Package for a wafer for the welding and/or cutting of plastic tubes

Information

  • Patent Grant
  • D355848
  • Patent Number
    D355,848
  • Date Filed
    Tuesday, January 18, 1994
    31 years ago
  • Date Issued
    Tuesday, February 28, 1995
    30 years ago
  • US Classifications
    Field of Search
    • US
    • D09 415
    • D09 346
    • D09 433
    • D09 432
    • D09 456
    • D09 457
    • 206 4533
    • 206 4513
    • 206 491
    • 206 492
    • 206 495
    • 206 472
    • 206 90
    • 206 92
    • 206 93
    • 206 105
    • 206 118
    • 206 119
    • 229 40
    • 229 8701
    • Term of Grant
      14Years
Abstract
Description
Claims
  • The ornamental design for a package for a wafer for the welding and/or cutting of plastic tubes, as shown and described.
US Referenced Citations (8)
Number Name Date Kind
D339063 Simon Sep 1993
2351223 Neivert Jun 1944
3373866 Will Mar 1968
4015708 Kelm Apr 1977
4016973 Blake Apr 1977
4333565 Woods Jun 1982
4570797 Weinman Feb 1986
5085318 Leverick Feb 1992
Non-Patent Literature Citations (2)
Entry
Modern Packaging, 1958, p. 340, as circled.
Packaging, 1959, p. 59, as circled.