Not applicable.
Not applicable.
Not applicable.
INCORPORATION-BY-REFERENCE OF MATERIALS SUBMITTED ON A COMPACT DISC
Not applicable.
1. Field of the Invention
The present application relates to an over-current protection device, and more particularly to an over-current protection device having positive temperature coefficient (PTC) characteristic. The novel over-current protection device is configured to replace a traditional circuit breaker.
2. Description of Related Art Including Information Disclosed Under 37 CFR 197 and 137 CFR 1.98
In recent years, super-thin portable electronic apparatuses have been increasingly developed, resulting in the demand of lightweight, thin and large capacity batteries. To meet the demand of high voltage and large capacity, a battery may use a large capacity cell or a plurality of cells in parallel and/or series connection. In over-current and over-heat protection to batteries, circuit breakers in response to temperature are usually employed nowadays.
An over-current breaker usually uses bi-metal plates, and the bi-metal plates constitute a normally closed micro-switch. When the breaker has current flowing therein, the bi-metal plates are heated and bent and the bi-metal plates bent more intensively as current increases. If over-current occurs, extremely large current induces over-bending of the bi-metal plates, the micro-switch changes to and sustain in an open state to sever the current. As a result, the breaker prevents the circuit from damage which may be caused by over-current. When the over-current or over-temperature event has gone, the bi-metal plates cool down and return to be of original shapes to rebuild a conductive path.
Although the bi-metal design has been widely used in breakers, the bi-metal plates have to be made by precision machinery and need precision manufacturing techniques. As a result, the bi-metal breakers are usually costly. Therefore, it is highly demanded to generate a breaker with high reliability and stability for safety, and consider how to simplify manufacturing process and obtain low cost.
The present application provides an over-current protection device having PTC characteristic, which is able to be connected to a circuit to be protected by spot-welding directly and to replace a traditional bi-metal breaker. Because precision punching is not needed in the manufacturing process, the manufacturing cost of the over-current protection device can decrease effectively.
In accordance with an aspect of the present application, an over-current protection device in place of a bi-metal breaker is devised. The over-current protection device is a strip-like structure containing an upper surface, a lower surface and four lateral planar surfaces, and comprises a PTC device, a first electrode, a second electrode, a first welding metal plate and a second welding, metal plate. The PTC device comprises a first conductive layer, a second conductive layer and a PTC polymeric material layer laminated therebetween The first electrode electrically connects to the first conductive layer. The second electrode electrically connects to the second conductive layer and is separated from the first electrode. The first welding metal plate is formed on an upper surface of the device and connects to the first electrode. The second welding, metal plate is formed on the upper surface or a lower surface of the device and connects to the second electrode. The first and second welding, metal plates are placed at two opposite ends of the strip-like structure, and each of the first and second welding metal plates has a thickness sufficient to withstand spot-welding without significant resultant damage to the PTC device.
In an embodiment, the over-current protection device further comprises a first insulating layer disposed on the first conductive layer and a second insulating layer disposed on the second conductive layer.
In an embodiment, the first electrode comprises two first electrode layers respectively disposed on the first insulating layer and the second insulating layer, whereas the second electrode comprises two second electrode layers respectively disposed on the first insulating layer and the second insulating layer.
In an embodiment, the over-current protection device further comprises a first conductive connecting member and a second conductive connecting member. The first conductive connecting member electrically connects the first electrode and the first conductive layer, and the second conductive connecting member electrically connects the second electrode and the second conductive layer.
In accordance with another aspect of the present application, an over-current protection device comprises a substrate, a resistive device, a first welding, metal plate and a second welding metal plate. The resistive device is disposed on the substrate and comprises a PTC device, a first electrode and a second electrode. The PTC device comprises a first conductive layer, a second conductive layer and a PTC polymeric, material layer laminated therebetween. The first electrode electrically connects to the first conductive layer. The second electrode electrically connects to the second conductive layer and is separated from the first electrode. The first welding metal plate is formed at an end on a surface of the substrate and electrically connects to the first electrode. The second welding metal plate is formed at another end on the surface of the substrate and electrically connects to the second electrode. Each of the first and second welding metal plate has a thickness sufficient to withstand spot-welding without significant resultant damage to the PTC device.
In an embodiment, the substrate comprises first, second, third and fourth bonding pads. The first bonding pad is configured to connect to the first welding metal plate, whereas the second bonding pad is configured to connect to the second welding metal plate. The third bonding pad is disposed on the lower surface of the resistive device and configured to connect to the first electrode, whereas the fourth bonding pad is disposed on the lower surface of the resistive device and configured to connect to the second electrode. The first and third bonding pads are electrically connected, and the second and fourth bonding pads are electrically connected.
The over-current protection device of the present application can replace a traditional bi-metal breaker and can be subjected to spot-welding without significant damage. The making of the over-current protection device needs not punching process by precision machine, thereby increasing production yield and efficiency, and it is cost-ellective because sophisticated metal punch heads are not needed.
The present application will be described according to the appended drawings in which:
The making and using of the presently preferred illustrative embodiments are discussed in detail below. It should be appreciated, however, that the present application provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific illustrative embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.
The PTC polymeric material layer 12 comprises crystalline polymer and conductive filler and exhibits PTC behavior. The crystalline polymer comprises polyethylene, polypropylene, polyvinyl fluoride, mixture or copolymer thereof. The conductive filler may comprise metal tiller, carbon-containing filler, metal oxide filler, metal carbide filler, or mixture, solid solution, or core-shell thereof.
More specifically, the upper surface and lower surface of the PTC polymeric material layer 12 are provided with the first conductive layer 13 and the second conductive layer 14. The first conductive layer 13 and the second conductive layer 14 extend to two opposite ends of the polymeric material layer 12, respectively. The conductive layers 13 and 14 can be made from a planar metal plate in which notches at the two ends of the strip-like structure are formed by laser trimming, chemical etching or mechanical machining. The conductive layers 13 and 14 can be made of nickel, copper, zinc, silver, gold, the alloy thereof or a multilayer containing the above materials. In addition, the notches may be of rectangular, semi-circular, triangular or irregular shape or figure. The insulating layers 15, 16, the PTC device 11, an upper metal foil and a lower metal foil are hot-pressed, and then the metal foils are etched to form a first electrode 17 and a second electrode 18. In other words, the insulating layer 15 is formed on the first conductive layer 13, and the insulating layer 16 is formed on the second conductive layer 14. In this embodiment, the first electrode 17 comprises a pair of electrode layers disposed on the insulating layers 15 and 16 and the second electrode 18 comprises a pair of electrode layers disposed on the insulating layers 15 and 16 as well.
The insulating layers 15 and 16 may use epoxy resin containing fiber glass such as prepreg (FR-4). The insulating layers 15 and 16 can protect the polymeric material in the PTC polymeric material layer 12 when the over-current protection device 10 undergoes spot-welding. In an embodiment, the insulting layers 15 and 16 may further comprise heat conductive filler, such as zirconium nitride, boron nitride, aluminum nitride, silicon nitride, aluminum oxide, magnesium oxide, zinc oxide or titanium oxide. The insulating layer 15 or 16 may have a thickness up to 0.2 mm, or may be 0.1 or 0.06 mm in consideration of the insulating and strength requirements, the thickness of the insulating layer 15 or 16 has to be equal to or greater than 0.03 mm.
The electrode 17 or 18 may be a foil comprising nickel, copper, aluminum, lead, tin, silver, gold or alloy thereof, or a nickel-plated copper foil, tin-plated copper foil or tin-plated stainless steel.
In this embodiment the pair of electrode layers of the first electrode 17 on the insulating layers 15 and 16 are connected through a first conductive connecting member 19, and the pair of electrode layers of the second electrode 18 on the insulating layers 15 and 16 are connected through a second conductive connecting member 20. More specifically, the first conductive connecting member 19 extends along a second direction (vertical direction) perpendicular to the first direction to electrically connect the first electrode 17 and the first conductive layer 13, and the first conductive connecting member 19 is separated from the second conductive layer 14. The second conductive connecting member 20 extends along the second direction to electrically connect the second electrode 18 and the second conductive layer 14, and the second conductive connecting member 20 is separated from the first conductive layer 13. The first conductive connecting member 19 is disposed on a lateral surface at an end of the device 10, and the second conductive connecting member 20 is disposed on a lateral surface at another end. The insulating layers 15 and 16 are disposed between the first electrode 17 and the second electrode 18, and also disposed between the electrodes 17, 18 and conductive layers 13, 14 for insulation.
The conductive connecting members 19 and 20 of semi-circular conductive through holes are exemplified herein. The sidewall of the semi-circular hole may be plated with a conductive metal layer such as copper or gold by electroless plating or electroplating. In addition to semi-circular shape, the cross section of the hole may be of circular shape, quadrantal shape, arc shape, square shape, diamond shape, rectangular shape, triangular shape or polygon shape. Moreover, the upper and lower parts of each of the electrodes 17 and 18 may be connected through full lateral surfaces plated with conductive films. In an embodiment, the first electrode 7 is separated from the second electrode IS by gaps on which insulative solder masks 21 may be formed thereon. In this embodiment, the solder masks 21 are of rectangular shapes; nevertheless others like semicircular, arc, triangular, or irregular shapes and figures may be used also.
It may not be:needed:that the over-current protection device 10 contains four welding metal plates. For example, if the device 10 is welded by using the upper welding metal plates 31 and 32, the lower welding metal plates 33 and 34 can be omitted. Alternatively, the device 10 may be equipped with the welding metal plates 31 and 34, or welding metal plates 32 and 33 only to meet the requirements of various welding positions. Nevertheless, it s advantageous that the over-current protection device 10 in
The devices of the second embodiment (
Three compositions are tested. Composition I contains a PTC material having high melting temperature crystalline polymer and titanium carbide (TiC); Composition 2 contains a PTC material having low melting temperature crystalline polymer and tungsten carbide (WC); Composition 3 contains a PTC material having low melting temperature crystalline polymer and titanium carbide. The titanium carbide and tungsten carbide serving as conductive fillers are dispersed in the crystalline polymer. The high melting temperature crystalline polymer has a melting temperature in a range of 120-140° C., such as high density polyethylene (HDDPE) and polyvinylidene fluoride (PVDF). The low melting temperature crystalline polymer has a melting temperature in a range of 70-105° C., such as low density polyethylene (LDPE). In addition to the titanium carbide and tungsten carbide, other conductive ceramic having a resistivity less than 500 μΩ-cm, such as vanadium carbide (VC), zirconium carbide (ZrC:), niobium carbide (NbC), tantalum carbide (TaC), molybdenum carbide (MoC), hafnium carbide (HfC), titanium boride (TiB2), vanadium boride (VB2), zirconium bon de niobium boride (NrB2), molybdenurn boride (MoB2), hafnium boride (HfB2) biannual nitride (TiN) or zirconium nitride (ZrN) may be used.
Table 2 shows initial resistance (Ri) of the over-current protection device and the resistance (RI) measured one hour later after the device trips once and returns to room temperature. Ri and RI of all the Compositions and Designs are less than 8 mΩ, or less than 6 mΩ in particular. Designs 1, 2 and 3 are less than 4 mΩ. It is obvious that the over-current protection devices meet low-resistance requirement for breakers.
Table 3 shows the bold currents of the over-current protection devices at ambient temperatures of 23° C. and 60° C., i.e., the maximum current of the device without trip. It can be seen from Table 3 that the hold current of all the devices are equal to or larger than 3.6A. More specifically, the devices of Composition I and Composition 3 have hold currents equal to or larger than 4A, or 4.6A in particular regardless of 23° C. or 60° C.
Table 4 shows the thermal cut off (TCO) temperatures of the over-current protection devices undergoing 2 amperes and 4.6 amperes. That is, when the device heat up to the temperature, the current will be cut off. Generally, it is advantageous to have lower TCO temperature to ensure that the current can decrease instantly as temperature increases. Table 4 shows that the TCO temperatures are less than 120° C., and the TCO temperatures of Composition 2 and Design I are equal to or less than 90° C., or equal to or less than 80° C. in particular.
Table 5 shows time-to-trip data for the devices of various Compositions and Designs, in which 8 amperes is applied to the devices. The time-to-trip is preferably less than 60 seconds. The time-to-trip data for all the devices is less than 80 seconds to ensure the devices being able to activate timely.
It can be seen from Tables 2 to 5 that the device of the present application have low resistance (e.g., <8 mΩ), high hold current (e.g., >4A at 60° C.), low TCO temperature (e.g., ≦90° C. at 2A) and short time-to-trip (e.g., sec at <60 sec at 8A), those characteristics meet the criteria of breakers. Therefore, the over-current protection device is qualified and is able to replace the traditional breaker. Moreover, the over-current protection devices can be made by printed circuit board (PCB) process, so they are cost-effective in mass production.
In addition to the above embodiments, welding metal plates may be placed at different positions as desired. In
In addition to being disposed on the surfaces of the device, the welding metal plates may be alternatively disposed on a substrate as mentioned below.
In case of using FPC, the substrate 92 with heat dissipation function can increase hold current value of the device. Moreover, flexible FPC substrate provides flexibility for installation. The copper lines 925 and 926 of the substrate 92 can be easily made by printed circuit board (PCB) process. In contrast, the welding nickel plates need be made by molding. As a result, the use of FPC can enhance design convenience and decrease manufacturing cost.
The over-current protection device of the present application has the following advantages. (1) It can replace a traditional breaker, and is able to be subjected to spot-welding directly. (2) The manufacturing process is simple and the punch process by a precision machine is not need, and thus the production yield and efficiency can be increased. (3) Sophisticated metal punch head is not needed and therefore manufacturing cost can be decreased. (4) Welding plates such as nickel plates can be placed by not only manual disposal but also surface-mountable technology, so as to provide more efficient manufacturing. (5) The nickel plates are welded before shipping out, resistance variance caused by soldering process at customer sites can be minimized. (6) The shapes of the devices of the present application are equivalent or similar to current SMD products, all of the devices can be subjected to resistance sorting to obtain better quality control. (7) The devices can be packed in reels rather than in bulk. (8) Different from welding of axial-leaded devices, the peeling of the welding metal plates of the present application caused by extremely large torque can be avoided.
The above-described embodiments of the present invention are intended to be illustrative only. Numerous alternative embodiments may be devised by persons skilled in the art without departing from the scope of the following claims.
Number | Date | Country | Kind |
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102110139 | Mar 2013 | TW | national |