Patent Application
20090078950
The present invention generally relates to a package structure for a light emitting diode (LED), and more specifically relates to a technical field that changes light extraction pattern of the LED by using replaceable optical elements.
LED is a solid semiconductor element that releases energy as light when current is passed through it to enable two carriers combining, and has advantages of slight weight, short response time and non-pollution. With these advantages, LEDs can be applied in many industries. The high-power LEDs are developed to overcome insufficient brightness, so the LEDs can be taken as a light source and have gradually taken the place of traditional tungsten lamps.
A conventional LED structure 1 is shown in
The aforesaid substrate 10 of the LED can overcome heat dissipation problem. Various light extraction characteristics or light patterns are required because the LED is in widespread use. Therefore, after the conventional LED is packaged completely, the lens 103 is fastened to the substrate 10. To get various light patterns, user must prepare many LEDs with different lenses or increase additional optical elements, thus resulting in time consuming.
To overcome the foregoing shortcomings, the inventor(s) of the present invention based on years of experience in the related field to conduct extensive researches and experiments, and finally invented a package structure with a replaceable element for an LED, as a method or a basis for resolving the foregoing drawbacks.
Briefly, it is a primary object of the present invention to provide a package structure for an LED to change light shape of the LED by using a replaceable optical element, thereby enhancing convenience in usage.
To achieve the foregoing object, the package structure for the LED includes a first substrate, an LED chip, a second substrate, a protection layer and a replaceable optical element. The LED is disposed on the first substrate. The second substrate is disposed on the first substrate, and surrounds the LED chip, and has a first thread. The protection layer covers the LED chip. The replaceable optical element has a second thread, and is fastened to the second substrate through the first thread. An interior wall of the optical element corresponds to a surface of the protection layer in arc shape.
Moreover, the present invention further discloses a lens holder for accommodating the optical element to provide another embodiment of the replaceable optical element. According to the package structure for the LED, the light extraction pattern of the LED can change by replacing the optical element through the structural design with the replaceable optical element.
To make it easier for our examiner to understand the object of the invention, its innovative features and performance, a detailed description and technical characteristics of the present invention are described together with the drawings as follows.
In the related figures for the package structure for an LED according to a preferred embodiment of the present invention, the same elements are described by the same reference numerals.
Referring to
The first substrate 21 has a first surface 211, and the material of the first substrate 21 includes a high thermal conducting material. The LED chip 12 is disposed on the first surface 211 of the first substrate 21. The LED chip 12 is covered by the protection layer 22, and the material of the protection layer 22 is silicone or epoxy resin.
The second substrate 20 is disposed on the first substrate 21, and surrounds the LED chip 12, and has a first thread 202 and electrode pins 201. The electrode pins 201 are used to receive an electrical signal to drive the LED chip 12 for emitting light. The second substrate 20 has high reflective capability upon demands. In general, a reflective surface is formed on a surface of the second substrate 20, and the first substrate 21 and the second substrate 20 may be made by integrated molding.
The replaceable optical element 23 has a second thread 231, and is fastened to the second substrate 20 through the first thread 20. An interior wall 232 of the optical element 23 corresponds to the surface of the protection layer 22 in arc shape. For example, the normal direction of the interior wall 232 of the optical element 23 is similar to the normal direction of the surface of the protection layer 22. Therefore, the light emitted by the LED chip 12 cannot be easily reflected by the interior wall 232 of the optical element 23 or the surface of the protection layer 22. The interior wall 232 of the optical element 23 may contact with the surface of the protection layer 22 or there is an interval between the interior wall 232 of the optical element 23 and the surface of the protection layer 22. The optical element 23 is generally a lens. The optical element 23 illustrated in the first embodiment is a Lambertian lens (as a lens for generating positive light).
Referring to
In accordance with the package structure for the LED, the goal of conveniently replacing the optical element can be achieved through the design of threads to overcome the drawbacks of inconveniently using the conventional LED and increasing additional optical elements.
Referring to
In accordance with the package structure for the LED, the goal of conveniently replacing the optical element can be achieved through the design of threads to overcome the drawbacks of inconveniently using the conventional LED and increasing additional optical elements.
Referring to
The first substrate 21 has a first surface 211, and the material of the first substrate 21 may be a high thermal conducting material. The LED chip 12 is disposed on the first surface 211 of the first substrate 21. The LED chip 12 is covered by the protection layer 22. The material of the protection layer 22 includes silicone or epoxy resin.
The second substrate 20 is disposed on the first substrate 21, and surrounds the LED chip 12. The second substrate 20 has a first thread 202 and electrode pins 201. The electrode pins 201 are used to receive an electrical signal to drive the LED chip 12 for emitting light. The second substrate 20 can have high reflective capability upon demands. In general, a reflective surface is formed on a surface of the second substrate 20. The first substrate 21 and the second substrate 20 may be made by integrated molding.
The lens holder 51 has an accommodating space and a second thread 511, and is fastened to the second substrate 20 through the first thread 202. The lens holder 51 is generally a hollow cylinder, and the interior wall of the lens holder 51 can form a reflective surface upon demands. The optical element 52 is disposed in the accommodating space of the lens holder 51. The optical element illustrated herein is generally a lens or a polarizer. The lens also includes a concave lens or a convex lens.
Therefore, in accordance with the package structure 5 for the LED of the fourth embodiment, the goal of conveniently replacing the optical element can be achieved through the design of threads to overcome the drawbacks of inconveniently using the conventional LED and increasing additional optical elements.
Referring to
The first substrate 21 has a first surface 211, and the material of the first substrate 21 is a high thermal conducting material. The LED chip 12 is disposed on the first surface 211 of the first substrate 21. The LED chip 12 is covered by the protection layer 22. The material of the protection layer 22 includes silicone or epoxy resin.
The second substrate 20 is disposed on the first substrate 21, and surrounds the LED chip 12. The second substrate 20 has a first thread 202 and electrode pins 201. The electrode pins 201 are used to receive an electrical signal to drive the LED chip 12 for emitting light. The second substrate 20 can have high reflective capability upon demands. Namely, a reflective surface is formed on a surface of the second substrate 20. The first substrate 21 and the second substrate 20 may be made by integrated molding.
The lens holder 61 has an accommodating space and a second thread 611, and is fastened to the second substrate 20 through the first thread 202. The lens holder 61 is generally a hollow cylinder, and the interior wall of the lens holder 61 can form a reflective surface upon demands. The lens holder 61 has the adjustment mechanism 63 for adjusting the position of the optical element 62.
The optical elements 62 and 64 are disposed in the accommodating space of the lens holder 61. The optical elements illustrated herein are generally a lens or a polarizer. The lens also includes a concave lens or a convex lens. The position of the optical element 62 can be adjusted by the adjustment mechanism 63 for fine-tuning the position of light beam focusing.
Therefore, in accordance with the package structure 6 for the LED of the fifth embodiment, the goal of conveniently replacing the optical element can be achieved through the design of threads to overcome the drawbacks of inconveniently using the conventional LED and increasing additional optical elements. The user can replace appropriate optical elements based on the application area of the LED, and use the adjustment mechanism 63 to change the light extraction characteristic of the LED.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
