Materials and processes to produce hermetic environmental barrier coatings (EBCs) to avoid spallation by thermally grown SiO2 oxides (TGO).
Environmental barrier coatings (EBCs) have been applied onto Si-based ceramic matrix composites (CMCs) for the protection of CMCs from oxidation and water vapor attack. Currently, state of art EBC systems contains a Si bond coat and a rare earth disilicate intermediate layer and/or top coat. Rare earth disilicate has a coefficient of thermal expansion (CTE) that closely matches that of the underlying SiC substrate. In high temperature gas turbine engine environments, water vapor can penetrate through micro-cracks resulting in the coating to accelerate oxidation of the Si bond coat, which causes the spallation of the EBCs when the thermally grown oxides (TGO) reach a threshold thickness. As this spallation of environmental barrier coatings (EBCs) induced by thermally grown SiO2 oxides (TGO) is a key EBC failure mode, it is important to control the TGO growth rate in order to improve the coating durability.
Conventionally, air plasma spray (APS) processes are normally used for depositing rare earth silicates coatings. However in the APS process, the particle velocity is generally lower (<200 m/s), which causes the significant SiO2 loss and results in the inclusion of rare earth monosilicates phases in the deposited disilicates coatings. As monosilicate generally has a much larger CTE (=7.5×10−6/° C.) than that of disilicate (=4.1×10−6/° C.), the inclusion of larger CTE monosilicates phases in a disilicates coating will generate cracks during thermal cycling. The presence of such cracks in the coating will provide a transport path for oxidizing species to the silicon bond coat and result in the rapid growth of TGO and earlier failure of coatings. Therefore, controlling the phase composition in the disilicates coating is critical to achieve highly durable EBCs. In addition, porosity and micro-cracks are always present in the conventional APS EBCs which will facilitate the diffusion of oxidants through these micro-cracks and accelerate the silicon bond coat oxidation and therefore reduce the EBCs durability.
To reduce TGO growth rate, a hermetic and oxidation barrier layer is needed to prevent oxidants diffusion to the silicon bond coat surface.
Embodiments are directed to materials and processes to produce a hermetic EBC. Such a deposited hermetic EBC showed excellent oxidation resistance in a steam environment at high temperature with almost no TGO growth after 410 hours exposure in steam environment at 1316° C.
Embodiments are directed to using an exemplary high apparent density feedstock as EBC materials or raw materials, wherein “high apparent density” is defined in accordance with ASTM B212 as higher than 1.8 g/cc. The exemplary high apparent density powders can have a solid ceramic core, which is desired to prevent SiO2 loss in the coating process. Further, a high temperature (where all or mean measured particle temperatures are above the melting temperature of the material composition), high velocity (where mean measured particle velocity is greater or equal to 200 m/s) coating process (HTHV) is used to deposit the exemplary EBCs. The particle velocity in the plasma jet in this HTHV process is over 200 m/s, and preferably between 400 m/s and 800 m/s, to produce dense coatings. By way of non-limiting example, the exemplary high apparent density powder according to embodiments can be a Yb2Si2O7 feedstock or powder.
In accordance with embodiments, it has been found that there is almost no TGO growth after 410 hours exposure in steam environment at 1316° C. for the HTHV coating formed using the exemplary high apparent density powders.
A high temperature, high velocity (HTHV) thermal spray process can be used for depositing an exemplary coating on a substrate, by way of non-limiting example, rare earth silicates EBC deposition, preferably disilicates EBC deposition. For example, as the higher particle velocity (>200 m/s) achieved by an HTHV application process is greater than that available with the conventional APS process, a dense and micro-crack free EBC is deposited. This dense microstructure provides a diffusion barrier for oxidants (i.e., steam, oxygen) and, therefore, prevents oxidation of silicon bond coat. Moreover, experimental results have demonstrated that there is almost no TGO growth after 410 hours exposure in a steam environment at 1316° C. for exemplary coatings made using the high temperature and high velocity (HTHV) process. By way of non-limiting example, the exemplary rare earth silicate coating can be a Yb2Si2O7/Si coating.
To prevent the significant SiO2 loss of silica containing molten particles (such as rare earth silicates, preferably disilicates, and mullite) in the plasma jet, high apparent density powder feedstock or feedstock powders made using the high apparent density powders as raw materials are preferred. The high apparent density powders have a solid ceramic core, which is desired to prevent the SiO2 loss in the coating process. The preferred apparent density is over 1.8 g/cc, preferably over 2.2 g/cc.
The high apparent density powders or the powder made using the high apparent density powders have a particle size distribution between 11 μm to 125 μm, preferably between 11 μm to 62 μm.
Using high apparent density powder feedstock, there is, e.g., only ˜6.0 v % Yb2SiO5 phase in the HTHV deposited Yb2Si2O7 coatings, which is advantageous to keep the coating having a CTE matched with that of the substrate.
The high apparent density powders can be manufactured using the following processes:
The high temperature and high velocity thermal spray processes can be any of the following processes and can be operated in air atmosphere or in a vacuum atmosphere.
In any of the above processes, the in-flight particles have an average velocity over 200 m/s, preferably over 400 m/s. Further, in the high temperature, high velocity vacuum plasma spray process, the vacuum ranges from 1 mbar to 100 mbar.
The high apparent density powder feedstock according to embodiments can have the following chemistries:
Other exemplary embodiments and advantages of the present invention may be ascertained by reviewing the present disclosure and the accompanying drawing.
The present invention is further described in the detailed description which follows, in reference to the noted plurality of drawings by way of non-limiting examples of exemplary embodiments of the present invention, in which like reference numerals represent similar parts throughout the several views of the drawings, and wherein:
The particulars shown herein are by way of example and for purposes of illustrative discussion of the embodiments of the present invention only and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the present invention. In this regard, no attempt is made to show structural details of the present invention in more detail than is necessary for the fundamental understanding of the present invention, the description taken with the drawings making apparent to those skilled in the art how the several forms of the present invention may be embodied in practice.
To prevent significant SiO2 loss of silica containing molten particles (such as rare earth silicates, preferably disilicates, and mullite) in the plasma jet, high apparent density powder feedstock or feedstock powders made using the high apparent density powders as raw materials is preferred. The high apparent density powders have a solid ceramic core, which is desired to prevent the SiO2 loss in the coating process. The preferred apparent density is over 1.8 g/cc, preferably over 2.2 g/cc.
The high apparent density powders can be manufactured using the following processes:
Moreover, powders made according to these processes have a phase purity over 95 v %.
Moreover, the exemplary high apparent density powder or pre-alloyed processed exemplary high apparent density powder feedstock is not limited to the above-identified rare earth silicates, but can have the following chemistries:
The high apparent density powders according to embodiments can be deposited using a high temperature, high velocity (HTHV) thermal spray process to form an EBC. As this HTHV process produces a higher particle velocity (>200 m/s) than can be achieved through the conventional APS process, it has been found that a dense, e.g., <5% porosity, and micro-crack free EBC is deposited. This dense microstructure provides a diffusion barrier for oxidants (i.e., steam, oxygen) and, therefore, prevents oxidation of silicon bond coat. Preferably, the HTHV process produces a particle velocity of greater than 400 m/s.
Moreover, the HTHV thermal spray processes can be any of the following processes and can be operated in air atmosphere or in a vacuum atmosphere.
In any of the above processes, the in-flight particles have an average velocity over 200 m/s, preferably over 400 m/s. Further, in the high temperature, high velocity vacuum plasma spray process, the vacuum ranges from 1 mbar to 100 mbar.
In accordance with embodiments,
The exemplary coating can also include an oxidation barrier layer that is formed on the bond coat layer to block oxygen and steam diffusion. The oxidation barrier layer deposited on the bond coat layer can have a thickness of 10 μm to 1000 μm and preferably 50 μm to 250 μm. This oxidation barrier layer is applied according to the embodiments by an HTHV process to have a porosity of less than 10% and preferably less than 5%. Further, the oxidation barrier layer can have the following chemistries:
It is noted that the foregoing examples have been provided merely for the purpose of explanation and are in no way to be construed as limiting of the present invention. While the present invention has been described with reference to an exemplary embodiment, it is understood that the words which have been used herein are words of description and illustration, rather than words of limitation. Changes may be made, within the purview of the appended claims, as presently stated and as amended, without departing from the scope and spirit of the present invention in its aspects. Although the present invention has been described herein with reference to particular means, materials and embodiments, the present invention is not intended to be limited to the particulars disclosed herein; rather, the present invention extends to all functionally equivalent structures, methods and uses, such as are within the scope of the appended claims.
Filing Document | Filing Date | Country | Kind |
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PCT/US2022/015276 | 2/4/2022 | WO |
Number | Date | Country | |
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63146209 | Feb 2021 | US |