Patent Application
20200365783
The subject matter herein generally relates to light emitting diodes (LEDs) packaging structure.
An LED packaging structure comprises a substrate and an encapsulation layer mounted on the substrate. Usually, the encapsulation layer is directly attached to the substrate, or bonded to the substrate by glue.
With the gradual reduction and thinning of the size of LED packaging structure, the contact area between the substrate and the encapsulation layer decreases, thus the bonding may not be not strong enough to keep the substrate and the encapsulation layer firmly connected together.
Implementations of the present technology will now be described, by way of embodiment, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
The substrate 10 further comprises a second surface 13 opposite to the first surface 12 and a plurality of side surfaces 14 connecting the first surface 12 and the second surface 13. An area of the first surface 12 near the side surface 14 sinks toward the second surface 13 to form the at least one groove 11. The grooves 11 can be distributed symmetrically around the light emitting chip 30. For example, areas of the first surface 12 adjacent to the side surface 14 inwardly sink to form two grooves 11. The central axis of the groove 11 is perpendicular to an extending direction of the substrate 10. The groove 11 does not penetrate the substrate 10. The groove 11 along the central axis is consistent in cross section. That is, the groove 11 is geometrically straight.
In an alternative embodiment, the cross-section area of the groove 11 is substantially semicircular, and the groove 11 comprises an opening 14 formed on the side surface 14.
The electrode 20 further comprises a second electrode 22 and a connecting portion 23 connecting the first electrode 21 and the second electrode 22. The second electrode 22 is arranged on the second surface 13, and the location of the second electrode 22 corresponds to that of the first electrode 21. The connecting portion 23 is formed across the first surface 12 and the second surface 13, and electrically connects the first electrode 21 and the second electrode 22. The second electrode 22 is electrically connected to an external power source (not shown), which provides electrical energy.
In an alternative embodiment, the light emitting chip 30 is electrically connected to the first electrode 21 by flip chip technology. The light emitting chip 30 and the first electrode 21 are electrically connected by a solder ball 31.
In an alternative embodiment, the package body 40 define an element capable of converting wavelengths of light, which converts the light emitted by the light emitting chip into white light. In an alternative embodiment, the package body 40 is made of the wavelength converting material.
While the present disclosure has been described with reference to particular embodiments, the description is illustrative of the disclosure and is not to be construed as limiting the disclosure. Therefore, those of ordinary skill in the art can make various modifications to the embodiments without departing from the scope of the disclosure as defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910394499.1 | May 2019 | CN | national |
