wire break detection 402, serial peripheral interface (SPI) 404, analog to digital converter 406, and multiplexer 408. Chip 401 also includes input supply and output voltage monitoring 410, charge pump 412, and light emitting diode (LED) module 414. Led module 414 may be coupled to LEDs 416, which may be located outside chip 401. Chip 401 also includes gate drive 418, output clamp 420, current sense 422, and temperature sense 424. System 400 includes a microcontroller (MCU) 426 in this example.

In one example, wire break detection 402 includes some of the circuitry described above with respect to FIGS. 1A and 1B. If wire break detection 402 detects a wire break, a fault signal is sent to MCU 426 via SPI 404. Voltage supply V_S may be 24 V in one example, and other voltages may be derived from the 24 V supply.

FIG. 5 is a flow diagram of a method 500 for low power mode output current detection in a high-side switch in various examples herein. The steps of method 500 may be performed in any suitable order. The hardware components described above with respect to FIGS. 1A, 1B, 3 or 4 may perform method 500 in some examples.

Method 500 begins at 510, where a first power stage, such as main power stage 102, provides a first current to a load (or to a load terminal) in a first mode of operation, where the first power stage includes a first power FET (such as power FET 104) and a first sense transistor (such as sense FET 106).

Method 500 continues at 520, where the method switches to a second mode of operation. In some examples, the method 500 switches to a second mode of operation responsive to an output current I_OUT 182 falling below a first threshold. Falling below the first threshold may indicate that the output current I_OUT 182 is near a wire break detection threshold, so the system switches to the wire break detection mode.

Method 500 continues at 530, where, responsive to switching to the second mode of operation, a second power stage (such as PMOS power stage 162) provides a second current to the load (or to the load terminal). The second power stage includes a second power FET (such as PMOS power FET 172) and a second sense transistor (such as PMOS sense FET 174). In other examples, transistors other than PMOS transistors are useful in the second power stage.

Method 500 continues at 540, where, responsive to switching to the second mode of operation, the first power FET (e.g., power FET 104) is connected in a diode configuration. In one example, switch 160 is activated to connect power FET 104 in the diode configuration. In other examples, a different type of switch or connection is useful.

Method 500 continues at 550, where, responsive to switching to the second mode operation, the second sense transistor is coupled to a sense amplifier. In one example, switch 130 switches to couple the second sense transistor (e.g., PMOS sense FET 174) to the sense amplifier 132. In the second mode of operation, PMOS sense FET 174 provides a sense current for determining wire break detection.

FIG. 6 is a circuit diagram of a low-power-mode (LPM) channel driver 600 in various examples herein. Some components shown in FIG. 6 are similar to the components shown in FIGS. 1A and 1B, and like numerals denote like components. Channel driver 600 also includes a transistor 602, resistor R2604, first bias current source 606, second bias current source 608, and comparator 610. Comparator 610 may be a low-input offset and low quiescent current (I_Q) voltage comparator in one example. Comparator 610 includes a first comparator input 612, a second comparator input 614, and a comparator output 616. Comparator output 616 may provide a signal to digital circuitry or a controller (not shown in FIG. 6) responsive to a condition being met in channel driver 600. FIG. 6 also includes auxiliary output current 618, which may provide auxiliary power to a load in one example.

Channel driver 600 may have a diode connected power FET 104 as a voltage clamp in one example. In this example, switch 160 is activated to place power FET 104 in a diode connected configuration by coupling the gate 108 of power FET 104 to the drain 112 of power FET 104. In the diode connected configuration, charge pump 114 is disconnected from gate 108 of power FET 104. In this configuration, shown in FIG. 6, channel driver 600 is operating in a low-power-mode, where transistor 602 is on and provides output current I_OUT 182 to load 140. Transistor 602 may be a p-channel FET (PFET) in this example. In some examples, transistor 602 may be turned on with an I_Q of less than 50 microamps. First bias current source 606 and second bias current source 608 may be provide current as small as a few hundreds nanoamps in an example. Therefore, in this configuration, channel driving I_Q may be as small as a few microamps per channel.

Comparator 610 has a first comparator input 612 coupled to voltage source VS 122 and a second comparator input 614 coupled to load 140. Comparator 610 is configured to detect any load condition changes by performing a comparison and providing an LPM exit control signal at comparator output 616 based on the comparison. If the voltage V_OUT at load 140 drops below the voltage provided by voltage source V_S 122 by a predetermined threshold, comparator 610 provides the LPM exit control signal at comparator output 616. The LPM exit control signal may be provided to digital circuitry or a controller in an example. Responsive to the LPM exit control signal, channel driver 600 exits the LPM. To exit the LPM, a controller causes switch 160 to disconnect power FET 104 from the diode-connected configuration, and causes charge pump 114 to resume providing a voltage to gate 108 of power FET 104. Charge pump 114 provides the voltage to gate 108 to turn on and drive power FET 104 for operation in a normal mode (e.g., a non-low-power-mode). The detection threshold may be determined, in one example, based on the size of transistor 602 and the maximum output current I_OUT 182 supported in the LPM. As one example, the voltage threshold of comparator 610 may be a maximum direct current (DC) value of output current I_OUT 182 multiplied by the resistance of transistor 602 if transistor 602 is on.

In examples herein, the PMOS power stage 162 improves current sense accuracy for wire break detection in parallel with the sense circuitry of the power FET 104. The existing sense amplifier 132 of the high-side switch is useful for the wire break mode, so no additional amplifier is added to the circuit, which saves area. Multiple thresholds may be enabled for entering/exiting the wire break mode and for detecting a wire break, as described above with respect to FIGS. 2A and 2B. Also, by connecting the power FET 104 in a diode-connected configuration during the wire break mode, the output voltage V_OUT drop may be limited during a sudden output load current increase, which may otherwise be unsupported by the smaller PMOS power stage 162.

In other examples, a low-power-mode channel driver is provided. A comparator 610 may place the channel driver in either the LPM or a normal operating mode by providing a signal to a controller or digital circuitry. If output voltage V_OUT drops below an acceptable threshold, comparator 610 may provide a signal to exit the LPM and resume operating in a normal mode. The LPM may reduce channel driving I_Q to as small as a few microamps per channel in some examples.

In this description, the term “couple” may cover connections, communications or signal paths that enable a functional relationship consistent with this description. For example, if device A provides a signal to control device B to perform an action, then: (a) in a first example, device A is directly connected to device B; or (b) in a second example, device A is coupled to device B through intervening component C if intervening component C does not alter the functional relationship between device A and device B, so device B is controlled by device A via the control signal provided by device A.

A device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or reconfigurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof.

A circuit or device that is described herein as including certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors, and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, for example, by an end-user and/or a third-party.

While certain components may be described herein as being of a particular process technology, these components may be exchanged for components of other process technologies. Circuits described herein are reconfigurable to include the replaced components to provide functionality at least partially similar to functionality available prior to the component replacement. Components shown as resistors, unless otherwise stated, are generally representative of any one or more elements coupled in series and/or parallel to provide an amount of impedance represented by the shown resistor. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in parallel between the same nodes. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in series between the same two nodes as the single resistor or capacitor.

Uses of the phrase “ground” in the foregoing description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. In this description, unless otherwise stated, “about,” “approximately” or “substantially” preceding a parameter means being within +/−10 percent of that parameter. Modifications are possible in the described examples, and other examples are possible within the scope of the claims.

Claims

1. A system, comprising: a first power stage including a first power field effect transistor (FET) and a first sense transistor coupled to the first power FET;a second power stage including a second power FET and a second sense transistor coupled to the second power FET, wherein the second power stage is smaller than the first power stage;a first switch coupled to a gate and a drain of the first power FET;a second switch coupled to the first power stage and the second power stage; anda sense amplifier coupled to the second switch, wherein the first power stage, the second power stage, and the sense amplifier are coupled to a load terminal.

2. The system of claim 1, wherein the first power stage is a power stage of a high-side switch.

3. The system of claim 1, further comprising: a charge pump coupled to the gate of the first power FET.

4. The system of claim 1, wherein the first sense transistor is coupled to a first input of the sense amplifier during a first mode of operation.

5. The system of claim 1, wherein the second sense transistor is coupled to a first input of the sense amplifier during a second mode of operation.

6. A system, comprising: a first power stage including a first power field effect transistor (FET) and a first sense transistor coupled to the first power FET, wherein the first power stage is configured to provide a first current to a load terminal;a second power stage including a second power FET and a second sense transistor coupled to the second power FET, wherein the second power stage is smaller than the first power stage, and wherein the second power stage is configured to provide a second current to the load terminal;a first switch coupled to a gate and a drain of the first power FET, wherein the first switch is configured to connect the gate to the drain of the first power FET; anda second switch coupled to the first power stage and the second power stage, wherein the second switch is configured to connect the first power stage or the second power stage to a sense amplifier.

7. The system of claim 6, further comprising: a charge pump coupled to the gate of the first power FET and configured to bias the first power FET.

8. The system of claim 6, wherein the first switch is configured to disconnect the gate from the drain of the first power FET during a first mode of operation, and the second switch is configured to connect the first power stage to the sense amplifier during the first mode of operation.

9. The system of claim 6, wherein the first switch is configured to connect the gate to the drain of the first power FET during a wire break mode of operation, and wherein the second switch is configured to connect the second power stage to the sense amplifier during the wire break mode of operation.

10. The system of claim 9, wherein a charge pump is coupled to the gate of the first power FET, and entering the wire break mode of operation disables the charge pump.

11. The system of claim 6, wherein, responsive to a sense current provided to the sense amplifier falling below a threshold, the first switch and the second switch are configured to change states.

12. The system of claim 11, wherein the first sense transistor is configured to provide the sense current to the sense amplifier.

13. The system of claim 11, wherein the threshold is a first threshold, the sense current is a first sense current, and responsive to a second sense current falling below a second threshold, a controller is configured to generate a wire break fault.

14. The system of claim 13, wherein the second threshold is lower than the first threshold.

15. The system of claim 13, wherein the second sense transistor is configured to provide the second sense current to the sense amplifier.

16. A method, comprising: providing a first current to a load with a first power stage in a first mode of operation, wherein the first power stage includes a first power field effect transistor (FET) and a first sense transistor;switching to a second mode of operation; andresponsive to switching to the second mode of operation: providing a second current to the load with a second power stage, wherein the second power stage includes a second power FET and a second sense transistor;connecting the first power FET in a diode connected configuration; andcoupling the second sense transistor to a sense amplifier.

17. The method of claim 16, wherein switching to the second mode of operation includes switching to the second mode of operation responsive to the first current crossing a first threshold.

18. The method of claim 17, further comprising a controller generating a wire break fault responsive to the second current falling below a second threshold.

19. The method of claim 16, further comprising the first power FET providing an auxiliary current to the load in the second mode of operation.

20. The method of claim 16, wherein the first sense transistor is configured to couple to the sense amplifier during the first mode of operation.

21. A system, comprising: a first transistor configured to provide a first current to a load terminal in a first mode of operation;a second transistor configured to provide a second current to the load terminal in a second mode of operation;a switch coupled to a gate and a drain of the first transistor and configured to place the first transistor in a diode-connected configuration during the second mode of operation; anda comparator having a comparator output, a first comparator input, and a second comparator input, wherein: the first comparator input is coupled to a voltage supply terminal;the second comparator input is coupled to the load terminal; andthe comparator is configured to provide a signal to exit the second mode of operation based on a comparison between a supply voltage and a voltage at the load terminal.

22. The system of claim 21, wherein exiting the second mode of operation includes: disconnecting the first transistor from the diode-connected configuration;coupling a charge pump to the gate of the first transistor; andproviding the first current to the load terminal.

23. The system of claim 21, wherein the comparator is configured to, responsive to the voltage at the load terminal falling below a predetermined threshold, exit the second mode of operation.

24. The system of claim 21, wherein the second mode of operation is a low power mode of operation.

25. The system of claim 21, wherein the first transistor is configured to provide an auxiliary current to the load terminal during the second mode of operation.