Claims
- 1. A method of forming an electronic package comprising the steps of:
- disposing at least one insulating material with reinforcement material within a mold chamber of a closed mold;
- pressure casting liquid metal into the mold chamber such that the reinforcement material is infiltrated and the insulating material is supported by the metal; and
- forming an electrical feedthrough from the insulating material extending through at least one wall of the electronic package.
- 2. A method as described in claim 1 including after the forming step, there is the step of introducing an electrically conductive wire through the electrical feedthrough.
- 3. The method as described in claim 1, wherein the reinforcement material is discontinuous.
- 4. A method of forming an electronic package comprising the steps of:
- disposing at least one weld ring with reinforcement material within a mold chamber of a closed mold, the reinforcement material defining a first wall and a second wall and the weld ring being disposed adjacent the second wall; and
- filling the mold chamber with the liquid metal such that the reinforcement material is infiltrated and the weld ring is supported adjacent the second wall by the metal to thereby form an electronic package having a weld ring for sealing the electronic package.
- 5. The method as described in claim 4, wherein the weld ring is substantially surrounded by the metal.
- 6. The method as described in claim 4, wherein the liquid metal is infiltrated into the reinforcement material under elevated pressure.
- 7. The method as described in claim 4, wherein the reinforcement material is discontinuous.
Parent Case Info
This is a continuation application of U.S. patent application Ser. No. 08/242,278 filed May 13, 1994, and now abandoned, which is a continuation-in-part of U.S. patent application Ser. No. 08/027,932 filed Mar. 8, 1993, now U.S. Pat. No. 5,311,920 issued May 17, 1994, which is a continuation application of U.S. patent application Ser. No. 07/737,493 filed Jul. 29, 1991 and now abandoned.
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Number |
Name |
Date |
Kind |
4508158 |
Amateau |
Apr 1985 |
|
4671336 |
Anahara et al. |
Jun 1987 |
|
5526867 |
Keck et al. |
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Foreign Referenced Citations (2)
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51-14821 |
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Continuations (2)
|
Number |
Date |
Country |
Parent |
242278 |
May 1994 |
|
Parent |
737493 |
Jul 1991 |
|
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
27932 |
Mar 1993 |
|