BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to a packaging box, and particularly to a packaging box for enclosing an electronic product therein so as to prevent the electronic product from being damaged by external forces.
2. Description of Related Art
In transportation of the electronic products, packaging boxes with buffer structures are often used so as to prevent the electronic products from being damaged by external forces. The buffer structure of the packaging box is usually an individual enclosure which is mounted in the packaging box. The buffer structure includes several projections extending from sidewalls thereof. The projections and walls of the buffer structure cooperatively define an accommodating space therebetween to enclose the electronic product therein. The projections keep certain distances between the electronic product and the walls of the buffer structure. Therefore, the external force exerted on the packaging box can be buffered by the projections but not directly exerted on the electronic product, which prevents the electronic product from being damaged by the external force.
However, because of the fact that the buffer structure is an individual enclosure, a separate mold is necessary in order to produce the individual buffer structure of the packaging box, which increases the cost of manufacturing of the packaging box. Therefore, a packaging box with lower manufacturing cost is needed.
SUMMARY OF THE INVENTION
The present invention relates to a packaging box and a assembly incorporating the same. According to a preferred embodiment of the present invention, the assembly includes an electronic product, and a packaging box for enclosing the electronic product therein. The packaging box includes a casing and a cover. The casing includes a base wall and four sidewalls disposed around the base wall. An accommodating space is defined between the base wall and the sidewalls for enclosing an electronic product therein. Two opposite first sidewalls of the casing pivotably extend two side plates therefrom. The side plates include a plurality of projections extending towards the accommodating space for being sandwiched between the electronic product and the corresponding sidewalls of the casing. The cover is pivotably extended from a second sidewall connected with the first sidewalls of the casing and covers the accommodating space.
Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an isometric view of an open state of a packaging box according to a preferred embodiment of the present invention;
FIG. 2 is a top view of the packaging box of FIG. 1;
FIG. 3 is an isometric view of the packaging box of FIG. 1, with side plates thereof being turned inwardly towards an accommodating space thereof;
FIG. 4 is an isometric view of a closed state of the packaging box of FIG. 1;
FIG. 5 is a cross sectional view of an assembly incorporating the packaging box of FIG. 1; and
FIG. 6 is a cross sectional view of an assembly incorporating a packaging box according to a second embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
Referring to FIGS. 1 to 4, a packaging box 10 according to a preferred embodiment of the present invention is shown. The packaging box 10 includes a casing 12 and a top cover 14, and is folded from a corrugated sheet so as to increase the anti-shock and anti-vibration capabilities thereof to prevent an electronic product 40 (shown in FIG. 5) disposed therein from being damaged by an external force.
The casing 12 includes a rectangular-shaped base wall 124 and four sidewalls, i.e., a left wall 120, a right wall 121, a front wall 122 and a rear wall 123, surrounding the base wall 124. An accommodating space 125 is formed between the base wall 124 and the sidewalls 120, 121, 122, 123 of the casing 12 for enclosing the electronic product 40 therein. Referring to FIG. 5, the electronic product 40 in the packaging box 10 is a heat dissipating apparatus including a heat sink 20 and a heat-dissipating fan 30 mounted on the heat sink 20.
The top cover 14 is rectangular-shaped in profile and is pivotably folded from a top end of the rear wall 123 of the casing 12. A locking plate 142 is folded from a free end of the top cover 14 and opposite to the top end of the rear wall 123 of the casing 12. Particularly referring to FIG. 2, a first hole 126 is defined at a middle portion of the base wall 124 of the casing 12, and a second hole 144 is defined at a middle portion of the top cover 14 thereof, so that the electronic product 40 in the packaging box 10 can be checked via the first and second holes 126, 144 without opening the packaging box 10.
Particularly referring to FIG. 1, the left and right walls 120, 121 of the casing 12 each pivotably extend a side plate 16 from a top end thereof. The side plate 16 has an arm 161 and a wing 103 extending from two opposite sides thereof. The arm 161 is disposed adjacent to the rear wall 123 of the casing 12, whilst the wing 103 is disposed adjacent to the front wall 122 of the casing 12. A hollow rectangular-shaped first projection 162 is folded from a free end of the arm 161 and opposite to the top end of the corresponding left/right wall 120/121 of the casing 12. A hollow rectangular-shaped second projection 164 is folded from a free end of a middle portion of the side plate 16 and adjacent to the corresponding left/right wall 120/121 of the casing 12. When the top cover 14 covers the casing 12, the first projections 162 of the side plates 16 are arranged adjacent to a middle portion of the top end of the rear wall 123.
Referring to FIG. 5, in assembly of the electronic product 40 into the packaging box 10, the top cover 14 and the side plates 16 of the casing 12 are turned outwardly and are positioned at a distance from the accommodating space 125 of the packaging box 10. The electronic product 40 is disposed in the accommodating space 125 of the packaging box 10, with a bottom surface and a front surface thereof respectively abutting against the base wall 124 and the front wall 122 of the casing 12. The side plates 16 of the casing 12 are turned inwardly towards the accommodating space 125, so that the first projections 162 of the side plates 16 are sandwiched between a rear surface of the fan 30 and the rear wall 123 of the casing 12, and the second projections 164 of the side plates 16 are sandwiched between side surfaces of the fan 30 and the left and right walls 120, 121 of the casing 12. The top cover 14 is turned inwardly towards the accommodating space 125 of the casing 12 until the locking plate 142 is sandwiched between the front wall 122 and the wings 103 of the casing 12 so as to cover the casing 12 with the top cover 14. Meanwhile, the electronic product 40 is sandwiched between the top cover 14, and the first and second projections 162, 164, the front wall 122 and the base wall 124 of the casing 12. Therefore, the electronic product 40 is firmly held in the accommodating space 125 of the casing 12.
In the assembly of the electronic product 40 and the packaging box 10, the electronic product 40 is sandwiched between the top cover 14, and the first and second projections 162, 164, the front wall 122 and the rear wall 123 of the casing 12. This prevents the electronic product 40 from shaking in the casing 12 and therefore benefits the transportation of the assembly. Moreover, the first and second projections 162, 164 provide buffer spaces formed between the rear wall 123 of the packaging box 10 and the electronic product 40, and the left and right walls 120, 121 of the packaging box 10 and the electronic product 40, which further prevents the electronic product 40 from being damaged by an external force exerted on the packaging box 10.
Referring to FIG. 6, an assembly 10a incorporating a packaging box 10 according to a second embodiment of the present invention is shown. In the assembly, a buffer pad 50 is sandwiched between the bottom surface of the electronic product 40 and the base wall 124 of the casing 12 so as to further increase the anti-shock capability thereof. The first and second projections 162, 164 have similar heights, which makes bottom surfaces of the first projections 162 coplanar with bottom surfaces of the second projections 164. The electronic product 40 has a flat top surface which is depressed by the first and second projections 162, 164 toward the buffer pad 50, whereby the electronic product 40 is cushioned between the first and second projections 162, 164 and the buffer pad 50.
It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.