Number | Name | Date | Kind |
---|---|---|---|
1239965 | Reinhold | Sep 1917 | A |
1326859 | Grammar | Dec 1919 | A |
1853829 | Maury | Apr 1932 | A |
2114130 | Brate | Apr 1938 | A |
2179172 | Bonnaire | Nov 1939 | A |
2751222 | Dexter | Jun 1956 | A |
2862624 | Stokes | Dec 1958 | A |
3760520 | Hamilton | Sep 1973 | A |
3773314 | Giovannini | Nov 1973 | A |
3920267 | Lyon, Jr. | Nov 1975 | A |
4010299 | Hershey, Jr. et al. | Mar 1977 | A |
4097067 | Schechter | Jun 1978 | A |
4229926 | Rowling | Oct 1980 | A |
4270742 | Kobayashi | Jun 1981 | A |
RE30958 | White | Jun 1982 | E |
4583763 | Shacklett, Jr. | Apr 1986 | A |
4606553 | Nickerson | Aug 1986 | A |
4616815 | Vijuk | Oct 1986 | A |
4621837 | Mack | Nov 1986 | A |
4637633 | Instance | Jan 1987 | A |
4660856 | Shacklett, Jr. | Apr 1987 | A |
4812195 | Vijuk | Mar 1989 | A |
4817931 | Vijuk | Apr 1989 | A |
4850611 | Skelton | Jul 1989 | A |
4887373 | Macaulay | Dec 1989 | A |
4905977 | Vijuk | Mar 1990 | A |
4906024 | Lein | Mar 1990 | A |
4991878 | Cowan et al. | Feb 1991 | A |
4997205 | Hansch | Mar 1991 | A |
5044873 | Vijuk | Sep 1991 | A |
5046710 | Vijuk | Sep 1991 | A |
5074595 | Hill et al. | Dec 1991 | A |
5156898 | McDonald | Oct 1992 | A |
5234231 | Hollander et al. | Aug 1993 | A |
5351991 | McDonald | Oct 1994 | A |
5403636 | Crum | Apr 1995 | A |
5439721 | Pedroli et al. | Aug 1995 | A |
5458374 | Vijuk et al. | Oct 1995 | A |
5605730 | Treleaven | Feb 1997 | A |
5667210 | DeLise, Jr. | Sep 1997 | A |
5685530 | DeLise | Nov 1997 | A |
5813700 | Vijuk et al. | Sep 1998 | A |
5909899 | Vijuk et al. | Jun 1999 | A |
6068300 | Vijuk et al. | May 2000 | A |
6095512 | Vijuk et al. | Aug 2000 | A |
6158778 | Vijuk et al. | Dec 2000 | A |
6290796 | Furst et al. | Sep 2001 | B2 |
Number | Date | Country |
---|---|---|
10939 | Sep 1880 | DE |
744196 | Apr 1933 | FR |
1403865 | May 1965 | FR |
28013 | Dec 1907 | GB |
20385 | Oct 1914 | GB |
Entry |
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Brochure of HHS Gluing Systems entitled “Glue Scan Integrated Glue Monitoring” (prior art). |
Information described in “Background of the Invention” section of the above patent application. |