Patent Application
20080110795
The present invention relates to packing cases, and more particularly to a packing case that can be used to hold or transport flat, thin objects such as substrates of flat display devices.
Because the liquid crystal display has the advantages of portability, low power consumption, and low radiation, the liquid crystal display is considered by many to have the potential to completely replace cathode ray tube displays. Typically, a liquid crystal display includes a liquid crystal panel, which has a thin film transistor (TFT) substrate and a color filter substrate. In mass production of the liquid crystal display, the TFT and color filter substrates are manufactured in different sections of a factory. Then the TFT and color filter substrates need to be transported to the same section of the factory for assembly. Packing cases are usually needed for holding and transporting the TFT and color filter substrates.
A typical packing case generally includes a main body and a cover. The main body together with the cover forms a closed space for receiving the TFT and color filter substrates therein. The main component of the TFT and color filter substrates is glass, therefore the TFT and color filter substrates are fragile and easily damaged if subjected to external impact. In order to prevent the TFT and color filter substrates from being damaged, a partition layer used as a shock absorber is provided between each two adjacent TFT substrates or color filter substrates in the packing case.
Each TFT substrate or color filter substrate generally includes electronic components such as TFTs formed at a display area of the substrate, and auxiliary circuits such as an electrostatic discharge circuit formed at peripheral sides of the display area. However, the electronic components and auxiliary circuits are liable to be damaged by friction between the substrate and either or both of the partition layers when the substrate is inserted into or taken out of the packing case.
What is needed, therefore, is a packing case that can overcome the above-described deficiencies.
A packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side walls. Each two adjacent protrusions define a groove therebetween. The groove includes a first portion and a second portion. The first portion is adjacent to the side wall, and a width of the second portion increases with increasing distance away from the side wall.
A packing case includes a main body having four side walls, and a plurality of protrusions formed at inner sides of two opposite of the side walls of the main body. At each of the opposite side walls, the protrusions are separate from each other and parallel to each other. Each of the protrusions has a wedge shape and is perpendicular to the side wall. Each two adjacent protrusions define a groove therebetween. The groove includes a first portion and a second portion. The first portion is adjacent to the side wall and has a uniform width, and the second portion flares from the first portion such that a width of the second portion adjacent to the first portion is the same as the width of the first portion and a width of the second portion farthest from the first portion is greater than the width of the first portion.
Other novel features and advantages will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Reference will now be made to the drawings to describe preferred and exemplary embodiments in detail.
The packing case 20 may be made of foam resin. The resin may be high density polyethylene, high density polypropylene, low density polyethylene, low density polypropylene, or another polyolefin material. The foam resin is fabricated by expansion foaming, whereby a size of the finished foam resin is about 3 to 30 times its original size. The forming process may be performed by way of heating up the foam resin with a mold. The process may also be a low pressure foaming process. Various portions of the packing case 20 typically have a thickness in the range from 15 mm to 100 mm.
The main body 25 includes a bottom 212, a first side wall 216, a second side wall 217, a third side wall 218 opposite to the first side wall 216, and a fourth side wall 219 opposite to the second side wall 217. The first, second, third, and fourth side walls 216, 217, 218, 219 are arranged end to end, and perpendicularly extend from the bottom 212. Thereby, the first, second, third, and fourth side walls 216, 217, 218, 219 together with the bottom 212 define a space for receiving the substrates 40. At a top of each of the first, second, third, and fourth side walls 216, 217, 218, 219, an inner portion of the first, second, third, and fourth side walls 216, 217, 218, 219 protrudes up higher than an outer portion of the first, second, third, and fourth side wall 216, 217, 218, 219. Thereby, an inner peripheral protruding rim (not labeled) is formed at the top of the main body 25, with an outer peripheral ledge of the top of the main body 25 surrounding a bottom of the inner peripheral protruding rim. The cover 21 can thereby be fittingly engaged on the top of the main body 25, with a bottom of the cover abutting the ledge of the main body 25, and an inner peripheral wall of the cover abutting the inner peripheral protruding rim of the main body 25.
Each of the first and third side walls 216, 218 includes a plurality of first protrusions 213 formed at an inner surface thereof. At each of the first and third side walls 216, 218, the first protrusions 213 are parallel to each other, separate from each other, and evenly spaced apart. All the first protrusions 213 of the first and third side walls 216, 218 have substantially the same configuration. Each of the first protrusions 213 has a wedge shape, and perpendicularly extends from the inner surface of the first or third side wall 216, 218. The first protrusions 213 of the first side wall 216 are symmetrically opposite the first protrusions 213 of the third side wall 218. Each two adjacent first protrusions 213 together with a corresponding portion of the first side wall 216 or third side wall 218 cooperatively define a first groove 215. The first grooves 215 are oriented perpendicular to the bottom 212 of the main body 25. The first grooves 215 of the first side wall 216 are symmetrically opposite the first grooves 215 of the third side wall 218.
Also referring to
The first portion of the first groove 215 has a width approximately equal to a thickness of the substrate 40. A width of the second portion of the first groove 215 increases with increasing distance away from the third side wall 218.
Also referring to
When a substrate 40 is received in the packing case 20, the substrate 40 is inserted into a groove unit. A side of the substrate 40 that has electronic components and auxiliary circuits contacts the second surfaces 2133 of the first protrusions 215. The other side of the substrate 40 contacts the first surfaces 2131 of the first protrusions 215. Thereby, three edges of the substrate 40 corresponding to the first side wall 216, the third side wall 218, and the bottom 212 are received in a groove unit, as shown in
As detailed above, the first protrusions 213 are provided at the first and third side walls 216, 218, and the second grooves 253 are provided at the bottom 212. The substrate 40 is fastened in the packing case 20, with the corresponding edges thereof being received in the groove unit defined by the first and second grooves 215, 253. Thereby, the substrate 40 is tightly fastened in the packing case 20. In addition, a display area of the substrate 40 is generally arranged in the central portion of the substrate 40. Thus when the substrate 40 is inserted into or taken out of the first and second grooves 215, 253, and when the packing case 20 is undergoing transportation, the display area of the substrate 40 does not contact the packing case 20. Accordingly, the electronic components at the display area of the substrate 40 avoid being damaged by any friction that occurs between the substrate 40 and the packing case 20.
Furthermore, the third surface 2135 of each first protrusion 213 extends in a direction oblique toward the third side wall 218. The width of the second portion of the first groove 215 increases with increasing distance away from the respective first or third side wall 216, 218. Peripheral sides of the substrate 40 around the display area of the substrate 40 are located at the second portions of the first grooves 215. Therefore, when the substrate 40 is inserted into or taken out of the first grooves 215, and when the packing case 20 is undergoing transportation, the auxiliary circuits at the peripheral sides of the substrate 40 avoid being damaged by any friction that occurs between the substrate 40 and the packing case 20.
Various modifications and alterations to the above-described embodiments are possible. For example, the third surface 2135 may be a curved surface, as long as the width of the second portion of the first groove 215 increases along with increasing distance away from the respective first or third side wall 216, 218. In another example, each of the second protrusions 251 may have a wedge shape.
It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 95141783 | Nov 2006 | TW | national |
