Patent Application
20170345961
This application claims the benefit of Chinese Patent Application No. 201610367262.0, filed on May 27, 2016, which is incorporated herein by reference in its entirety.
The present disclosure relates to a package structure and a method for manufacturing the same, and more particularly, to a package structure having a light sensor and method for manufacturing the same.
In a device such as a notebook computer and a mobile phone, various light sensors are generally used. Ambient light sensors can detect the brightness of ambient light and automatically adjust backlight luminance of the display based on it, in order to reduce power consumption. Therefore, energy-saving and intelligence of the products are realized. Proximity sensors can detect the action that a user puts a phone mobile close to ear and begins to make a phone call, at the occasion, the backlight module in the mobile phone can be turned off, for saving energy and preventing misoperation.
When an ambient light sensor and a proximity sensor are used in an electronic product, the proximity sensor is generally a infrared light sensor which needs to receive the infrared light reflected, and the ambient light sensor needs to avoid the interference of the infrared light as possible to make the determination result of the ambient light sensor to the brightness of the ambient light close to the human eyes. Ambient light sensors, infrared light sensors and infrared light emitters are generally independent devices in the conventional electronic products, which increases manufacturing cost, and the resulting products including the sensors have large sizes. Therefore, the prior art begins to integrate the ambient light sensor, the infrared light sensor and the infrared light emitter into a package structure. The package structure, as shown in
However, in order to improve the convenience of notebook computers, mobile phones and other equipments, it is desired to further reduce the size of the package structure.
In view of the above problems, an objective of the disclosure is to provide a package structure and a method for manufacturing the same, to ensure the anti-interference capability of the light sensor and reduce the size.
According to one aspect of the disclosure, the package structure comprises a lead frame; a first light sensor being electrically coupled to the lead frame; a light emitter separated from the first light sensor and being electrically coupled to the lead frame; a first plastic body in which a trench is formed; and a photoresist layer located on a side surface of the first plastic body, wherein the first plastic body is divided by the trench into a first portion covering the light emitter and a second portion covering the first light sensor, the first portion of the first plastic body has the side surface facing the first light sensor.
Preferably, the package structure further comprises a second light sensor being electrically coupled to the lead frame.
Preferably, the first light sensor is an ambient light sensor, on which an ambient light sensitive region is provided to detect ambient light; and the second light sensor is an infrared light sensor, on which an infrared light sensitive region is provided to detect infrared light.
Preferably, the first plastic body is a transparent plastic body; and the photoresist layer is an infrared photoresist layer that prevents infrared light from passing through.
Preferably, a first filter film is provided on the ambient light sensitive region of the ambient light sensor, which is an infrared cutoff filter film.
Preferably, a second filter film is provided on the infrared light sensitive region of the infrared light sensor, which allows only infrared light to pass through.
Preferably, the portions of the first plastic body on the ambient light sensor, the infrared light sensor, and the infrared light emitter may optionally have arcuate projections.
Preferably, the package structure further comprising:
a second plastic body made of infrared cutoff materials and covering the rest portion of the infrared light sensor except for the infrared light sensitive region.
Preferably, the lead frame comprises:
a plurality of inner pins being coupled to the first light sensor and the light emitter; and a plurality of outer pins being exposed outside the first plastic body.
Preferably, the package structure further comprising:
a third plastic body, wherein there are gaps between the plurality of inner pins, and the gaps are filled with the third plastic body.
Preferably, the third plastic body is made of infrared cutoff materials.
According to the other aspect of the disclosure, there is provided a method for manufacturing a package structure, comprising:
providing a lead frame; mounting a first light sensor and a light emitter which are mounted separately but both electrically coupled to the lead frame; forming an first plastic body which covers all or part of the first light sensor and the light emitter; forming a trench in the first plastic body, wherein the first plastic body is divided by the trench into a first portion covering the light emitter and a second portion covering the first light sensor, the first portion of the first plastic body has a side surface facing the first light sensor; forming a light photoresist layer on the side surface.
Preferably, the method further comprises:
mounting a second light sensor being electrically coupled to the lead frame.
Preferably, the second light sensor is mounted while the first light sensor and the light emitter are mounted.
Preferably, the second light sensor is mounted in superposed manner on the first light sensor.
Preferably, the second light sensor is mounted after the first plastic body is formed.
Preferably, a second plastic body is formed covering the second light sensor after the second light sensor is mounted. When the first plastic body is cut, the second plastic body is cut or not.
Preferably, the step of forming the first plastic body comprises forming arcuate projections over the first light sensor and the light emitter.
Preferably, the electric coupling is implemented by coupling electrodes of the first light sensor or the second light sensor or the light emitter to inner pins of the lead frame via electric connectors.
Preferably, the electric coupling is implemented by placing electrodes of the first light sensor or the second light sensor or the light emitter towards inner pins of the lead frame and welding to the inner pins.
Preferably, the electric coupling between the second light sensor and the lead frame is implemented by conductive vias provided on the first light sensor.
Preferably, wherein the materials of the first plastic body are filled between the photoresist layer and the second portion of first plastic body to form a complete first plastic body.
The package structure and method for manufacturing the same according to the disclosure comprise mounting a photoresist layer between the light emitter and the light sensor, so as to prevent the light with a specific wavelength from passing through and avoid the influence to the normal operation of the light sensor, and thus the anti-interference capacity of the light sensor is ensured and the size of package structure is reduced while the light sensor is integrated.
The above and other objects, advantages and features of the present invention will become more fully understood from the detailed description given hereinbelow in connection with the appended drawings, and wherein:
Exemplary embodiments of the present disclosure will be described in more details below with reference to the accompanying drawings. In the drawings, like reference numerals denote like members. The figures are not drawn to scale, for the sake of clarity. Moreover, some well-known parts may not be shown.
It should be understood that when one layer or region is referred to as being “above” or “on” another layer or region in the description of device structure, it can be directly above or on the other layer or region, or other layers or regions may be intervened therebetween. Moreover, if the device in the figures is turned over, the layer or region will be “under” or “below” the other layer or region.
In contrast, when one layer is referred to as being “directly on” or “on and adjacent to” or “adjoin” another layer or region, there are not intervening layers or regions present. In the present application, when one region is referred to as being “directly in”, it can be directly in another region and adjoins the another region.
Some particular details of the present disclosure will be described below, such as exemplary semiconductor structures, materials, dimensions, process steps and technologies of the semiconductor device, for better understanding of the present disclosure. However, it can be understood by one skilled person in the art that these details are not always essential for but can be varied in a specific implementation of the disclosure.
Hereinafter, the process of packaging an ambient light sensor, an infrared light sensor and an infrared light emitter are used as an example to describe a package structure and method for manufacturing the same, where the ambient light sensor and infrared light sensor can be exchanged in their positions.
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It should be noted that the above second embodiment can also be embodied in differently alternative manners.
In an alternative embodiment, a first filter film is provided on the ambient light sensitive region of the ambient light sensor 340, the first filter film is an infrared cutoff filter film, so that the determination result of the ambient light sensor to the brightness of ambient light is close to the human eyes. The infrared light sensor 330 includes a second filter film provided on the infrared light sensitive region and the second filter film only allows infrared light to pass through.
In another alternative embodiment, the first plastic body 350 has a first portion covering the infrared light emitter 320 and a second portion covering the infrared light sensor 330 and the ambient light sensor 340, the second portion has arcuate projections.
In another alternative embodiment, the materials of the first plastic body 350 are filled between the photoresist layer 380 and the second portion of the first plastic body 350.
In another alternative embodiment, the lead frame 310 includes a package substrate including a first surface and a second surface, the first surface has conductive traces, i.e., inner pins, the inductive traces are coupled to the outer pins on the second surface of the package substrate via the conductive vias in the package substrate, and the infrared light emitter, the infrared light sensor and ambient light sensor are electrically coupled to the conductive traces of the package substrate.
The method for manufacturing the package structure according to the third embodiment and that according to the second embodiment are basically the same, and the difference between them are described below.
First, the lead frame 410 is provided to mount the infrared light emitter 420, infrared light sensor 430 and ambient light sensor 440, three of them have electrodes towards the lead frame 410 and are coupled to the lead frame 410 by welding the electrodes to the lead frame 410.
The subsequent processes, including plasticizing, cutting the first plastic body and spraying the photoresist materials to form the photoresist layer, are the same as the corresponding steps of the second embodiment, and will not describe in detail herein. The first plastic body 450 is cut to form a trench therein, the trench extends to the surface of the infrared light sensor 430, the first plastic body 450 includes a first portion covering the infrared light emitter 420 and a second portion covering the infrared light sensor 430 and the ambient light sensor 440. Finally, the materials of the first plastic body 450 is filled between the photoresist layer 480 and the second portion of the first plastic body 450, so as to form a more complete first plastic body 450. With this, the manufacturing process for the package structure according to the third embodiment is accomplished.
It should be noted that the infrared light sensor and the ambient light sensor according to the embodiments can exchange in their positions. Actually, the infrared light emitter may also be light emitting devices with other wavelength. At that condition, the ambient light sensor, the infrared light sensor, the filter film located on their light sensitive regions, the plastic materials, and the photoresist materials of the photoresist layer should be changed correspondingly.
It should also be understood that the relational terms such as “first”, “second”, and the like are used in the context merely for distinguishing one element or operation form the other element or operation, instead of meaning or implying any real relationship or order of these elements or operations. Moreover, the terms “comprise”, “comprising” and the like are used to refer to comprise in nonexclusive sense, so that any process, approach, article or apparatus relevant to an element, if follows the terms, means that not only said element listed here, but also those elements not listed explicitly, or those elements inherently included by the process, approach, article or apparatus relevant to said element.
If there is no explicit limitation, the wording “comprise a/an . . . ” does not exclude the fact that other elements can also be included together with the process, approach, article or apparatus relevant to the element.
Although various embodiments of the present invention are described above, these embodiments neither present all details, nor imply that the present invention is limited to these embodiments. Obviously, many modifications and changes may be made in light of the teaching of the above embodiments. These embodiments are presented and some details are described herein only for explaining the principle of the invention and its actual use, so that one skilled person can practice the present invention and introduce some modifications in light of the invention. The invention is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the invention as defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201610367262.0 | May 2016 | CN | national |
