Package structure for a semiconductor element

Abstract

Description

FIG. 1 is a top perspective view of a package structure for a semiconductor element, showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a package structure for a semiconductor element, as shown and described.