Claims
- 1. An overvoltage protection material for placement between and in contact with spaced conductors, said material comprising a matrix formed of a binder and only closely spaced conductive particles:
- a) said only closely spaced conductive particles homogeneously distributed in said binder, said particles being in the size range 10 microns to two hundred microns and spaced in the range 25 angstroms to 350 angstroms to provide electrical conduction by quantum-mechanical tunneling therebetween; and
- b) said binder selected to provide the quantum-mechanical tunneling media between said particles and predetermined resistance between said conductive particles in the absence of quantum-mechanical tunneling.
- 2. A material according to claim 1 wherein the binder is an electrical insulator.
- 3. A material according to claim 1 wherein the binder material has electrical resistivity ranging from 10.sup.8 to about 10.sup.16 ohm-centimeters.
- 4. A material according to claim 1 wherein the binder is a polymer which has had its resistance characteristics modified by addition of materials such as powdered metallic compounds, powdered metallic oxides, powdered semiconductors, organic semiconductors, organic salts, coupling agents, and dopants.
- 5. A material according to claim 1 wherein the binder is selected from the class of organic polymers such as polyethylene, polypropylene, polyvinyl chloride, natural rubbers, urethanes, and epoxies.
- 6. A material according to claim 1 wherein the binder is selected from silicone rubbers, fluoropolymers, and polymer blends and alloys.
- 7. A material according to claim 1 wherein the binder is selected from the class of materials including ceramics, and refractory alloys.
- 8. A material according to claim 1 wherein the binder is selected from the class of materials including waxes and oils.
- 9. A material according to claim 1 wherein the binder is selected from the class of materials including glasses.
- 10. A material according to claim 1 wherein the binder includes fumed silicon dioxide, quartz, alumina, aluminum trihydrate, feld spar, silica, barium sulphate, barium titanate, calcium carbonate, woodflour, crystalline silica, talc, mica, or calcium sulphate.
- 11. A material according to claim 1 wherein the conductive particles include powders of aluminum, beryllium, iron, gold, silver, platinum, lead, tin, bronze, brass, copper, bismuth, cobalt, magnesium, molybdenum, palladium, tantalum, tungsten and alloys thereof, carbides including titanium carbide, boron carbide, tungsten carbide, and tantalum carbide, powders based on carbon including carbon black and graphite, as well as metal nitrides and metal borides.
- 12. A material according to claim 1 wherein the conductive particles include uniformly sized hollow or solid glass spheres coated with a conductor such as include powders of aluminum, beryllium, iron, gold, silver, platinum, lead, tin, bronze, brass, copper, bismuth, cobalt, magnesium, molybdenum, palladium, tantalum, tungsten and alloys thereof, carbides including titanium carbide, boron carbide, tungsten carbide, and tantalum carbide, powders based on carbon including carbon black and graphite, as well as metal nitrides and metal borides.
- 13. A material according to claim 1 wherein the conductive particles have resistivities ranging from about 10.sup.-1 to 10.sup.-6 ohm-centimeters.
- 14. A material according to claim 1 wherein the percentage, by volume, of conductive particles in the material is greater than about 0.5% and less than about 50%.
- 15. A two terminal device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry between terminals.
- 16. An electroded device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry.
- 17. A leaded electroded device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry.
- 18. A device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry and electrostatic bleed.
- 19. An electroded device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry and electrostatic bleed.
- 20. A leaded electroded device utilizing materials in any one of claims 1 through 14 to provide nanosecond transient over-voltage protection to electronic circuitry and electrostatic bleed.
- 21. A device utilizing materials in any one of claims 1 through 14 in which the on-state resistance is low, on the order of 10 ohms.
Parent Case Info
This application is a continuation-in-part of pending application Ser. No. 143,615 filed Jan. 11, 1988 entitled Overvoltage Protection Device And Material and now U.S. Pat. No. 4,977,357, issued Dec. 11, 1990.
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3685026 |
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Aug 1972 |
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4551268 |
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4726991 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
143615 |
Jan 1988 |
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