Claims
- 1.A wireless smart package assembly for use in the protection of a product, said assembly comprising:
- 2.The assembly of claim 1 wherein said electrically conductive layer covers a non-planar region of said sheet and is adapted to form an antenna.
- 3.The assembly of claim 1 wherein:
- 4.The assembly of claim 3 wherein said electrically conductive layer is adapted to form an antenna and said layer is defined by a length and width along said surfaces in proportion to at least one property selected from the group consisting of size of said package, material used in said sheet, uses for said antenna, material properties of said product, and operating frequency of said antenna.
- 5.The assembly of claim 2 or 4 wherein said layer has a thickness defined proportionally to a selected range and a selected radiating efficiency.
- 6.The assembly of claim 2 or 4 wherein said antenna is adapted to receive excitation from a transceiver, said excitation being selected from the group consisting of linear and circular polarization.
- 7.The assembly of claim 2 or 4 wherein said antenna includes a 5% VSWR bandwidth.
- 8.The assembly of claim 7 wherein said VSWR bandwidth is increased by resistively loading said electrically conductive layer.
- 9.The assembly of claim 2 or 4 wherein said layer is printed onto said surfaces.
- 10.The assembly of claim 2 or 4 wherein said layer is formed from copper metalization.
- 11.The assembly of claim 2 or 4 wherein said layer is formed from a conductive ink.
- 12.A wireless smart package assembly for use in the protection of a product, said assembly comprising:
- 13.The assembly of claim 12 wherein said electrically conductive layer is defined by a length and width along said surfaces in proportion to at least one property selected from the group consisting of size of said package, material used in said sheet, uses for said antenna; material properties of said product; and operating frequency of said antenna.
- 14.The assembly of claim 12 or 13 wherein said layer has a thickness defined proportionally to a selected range and a selected radiating efficiency.
- 15.The assembly of claim 12 or 13 wherein said antenna is adapted to receive excitation from a transceiver, said excitation being selected from the group consisting of linear and circular polarization.
- 16.The assembly of claim 12 or 13 wherein said antenna includes a 5% VSWR bandwidth.
- 17.The assembly of claim 16 wherein said VSWR bandwidth is increased by resistively loading said electrically conductive layer.
- 18.The assembly of claim 12 or 13 wherein said layer is printed onto said surfaces.
- 19.The assembly of claim 12 or 13 wherein said layer is formed from copper metalization.
- 20.The assembly of claim 12 or 13 wherein said layer is formed from a conductive ink.
- 21.The assembly of claim 13 wherein said at least one sheet is adapted with at least four surfaces to surround said product and said layer covers a portion of four of said surfaces.
- 22The assembly of claim 13 wherein sheet is or a two ply material and said layer is formed in between said two-ply layers.
- 23.The assembly of claim 13 including an RFID tag electrically connected with said layer.
- 24.A wireless smart package assembly for use in the protection and display of a product, said assembly comprising:
- 25.A wireless smart package assembly for use in the distribution of a product, said assembly comprising:
- 26.The assembly of claim 25 wherein:
- 27.The assembly of claim 26 wherein said layer has a thickness defined proportionally to a selected range and a selected radiating efficiency.
- 28.The assembly of claim 26 wherein said antenna is adapted to receive excitation from a transceiver, said excitation being selected from the group consisting of linear and circular polarization.
- 29.The assembly of claim 12 or 13 wherein said antenna includes a 5% VSWR bandwidth.
- 30.The assembly of claim 16 wherein said VSWR bandwidth is increased by resistively loading said electrically conductive layer.
- 31.The assembly of claim 26 wherein said layer is printed onto said surfaces.
- 32.The assembly of claim 26 wherein said layer is formed from copper metalization.
- 33.The assembly of claim 12 or 13 wherein said layer is formed from a conductive ink.
- 34.The assembly of claim 25 wherein:
- 35.The assembly of claim 25, 26 or 34 including:
Cross Reference to Related Applications
[0001] This application claims priority from U. S. Provisional Application No. 60/189,694 filed on March 15, 2000 and U.S. Provisional Application No. 60/189, 596 filed on March 15, 2000 and which are hereby incorporated by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/189,596 |
Mar 2000 |
US |