The present disclosure relates generally to electromagnetic interference/radio frequency interference (EMI/RFI) gaskets. More specifically, the present disclosure relates to an overlap helical conductive springs.
Electronic noise (EMI) and radio frequency interference (RFI) are the presence of undesirable electromagnetic energy in an electronic system. EMI can result from unintentional electromagnetic energy generate in and around the electronic system. For example, electrical wiring can generate electronic noise at about 60 Hz. Other sources of unintentional electromagnetic energy can include thermal noise, lightning, and static discharges. Additionally, EMI can result from intentional electromagnetic energy, such as radio signals used for radio and television broadcasts, wireless communication systems such as cellular phones, and wireless computer networks.
Elimination of EMI is important in the design of electronic systems. Placement of components within the system, as well as the use of shielding and filtering, make it possible to control and reduce the EMI that interferes with the function of the electronic system as well as the EMI produced by the electronic system that can interfere with other systems. The effectiveness of shielding and filtering is dependent on the methods by which the shielding materials are bonded together. Electrical discontinuities in the enclose, such as joints, seems, and gaps, all effect the frequency and the amount of EMI that can breach the shielding.
In an embodiment, a cross-diametric compression spring includes a conductive ribbon formed into an overlapping helical coil. The width of the conductive ribbon extends substantially parallel to the length of the overlapping helical coil. The thickness of the conductive ribbon is smaller than the width. Adjacent loops of the conductive ribbon overlap along the width of the conductive ribbon.
The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings.
The use of the same reference symbols in different drawings indicates similar or identical items.
In an embodiment, ribbon 102 can be a conductive ribbon. The conductive ribbon can be formed from a metal or a metal alloy. The metal alloy can be a stainless steel, a copper alloy such as beryllium copper and copper-chromium-zinc alloy, a nickel alloy such as hastelloy, Ni220, and Phynox, or the like. Additionally, the conductive ribbon can be plated with a plating metal, such as gold, tin, nickel, silver or any combination thereof. In an alternative embodiment, the conductive ribbon can be formed of a polymer coated with a plating metal.
In an alternative embodiment, there can be a gap between the ends of the coil. Generally, the gap should be small, such as not greater than about 5% of the diameter 302 of the torus 300, not greater than about 2.5% of the diameter 302 of the torus 300, even not greater than about 1% of the diameter 302 of the torus 300.
The cross diametric compression spring can be used as a gasket or seal in an electronic system to reduce EMI/RFI. In an embodiment, the cross diametric compression spring can be placed between two parts of an electronics enclosure, such as between a body and a lid, to provide an EMI/RFI seal. Preferably, the ends of the spring can be welded together to prevent the formation of a gap in the seal. Alternatively, the ends of the spring may not be welded, but can be placed close together to minimize the formation of a gap.
The cross diametric compression spring can significantly reduce the electromagnetic energy able to pass through the space between the two parts of the enclosure. For example, the cross diametric compression spring may attenuate the electromagnetic energy passing through the space by at least −70 dB, such as at least −80 dB. Additionally, the cross diametric compression spring can have a substantially constant attenuation over a range of frequencies, such as between about 1 MHz and about 600 MHz. In an embodiment, the cross-diametric compression spring can have an Attenuation Resistance Rating of not less than about 2.0 dB ohms per inch, such as not less than about 3.0 dB ohms per inch, even not less than about 3.5 dB ohms per inch. The Attenuation Resistance Rating is the product of the DC resistance and the shielding quality at 600 MHz.
Samples were prepared using full hard 301 Stainless Steel having a bright surface. The compressive load is measured using a spring tester. The DC resistance is determined using an Agilent 4338B milliohmmeter. In accordance with SAE ARP1706 Rev A, the attenuation is determined using an Agilent E4402 and the attenuation is standardized to Shielding Quality. Attenuation Resistance Rating is determined by multiplying the DC resistance by the shielding quality at 600 MHz.
Sample 1 is an overlapping helical coil made from 0.002 inch thick and 0.125 inch wide ribbon formed in a helical coil having an 0.188 inch outer diameter and a 30% overlap between adjacent loops. The compressive load measured at 0.015-inch compression is 7.0 pound-feet per inch of length of the helical coil. DC resistance is determined to be 30.060 milliohm per inch. As shown in
Sample 2 is a non-overlapping helical coil made from 0.004 inch thick and 0.062 inch wide ribbon formed in a helical coil having a 0.188-inch outer diameter and a 0.005-inch gap between adjacent loops. The compressive load measured at 0.015-inch compression is 9.8 pound-feet per inch of length of the helical coil. DC resistance is determined to be 14.43 milliohm per inch. As shown in
The present application claims priority from U.S. Provisional Patent Application No. 61/158,205, filed Mar. 6, 2009, entitled “OVERLAP HELICAL CONDUCTIVE SPRING,” naming inventors Jon M. Lenhert, Karthik Vaideeswaran and Donald M. Munro, which application is incorporated by reference herein in its entirety.
Number | Date | Country | |
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61158205 | Mar 2009 | US |