PAD CONDITIONERS

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0071653 filed in the Korean Intellectual Property Office on Jun. 2, 2023, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present disclosure relates to pad conditioners. Semiconductor device manufacturing processes may include deposition processes of forming thin film layers on a wafer and etching processes of forming fine circuit patterns on the thin film layers. The processes may be repeated until required circuit patterns are formed on the wafer, and after the circuit patterns are formed, a plurality of curvatures may be formed on surfaces of the wafer. Structures of semiconductor devices have become multilayered due to high integration, and the number of curvatures on surfaces of a wafer and step differences (or height differences) between the curvatures are increasing. However, since non-planarization of surfaces of a wafer may cause problems such as defocus or the like in photolithography processes, periodic polishings may be required to planarize the surfaces of the wafer.

There are various surface planarization techniques to planarize surfaces of a wafer. Among these, chemical mechanical polishing (“CMP”) is a technique that is widely used because wide surfaces, as well as narrow surfaces, may be planarized with good flatness by using CMP. CMP devices may include a carrier head that applies pressure to a polishing pad while supporting a wafer. In addition, CMP devices may include a pad conditioner for constantly managing a state of a polishing pad.

SUMMARY OF THE INVENTION

One aspect of embodiments of the present disclosure is to provide a pad conditioner capable of effectively managing a state of a polishing pad.

However, problems to be solved by the embodiments of the present disclosure are not limited to the above-described problem and may be variously extended in a range of technical ideas included in the present disclosure.

A pad conditioner according to some embodiments may include: a disk holder that is rotatable; a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to vary the thickness of the posture adjusting member according to a signal received from the posture sensor.

A pad conditioner according to some embodiments may include: a disk holder that is rotatable a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; and a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness.

A pad conditioner according to some embodiments may include: a disk holder that is ratable a frame on the disk holder; a lifting and lowering support member between the frame and the disk holder; a plurality of posture adjusting members that are between the lifting and lowering support member and the frame and have thicknesses, wherein the plurality of posture adjusting members are capable of varying the thicknesses; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to change the thicknesses according to a signal received from the posture sensor, wherein the plurality of posture adjusting members are circumferentially spaced apart from each other.

According to the pad conditioner according to the embodiments, a polishing pad may be effectively managed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a chemical mechanical polishing device according to some embodiments.

FIG. 2 is a perspective view showing a pad conditioner of FIG. 1.

FIG. 3 is a partial perspective view illustrating an upper structure of a region in which a conditioning portion is disposed in the pad conditioner.

FIG. 4 is a perspective view from one side of the conditioning portion in which a housing is omitted.

FIG. 5 is a perspective view from the other side of the conditioning portion in which the housing is omitted.

FIG. 6 and FIG. 7 are perspective cross-sectional views of the region in which the conditioning portion is disposed in the pad conditioner.

FIG. 8 is a schematic diagram showing a control relationship of the pad conditioner according to some embodiments.

FIG. 9 is a graph showing a degree of an inclination of a disk holder when the chemical mechanical polishing device operates.

FIG. 10 and FIG. 11 are graphs showing a result of controlling the degree of the inclination of the disk holder through a posture adjusting member.

FIG. 12 is a schematic diagram showing a control relationship of the pad conditioner according to some embodiments.

FIG. 13 is a flowchart illustrating a process in which a controller detects (or senses) an abnormal state of the chemical mechanical polishing device or the pad conditioner.

FIG. 14 is a graph schematically showing a sensing value monitored by the controller.

FIGS. 15 to 17 are graphs illustrating when the abnormal state is detected in the sensing value.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the scope of the present disclosure.

In order to clearly describe the present disclosure, parts or portions that are irrelevant to the description may be omitted, and identical or similar constituent elements throughout the specification are denoted by the same reference numerals unless clearly stated otherwise.

Further, in the drawings, the size and thickness of each element may be arbitrarily illustrated for ease of description, and the present disclosure is not necessarily limited to those illustrated in the drawings. In the drawings, the thicknesses of layers, films, panels, regions, areas, etc., may be exaggerated for clarity. In the drawings, for ease of description, the thicknesses of some layers and areas may be exaggerated.

It will be understood that when an element such as a layer, film, region, area, or substrate is referred to as being “on” or “above” another element, it may be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. Further, in the specification, the word “on” or “above” means disposed on or below the object portion, and does not necessarily mean disposed on the upper side of the object portion based on a gravitational direction.

In addition, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” or “comprising” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.

Further, throughout the specification, the phrase “in a plan view” or “on a plane” means viewing a target portion from the top, and the phrase “in a cross-sectional view” or “on a cross-section” means viewing a cross-section formed by vertically cutting a target portion from the side.

FIG. 1 is a perspective view showing a chemical mechanical polishing device according to some embodiments.

Referring to FIG. 1, a chemical mechanical polishing (“CMP”) device 1 according to some embodiments may include a base 2, a platen 3, a carrier head 5, and a pad conditioner 7.

The base 2 may provide (e.g., constitute) a lower structure of the CMP device 1.

One or more platens 3 may be provided at (e.g., in/on) an upper portion of the base 2. The platen 3 may be rotatably provided using a vertical direction as an axis. The vertical direction may be perpendicular to an upper surface of the base 2. A polishing pad 4 may be disposed on an upper surface of the platen 3 to be supported by the platen 3 so that the polishing pad 4 is rotated together with the platen 3 during a process (e.g., a CMP process). The polishing pad 4 may be provided as a flat plate or a substantially flat plate with a certain thickness. The polishing pad 4 may be a portion that directly contacts a wafer to mechanically polish the wafer and have a rough surface.

The carrier head 5 may be disposed above the platen 3. The carrier head 5 may hold a wafer with a polishing surface facing the polishing pad 4 and press the wafer against the polishing pad 4 during the CMP process.

The CMP device 1 may further include a slurry supply member 6. The slurry supply member 6 may be provided adjacent to the platen 3 in/on the base 2. The slurry supply member 6 may supply a slurry that may include a reaction agent, a wear particle, a chemical reaction catalyst, and the like to a surface of the polishing pad 4.

The pad conditioner 7 may be disposed adjacent to the platen 3. The pad conditioner 7 may be rotatably connected to the base 2. The pad conditioner 7 may maintain a state of the polishing pad 4 so that a wafer is effectively polished while a polishing process (e.g., the CMP process) is being performed.

To generate a sweeping motion, the pad conditioner 7 may be rotated using one end portion of the pad conditioner 7 as an axis. An arm driving member 15 of FIG. 8 may be connected to the one end portion of the pad conditioner 7. The arm driving member 15 may provide power to rotate the pad conditioner 7. The arm driving member 15 may be provided as, for example, a motor or the like. The arm driving member 15 may be disposed at (e.g., in/on) the base 2.

By the sweeping motion, a contact point between the pad conditioner 7 and the polishing pad 4 may be changed.

FIG. 2 is a perspective view showing the pad conditioner of FIG. 1.

Referring to FIG. 2, the pad conditioner 7 may include a connecting hub 10, an arm 11, and a conditioning portion 12.

The connecting hub 10 may be rotatably connected to the base 2. The connecting hub 10 may be rotated with respect to the base 2 using the vertical direction as a rotation axis. The arm driving member 15 may be connected to the connecting hub 10.

The arm 11 may extend from (e.g., be connected to) the connecting hub 10.

The conditioning portion 12 may be connected to the arm 11. The connecting hub 10 may be connected to one end portion of the arm 11, and the conditioning portion 12 may be connected to the other end portion of the arm 11. A housing 13 may be connected to an end portion of the arm 11. The housing 13 may be provided so that a space formed within the housing 13 opens downward (e.g., toward the base 2). At least a portion of the conditioning portion 12 may be disposed inside the housing 13. For example, the housing 13 may extend around at least a portion of the conditioning portion 12.

FIG. 3 is a partial perspective view illustrating an upper structure of a region in which the conditioning portion is disposed in the pad conditioner, FIG. 4 is a perspective view from one side of the conditioning portion in which the housing is omitted, FIG. 5 is a perspective view from the other side of the conditioning portion in which the housing is omitted, and FIG. 6 and FIG. 7 are perspective cross-sectional views of the region in which the conditioning portion is disposed in the pad conditioner.

Referring to FIGS. 3 to 7, the conditioning portion 12 may include a frame 110, a disk holder 130, a rotation driving member 140, a lifting and lowering support member 170, a posture adjusting member 190, and a posture sensor 200. The posture adjusting member 190 may include a first posture adjusting member 190a, a second posture adjusting member 190b, a third posture adjusting member 190c, and/or a fourth posture adjusting member 190d. The first to the fourth posture adjusting members 190a to 190d may be collectively referred to as a plurality of posture adjusting members 190a, 190b, 190c, and 190d or posture adjusting members 190a, 190b, 190c, and 190d. Although four posture adjusting members (the first to the fourth posture adjusting members 190a to 190d) are described, the inventive concepts of the present disclosure are not limited to the number of posture adjusting members. The posture sensor 200 may include a first posture sensor 200a, a second posture sensor 200b, a third posture sensor 200c, and/or a fourth posture sensor 200d. The first to the fourth posture sensors 200a to 200d may be collectively referred to as a plurality of posture sensors 200a, 200b, 200c, and 200d or posture sensors 200a, 200b, 200c, and 200d. Although four posture sensors (the first to the fourth posture sensors 200a to 200d) are described, the inventive concepts of the present disclosure are not limited to the number of posture sensors.

The frame 110 has a predetermined volume. The frame 110 may be connected to the arm 11 by a lifting and lowering driving member 100. Accordingly, the frame 110 may move up and down with respect to the arm 11. For example, the frame 110 may move farther from or closer to the base 2 in the vertical direction.

The lifting and lowering driving member 100 may be provided as a structure in which one end portion of the lifting and lowering driving member 100 is capable of being lifted or lowered relative to the other end portion of the lifting and lowering driving member 100. The one end portion of the lifting and lowering driving member 100 may be fixed to the arm 11, and the other end portion of the lifting and lowering driving member may be connected to the frame 110. As used hereinafter, the term “fixed” may broadly refer to as “connected” or vice versa. A load sensor 120 may be disposed between the other end of the lifting and lowering driving member 100 and the frame 110. The load sensor 120 may detect (or sense) a load (e.g., weight or pressure) applied from the outside. As used hereinafter, the terms “external/outside configuration”, “external/outside device”, “external/outside power”, “external/outside signal”, or “outside” are intended to broadly refer to a device, circuit, block, module, power, and/or signal that resides externally (e.g., outside of a functional or physical boundary) with respect to a given circuit, block, module, system, or device.

The lifting and lowering driving member 100 may include a cylinder 101, a piston 103, and a piston rod 104.

The cylinder 101 may have a reciprocating space 102 formed therein. The cylinder 101 may be fixed to the arm 11.

The piston 103 may be disposed in the reciprocating space 102. The piston 103 may be provided to reciprocate up and down. For example, the piston 103 may move farther from or closer to the base 2 in the vertical direction.

The piston rod 104 may be connected to the piston 103 to extend toward the outside of the cylinder 101. The piston rod 104 may extend upward from the piston 103. The piston rod 104 may be connected to the frame 110. The load sensor 120 may be disposed between the piston rod 104 and the frame 110.

The reciprocating space 102 may be connected to a driving port 106. The driving port 106 may supply a fluid to the reciprocating space 102. The fluid may be a gas, but is not limited thereto. The driving port 106 may include an upper port 106a and a lower port 106b. The upper port 106a may supply the fluid to an upper portion of the reciprocating space 102 so that a force for the piston 103 to move downward is generated. The lower port 106b may supply the fluid to a lower portion of the reciprocating space 102 so that a force for the piston 103 to move upward is generated.

At least some regions of the frame 110 may be disposed in a space formed inside the housing 13. A frame-side guide 117 may be disposed at one side of the frame 110. The frame-side guide 117 may be connected to a housing-side guide 118 disposed inside the housing 13 to be slidable in the vertical direction. The frame-side guide 117 and the housing-side guide 118 may be disposed to face the lifting and lowering driving member 100 with respect to an inner central region of the housing 13. For example, the guides, including frame-side guide 117 and the housing-side guide 118, and the lifting and lowering driving member 100 may be disposed on opposite sides of the inner central region of the housing 13.

The frame 110 may include a fastening frame portion 111 and a main frame portion 112.

The fastening frame portion 111 may be connected to the arm 11. The lifting and lowering driving member 100 may be disposed between the fastening frame portion 111 and the arm 11. The piston rod 104 of the lifting and lowering driving member 100 may be connected to the fastening frame portion 111.

The load sensor 120 may be disposed between the lifting and lowering driving member 100 and the fastening frame portion 111. The fastening frame portion 111 may have a predetermined length in the vertical direction.

The main frame portion 112 may be connected to the fastening frame portion 111. The main frame portion 112 may be connected to a lower portion of the fastening frame portion 111. The main frame portion 112 may include a connection space 114 vertically penetrating an inner central region thereof. The frame-side guide 117 may be disposed at one side of the main frame portion 112.

The disk holder 130 may be rotatably disposed below the frame 110. A conditioning disk 130a may be connected to a lower surface of the disk holder 130. For example, the disk holder 130 may be between the frame 110 and the conditioning disk 130a. The conditioning disk 130a may be attached to or detached from the disk holder 130. For example, the disk holder 130 may be capable of attaching or detaching the conditioning disk 130a.

A rotation driving member 140 may be connected to the disk holder 130 to provide power for rotating the disk holder 130. The rotation driving member 140 may include a motor or the like. The rotation driving member 140 may be disposed on/above the disk holder 130. The rotation driving member 140 may be fixed to the frame 110. The rotation driving member 140 may be fixed to an upper portion of the main frame portion 112.

A driving connecting member 150 may be disposed between the rotation driving member 140 and the disk holder 130. The driving connecting member 150 may transfer power of the rotation driving member 140 to the disk holder 130. An upper portion of the driving connecting member 150 may be connected to the rotation driving member 140, and a lower portion of the driving connecting member 150 may be connected to the disk holder 130. The upper and lower portions of the driving connecting member 150 may be relatively rotated on an axis in a direction intersecting (e.g., crossing) the vertical direction. Accordingly, the disk holder 130 may be inclined in an inclined direction with respect to the vertical direction. For example, the driving connecting member 150 may be provided as a cross-joint coupling or the like so that an upper end portion of the driving connecting member 150 is connected to the rotation driving member 140 and a lower end portion of the driving connecting member 150 is connected to the disk holder 130.

A driving connecting portion 131 may be formed at an upper central region of the disk holder 130. The driving connecting portion 131 may extend upwardly in the vertical direction. A portion of the driving connecting portion 131 may be disposed (e.g., inserted) in the connection space 114 formed at the inner central region of the main frame portion 112. The driving connecting portion 131 may be connected to the rotation driving member 140. The driving connecting member 150 may be disposed between the driving connecting portion 131 and the rotation driving member 140.

An inner side rotation auxiliary member 160 may be disposed between the disk holder 130 and the frame 110. The inner side rotation auxiliary member 160 may be disposed between an outer side surface of the driving connecting portion 131 and a lower portion of the frame 110. An upper portion of the driving connecting portion 131 may be connected to a lower portion of the driving connecting member 150, and the rotation driving member 140 may be connected to an upper portion of the driving connecting member 150.

A lower end portion 113 of the main frame portion 112 may be provided as a ring structure to extend around (e.g., surround) an outer side surface (e.g., an outer circumference) of the driving connecting portion 131. An inner side surface of the lower end portion 113 of the main frame portion 112 may be spaced apart from the outer side surface of the driving connecting portion 131.

The inner side rotation auxiliary member 160 may be disposed between the outer side surface of the driving connecting portion 131 and the inner side surface of the lower end portion 113 of the main frame portion 112.

A lower portion of the driving connecting portion 131 may be connected to the inner side rotation auxiliary member 160, and an upper portion of the driving connecting portion 131 may be connected to the rotation driving member 140.

The inner side rotation auxiliary member 160 may allow (e.g., assist) the disk holder 130 to rotate with respect to the frame 110. For example, the inner side rotation auxiliary member 160 may be provided as a bearing structure. An inner race 161 of the inner side rotation auxiliary member 160 may be connected to an upper portion of the disk holder 130. The inner race 161 of the inner side rotation auxiliary member 160 may be connected to the outer side surface of the driving connecting portion 131. The inner race 161 of the inner side rotation auxiliary member 160 may be connected to a lower portion of the outer side surface of the driving connecting portion 131.

An outer race 162 of the inner side rotation auxiliary member 160 may be connected to a lower portion of the frame 110. For example, the outer race 162 of the inner side rotation auxiliary member 160 may be connected to the main frame portion 112. The outer race 162 of the inner side rotation auxiliary member 160 may be connected to the inner side surface of the lower end portion 113 of the main frame portion 112.

The inner side rotation auxiliary member 160 may be provided as a ball bearing or the like. The inner race 161 of the inner side rotation auxiliary member 160 may be provided to be biased with respect to the outer race 162 of the inner side rotation auxiliary member 160. For example, the inner side rotation auxiliary member 160 may be provided as a self-aligning ball bearing. Accordingly, the inner side rotation auxiliary member 160 may allow the disk holder 130 to be tilted with respect to the frame 110.

The lifting and lowering support member 170 may be disposed between one side of the frame 110 and one upper side of the disk holder 130. The lifting and lowering support member 170 may be disposed above an outer region of the disk holder 130. The lifting and lowering support member 170 may be provided as a ring structure. The driving connecting portion 131 may be disposed to be, at least partially, inserted into the lifting and lowering support member 170.

The lifting and lowering support member 170 may include an upper fastening portion 171, an outer race fastening portion 172, and a cover portion 173.

The upper fastening portion 171 may be disposed at an upper region of the lifting and lowering support member 170. The outer race fastening portion 172 may be disposed at a lower region of the lifting and lowering support member 170. The upper fastening portion 171 may be disposed on the outer race fastening portion 172. The cover portion 173 may be disposed at an outer circumference of the outer race fastening portion 172. The cover portion 173 may reduce (e.g., prevent) a foreign substance from being introduced into the lifting and lowering support member 170.

A rotation connecting portion 132 may be formed at/on an upper portion of the disk holder 130. The rotation connecting portion 132 may be disposed at a predetermined distance in an outer side direction from an upper center portion (e.g., upper center) of the disk holder 130. The rotation connecting portion 132 may be provided as a ring shape. An inner side surface of the rotation connecting portion 132 may be disposed to be spaced apart from the driving connecting portion 131. An insertion space 133 may be formed between the inner side surface of the rotation connecting portion 132 and the outer side surface of the driving connecting portion 131. The lower end portion 113 of the main frame portion 112 may be disposed in the insertion space 133.

The rotation connecting portion 132 may be disposed to be, at least partially, inserted into the lifting and lowering support member 170. Accordingly, an outer side surface of the rotation connecting portion 132 may face an inner side surface of the lifting and lowering support member 170.

An outer side rotation auxiliary member 180 may be disposed between the disk holder 130 and the lifting and lowering support member 170. The outer side rotation auxiliary member 180 may be disposed between the outer side surface of the rotation connecting portion 132 and the inner side surface of the lifting and lowering support member 170. The outer side rotation auxiliary member 180 may allow (e.g., assist) the disk holder 130 to rotate with respect to the lifting and lowering support member 170. The outer side rotation auxiliary member 180 may transfer a force generated according to a vertical movement of the lifting and lowering support member 170 to the disk holder 130. The outer side rotation auxiliary member 180 may be provided as a bearing structure. An inner race 181 of the outer side rotation auxiliary member 180 may be fixed to an upper portion of the disk holder 130. The inner race 181 of the outer side rotation auxiliary member 180 may be fixed to the outer side surface of the rotation connecting portion 132. An outer race 182 of the outer side rotation auxiliary member 180 may be fixed to the lifting and lowering support member 170. The outer race 182 of the outer side rotation auxiliary member 180 may be fixed to the inner side surface of the lifting and lowering support member 170. The outer race 182 of the outer side rotation auxiliary member 180 may be fixed to the outer race fastening portion 172. In addition, the outer side rotation auxiliary member 180 may be provided to contact the upper fastening portion 171 so that it exchanges force with the upper fastening portion 171.

The outer side rotation auxiliary member 180 may be provided as a ball bearing or the like. For example, the outer side rotation auxiliary member 180 may be provided as a deep groove ball bearing. Accordingly, the outer side rotation auxiliary member 180 may effectively support a thrust load and may effectively transfer a load between the disk holder 130 and the lifting and lowering support member 170.

The posture adjusting member 190 may connect the lifting and lowering support member 170 to the frame 110. The posture adjusting member 190 may be disposed between the lifting and lowering support member 170 and one side of the main frame portion 112. A lower portion of the posture adjusting member 190 may be fixed to an upper portion of the lifting and lowering support member 170. The lower portion of the posture adjusting member 190 may be fixed to the upper fastening portion 171. An upper portion of the posture adjusting member 190 may be fixed to the one side of the main frame portion 112. The posture adjusting member 190 may be provided to have a variable thickness in the vertical direction. For example, the posture adjusting member 190 may be provided as an air bag structure, so that the thickness in the vertical direction may be adjusted according to an amount of a gas filled inside (e.g., contained within) the air bag structure. A connecting port 195 may be provided at one side of the posture adjusting member 190. The connecting port 195 may provide a path through which a gas is introduced into the posture adjusting member 190 or through which a gas inside the posture adjusting member 190 is discharged to the outside thereof.

When a thickness of the posture adjusting member 190 is adjusted, a vertical height of the lifting and lowering support member 170 may be changed at a region disposed below the posture adjusting member 190. For example, the vertical height of the lifting and lowering support member 170 may be changed at a region on which a thickness of at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190d changes. As used herein, the term “height” or “up” and “down” may refer to a distance from the base 2 in the vertical direction. For example, if an element A is higher (or upper) than an element B may be interpreted as the element A is farther than the element B from the base 2 in the vertical direction. On the other hand, if the element is lower than the element B may be interpreted as the element A is closer than the element B to the base 2 in the vertical direction. The plurality of posture adjusting members 190a, 190b, 190c, and 190d may be provided to be disposed to be spaced apart from each other along a circumferential direction. The plurality of posture adjusting members 190a, 190b, 190c, and 190d may be circumferentially spaced apart from each other. Distances at which the plurality of posture adjusting members 190a, 190b, 190c, and 190d are spaced apart from each other along the circumferential direction may correspond to each other. Thicknesses of the plurality of posture adjusting members 190a, 190b, 190c, and 190d in the vertical direction may be individually adjusted. When the posture adjusting member 190 has the air bag structure, each of the plurality of posture adjusting members 190a, 190b, 190c, and 190d may individually include the connecting port 195.

The posture adjusting members 190a, 190b, 190c, and 190d may include the first posture adjusting member 190a, the second posture adjusting member 190b, the third posture adjusting member 190c, and the fourth posture adjusting member 190d.

The first posture adjusting member 190a, the second posture adjusting member 190b, the third posture adjusting member 190c, and the fourth posture adjusting member 190d may be sequentially disposed along the circumferential direction. The first posture adjusting member 190a may be disposed to face the third posture adjusting member 190c with a central region of the circumferential direction interposed therebetween. The first posture adjusting member 190a and the third posture adjusting member 190c may be diametrically opposed to each other. The second posture adjusting member 190b may be disposed to face the fourth posture adjusting member 190d with the central region of the circumferential direction interposed therebetween. The second posture adjusting member 190b and the fourth posture adjusting member 190d may be diametrically opposed to each other.

The posture sensor 200 may detect (or senses) a vertical height of the lifting and lowering support member 170. The posture sensor 200 may be fixed to the frame 110. The posture sensor 200 may be fixed to the main frame portion 112. The plurality of posture sensors 200a, 200b, 200c, and 200d may be provided. The plurality of posture sensors 200a, 200b, 200c, and 200d may be disposed to be spaced apart from each other along a circumferential direction. The plurality of posture sensors 200a, 200b, 200c, and 200d may be circumferentially spaced apart from each other. The number of posture sensors 200a, 200b, 200c, and 200d may correspond to the number of posture adjusting members 190a, 190b, 190c, and 190d.

The posture sensors 200a, 200b, 200c, and 200d may include the first posture sensor 200a, the second posture sensor 200b, the third posture sensor 200c, and the fourth posture sensor 200d.

The first posture sensor 200a, the second posture sensor 200b, the third posture sensor 200c, and the fourth posture sensor 200d may be disposed to be spaced apart from each other along the circumferential direction. The first posture sensor 200a, the second posture sensor 200b, the third posture sensor 200c, and the fourth posture sensor 200d may detect (or sense) vertical heights of different regions of the lifting and lowering support member 170.

The first posture sensor 200a may detect the vertical height of the lifting and lowering support member 170 disposed at a region below the first posture adjusting member 190a. A first sensing auxiliary member 210a may be connected to one side of the lifting and lowering support member 170. The first sensing auxiliary member 210a may be connected to the upper fastening portion 171. The first sensing auxiliary member 210a may have a lower end portion connected to the lifting and lowering support member 170 and may extend upward. The lower end portion of the first sensing auxiliary member 210a may be fixed to the lifting and lowering support member 170 at a region adjacent to a region to which the first posture adjusting member 190a is fixed. For example, the lower end portion of the first sensing auxiliary member 210a and the first posture adjusting member 190a may be disposed to face each other along a radial direction with respect to a circumference where the plurality of posture adjusting members 190a, 190b, 190c, and 190d are disposed. An upper end portion of the first sensing auxiliary member 210a may be disposed to face the first posture sensor 200a. The first posture sensor 200a may detect the upper end portion of the first sensing auxiliary member 210a to detect a vertical height of the first sensing auxiliary member 210a so that, through the vertical height of the first sensing auxiliary member 210a, the first posture sensor 200a may detect a vertical height of a region of the lifting and lowering support member 170, to which the lower end portion of the first sensing auxiliary member 210a is fixed.

The second posture sensor 200b may detect the vertical height of the lifting and lowering support member 170 disposed at a region below the second posture adjusting member 190b. A second sensing auxiliary member 210b may be connected to one side of the lifting and lowering support member 170. The second sensing auxiliary member 210b may be connected to the upper fastening portion 171. The second sensing auxiliary member 210b may have a lower end portion connected to the lifting and lowering support member 170 and may extend upward. The lower end portion of the second sensing auxiliary member 210b may be fixed to the lifting and lowering support member 170 at a region adjacent to a region to which the second posture adjusting member 190b is fixed. For example, the lower end portion of the second sensing auxiliary member 210b and the second posture adjusting member 190b may be disposed to face each other along the radial direction with respect to the circumference where the plurality of posture adjusting members 190a, 190b, 190c, and 190d are disposed. An upper end portion of the second sensing auxiliary member 210b may be disposed to face the second posture sensor 200b. The second posture sensor 200b may detect the upper end portion of the second sensing auxiliary member 210b to detect a vertical height of the second sensing auxiliary member 210b so that, through the vertical height of the second sensing auxiliary member 210b, the second posture sensor 200b may detect a vertical height of a region of the lifting and lowering support member 170, to which the lower end portion of the second sensing auxiliary member 210b is fixed.

The third posture sensor 200c may detect the vertical height of the lifting and lowering support member 170 disposed at a region below the third posture adjusting member 190c. A third sensing auxiliary member 210c may be connected to one side of the lifting and lowering support member 170. The third sensing auxiliary member 210c may be connected to the upper fastening portion 171. The third sensing auxiliary member 210c may have a lower end portion connected to the lifting and lowering support member 170 and may extend upward. The lower end portion of the third sensing auxiliary member 210c may be fixed to the lifting and lowering support member 170 at a region adjacent to a region to which the third posture adjusting member 190c is fixed. For example, the lower end portion of the third sensing auxiliary member 210c and the third posture adjusting member 190c may be disposed to face each other along the radial direction with respect to the circumference where the plurality of posture adjusting members 190a, 190b, 190c, and 190d are disposed. An upper end portion of the third sensing auxiliary member 210c may be disposed to face the third posture sensor 200c. The third posture sensor 200c may detect the upper end portion of the third sensing auxiliary member 210c to detect a vertical height of the third sensing auxiliary member 210c so that, through the vertical height of the third sensing auxiliary member 210c, the third posture sensor 200c may detect a vertical height of a region of the lifting and lowering support member 170, to which the lower end portion of the third sensing auxiliary member 210c is fixed.

The fourth posture sensor 200d may detect the vertical height of the lifting and lowering support member 170 disposed at a region below the fourth posture adjusting member 190d. A fourth sensing auxiliary member 210d may be connected to one side of the lifting and lowering support member 170. The fourth sensing auxiliary member 210d may be connected to the upper fastening portion 171. The fourth sensing auxiliary member 210d may have a lower end portion connected to the lifting and lowering support member 170 and may extend upward. The lower end portion of the fourth sensing auxiliary member 210d may be fixed to the lifting and lowering support member 170 at a region adjacent to a region to which the fourth posture adjusting member 190d is fixed. For example, the lower end portion of the fourth sensing auxiliary member 210d and the fourth posture adjusting member 190d may be disposed to face each other along the radial direction with respect to the circumference where the plurality of posture adjusting members 190a, 190b, 190c, and 190d are disposed. An upper end portion of the fourth sensing auxiliary member 210d may be disposed to face the fourth posture sensor 200d. The fourth posture sensor 200d may detect the upper end portion of the fourth sensing auxiliary member 210d to detect a vertical height of the fourth sensing auxiliary member 210d so that, through the vertical height of the fourth sensing auxiliary member 210d, the fourth posture sensor 200d may detect a vertical height of a region of the lifting and lowering support member 170, to which the lower end portion of the fourth sensing auxiliary member 210d is fixed.

The lifting and lowering driving member 100 may be connected to a gas control member 230. The gas control member 230 may be connected to the connecting port 195 of the lifting and lowering driving member 100 to supply a gas. The gas control member 230 may be connected to the upper port 106a and the lower port 106b, respectively, so that an amount of a gas supplied to each of the upper port 106a and the lower port 106b is adjusted. When the gas is supplied to the lower port 106b, the piston 103 may be forced upward. Accordingly, the conditioning portion 12 may be moved upward relative to the arm 11, or a load on which the conditioning portion 12 presses the polishing pad 4 may be reduced.

When the gas is supplied to the upper port 106a, the piston 103 may be forced downward. Accordingly, the conditioning portion 12 may be moved downward relative to the arm 11, or the load on which the conditioning portion 12 presses the polishing pad 4 may be increased.

The posture adjusting member 190 may be connected to the gas control member 230. The gas control member 230 may be connected to the driving port 106 to adjust an amount of a gas filled inside (e.g., contained within) the posture adjusting member 190. The gas control member 230 may be connected to driving ports 106 of the first posture adjusting member 190a, the second posture adjusting member 190b, the third posture adjusting member 190c, and the fourth posture adjusting member 190d. Accordingly, the amounts of the gases filled inside (e.g., contained within) the posture adjusting members 190a, 190b, 190c, and 190d may be individually adjusted, so that the thicknesses of the posture adjusting members 190a, 190b, 190c, and 190d in the vertical direction are individually adjusted.

The gas control member 230 may be provided to adjust on/off of a gas supply, a gas supply amount, a gas discharge amount, or the like. The gas control member 230 may be provided as a valve or the like. For example, the gas control member 230 may be provided as a piezo valve, so that a response speed to a control signal is quicker than conventional valves. The gas control member 230 may be disposed at one side of the pad conditioner 7. The gas control member 230 may be disposed at one side of (e.g., adjacent) the arm 11. For example, the gas control member 230 may be disposed to be buried inside the arm 11. Accordingly, a distance between the gas control member 230 and the lifting and lowering driving member 100 and a distance between the gas control member 230 and the posture adjusting member 190 may be shortened. In addition, response of the lifting and lowering driving member 100 or the posture adjusting member 190 according to an operation of the gas control member 230 may be quickened.

FIG. 8 is a schematic diagram showing a control relationship of the pad conditioner according to some embodiments.

Referring to FIGS. 1 to 8, the controller 16 may control an operating state of the pad conditioner 7.

The controller 16 may receive a signal from the load sensor 120 to detect (or sense) a load acting between the lifting and lowering driving member 100 and the pad conditioner 7. In addition, the controller 16 may detect a load applied by the pad conditioner 7 to the platen 3 and/or the polishing pad 4 through the load detected by the load sensor 120.

The controller 16 may receive a signal from the posture sensor 200 (e.g., the plurality of posture sensors 200a, 200b, 200c, and 200d) to detect (or sense) an inclination of a lower portion of the pad conditioner 7. For example, the controller 16 may receive a signal from each of the plurality of posture sensors 200a, 200b, 200c, and 200d to detect (or sense) a vertical height of each region of the lifting and lowering support member 170. The lifting and lowering support member 170 may be provided to move up and down together with an outer side region of the disk holder 130. Therefore, the vertical height of a region (e.g., each region) of the lifting and lowering support member 170 may correspond to a vertical height of a region (e.g., each region) of the outer side region of the disk holder 130. Accordingly, the controller 16 may detect (or sense) a vertical height of a region (e.g., each region) of the disk holder 130 through a signal detected by the posture sensor 200 (e.g., the plurality of the posture sensors 200a, 200b, 200c, and 200d). The controller 16 may detect (or sense) a tilted direction or a tilted angle of the disk holder 130, a height at which one side of the disk holder 130 is spaced upward from an upper surface of the polishing pad 4, or the like through the vertical height of each region of the disk holder 130.

Regions measured by the first posture sensor 200a and the third posture sensor 200c in the lifting and lowering support member 170 may be disposed to face each other with respect to a central region of the lifting and lowering support member 170. Regions measured by the second posture sensor 200b and the fourth posture sensor 200d in the lifting and lowering support member 170 may be disposed to face each other with respect to the central region of the lifting and lowering support member 170. Accordingly, the controller 16 may detect inclinations of the lifting and lowering support member 170 and the disk holder 130 more effectively.

The controller 16 may control an operating state of the lifting and lowering driving member 100 through control of the gas control member 230. Accordingly, the controller 16 may adjust the load applied by the pad conditioner 7 to the platen 3 and/or the polishing pad 4. In addition, the controller 16 may perform control so that a signal sensed by the load sensor 120 and control of the lifting and lowering driving member 100 form a closed-loop control. Accordingly, the controller 16 may perform control so that the load applied by the pad conditioner 7 to the platen 3 and/or the polishing pad 4 converges to a target value. In this case, the target value of the load applied by the pad conditioner 7 may be adjusted by a user.

The controller 16 may control an operating state of the posture adjusting member 190 (e.g., the plurality of posture adjusting members 190a, 190b, 190c, and 190d) through control of the gas control member 230. Accordingly, the controller 16 may adjust the height of a region (e.g., each region) of the lifting and lowering support member 170 and the height of a region (e.g., each region) of the disk holder 130. In addition, the controller 16 may adjust the height of a region (e.g., each region) of the lifting and lowering support member 170 and the height of a region (e.g., each region) of the disk holder 130 so that a lower surface of the disk holder 130 is adjusted parallel to an upper surface of the platen 3 and/or an upper surface of the polishing pad 4.

Specifically, the controller 16 may allow a gas to be supplied to the posture adjusting member 190 (e.g., at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190d) so that the gas increases the thickness of the 190. Accordingly, a region (e.g., at least one of the regions) of the lifting and lowering support member 170 and a region (e.g., at least one of the regions) of the disk holder 130 disposed below the posture adjusting member 190 to which the gas is supplied, may be moved downward. In addition, the controller 16 may allow a gas to be discharged from the posture adjusting member 190 (e.g., at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190d) so that the gas reduces thickness of the posture adjusting member 190 from which the gas is discharged. Accordingly, a region (e.g., at least one of the regions) of the lifting and lowering support member 170 and a region (e.g., at least one of the regions) of the disk holder 130 disposed below the posture adjusting member 190 from which the gas is discharged, may be moved upward.

The controller 16 may increase or decrease an internal pressure of the posture adjusting member 190 (e.g., at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190c) so that a thickness of the posture adjusting member 190 is adjusted. Specifically, when the process progresses, a mutual force may act between the pad conditioner 7 and the polishing pad 4. Accordingly, in a region at which the posture adjusting member 190 (e.g., at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190d) having the decreased internal pressure is disposed, the disk holder 130 and the lifting and lowering support member 170 move upward by a force applied by the polishing pad 4 to the pad conditioner 7, and a thickness of the posture adjusting member 190 may be reduced.

On the other hand, in a region at which the posture adjusting member 190 (e.g., at least one of the plurality of posture adjusting members 190a, 190b, 190c, and 190d) having the increased internal pressure is disposed, the disk holder 130 and the lifting and lowering support member 170 may move downward as a thickness of the posture adjusting member 190 is increased.

In this case, increase or decrease of the internal pressure of the posture adjusting member 190 may be made based on a reference pressure. The reference pressure may be set to an atmospheric pressure or the like.

In addition, the controller 16 may perform control so that a signal sensed by the posture sensor 200 and control of the posture adjusting member 190 form a closed-loop control. Accordingly, when the controller 16 senses inclinations of the lifting and lowering support member 170 and the disk holder 130 through the posture sensor 200, the controller 16 may operate the posture adjusting member 190 so that the lower surface of the disk holder 130 is adjusted parallel to the upper surface of the platen 3 and the upper surface of the polishing pad 4. In addition, the lower end portion of each of the sensing auxiliary members 210a, 210b, 210c, and 210d may be disposed adjacent to each of the posture adjusting members 190a, 190b, 190c, and 190d. That is, the signal sensed by each of the posture sensors 200a, 200b, 200c, and 200d and control of each of the posture adjusting members 190a, 190b, 190c, and 190d may be matched with each other.

When the controller 16 controls the posture adjusting member 190, the controller 16 may reverse gas supply states (e.g., supplying and discharging) for two posture adjusting members (e.g., the first and third posture adjusting members 190a and 190c or the second and fourth posture adjusting members 190b and 190d) disposed facing each other with respect to a central region (e.g., a center) of a circumference on which the posture adjusting members 190a, 190b, 190c, and 190d are disposed.

That is, the controller 16 may increase an internal pressure of one of the two posture adjusting members facing each other with respect to the central region (e.g., center) of the circumference and may decrease an internal pressure of the other of the two posture adjusting members. Accordingly, a posture of each of the lifting and lowering support member 170 and the disk holder 130 may be adjusted in such a way that one of two regions of each of the lifting and lowering support member 170 and the disk holder 130 facing each other descends and the other of the two regions ascends with respect to an inner central region. For example, the controller 16 may increase an internal pressure of one of the first posture adjusting member 190a and the third posture adjusting member 190c and may decrease an internal pressure of the other of the first posture adjusting member 190a and the third posture adjusting member 190c. In some embodiments, the controller 16 may perform control in such a manner that an internal pressure of one of the second posture adjusting member 190b and the fourth posture adjusting member 190d is increased and an internal pressure of the other of the second posture adjusting member 190b and the fourth posture adjusting member 190d is decreased. Accordingly, an excessive increase or decrease in the internal pressure of the posture adjusting member 190 may be improved (e.g., prevented), and a posture of the disk holder 130 may be adjusted more quickly. In addition, since the internal pressure of the posture adjusting member 190 maintains a certain range, an influence of posture adjustment of the disk holder 130 on a load applied downward by the pad conditioner 7 may be reduced (e.g., minimized). In addition, the gas supply states for the two posture adjusting members disposed facing each other (e.g., the first and third posture adjusting members 190a and 190c or the second and fourth posture adjusting members 190b and 190d) may be reversed so that a sum of the internal pressures of the posture adjustment members may maintain a predetermined range. Accordingly, the influence of the posture adjustment of the disk holder 130 on the load applied downward by the pad conditioner 7 may be reduced (e.g., minimized).

The controller 16 may operate the rotation driving member 140 to rotate the disk holder 130.

The controller 16 may operate the arm drive member 15 so that the pad conditioner 7 rotates with respect to the base 2. Accordingly, a sweeping motion may be generated.

FIG. 9 is a graph showing a degree of an inclination of the disk holder when the chemical mechanical polishing device operates.

In FIG. 9, Case 1 indicates the degree of the inclination of the disk holder 130 when only the disk holder 130 is rotated, Case 2 indicates the degree of the inclination of the disk holder 130 when the platen 3 and the polishing pad 4 are rotated while the disk holder 130 is rotated, and Case 3 indicates the degree of the inclination of the disk holder 130 when the pad conditioner 7 is rotated with respect to the base 2 while the disk holder 130 is rotated and the platen 3 and the polishing pad 4 are rotated.

Referring to FIG. 9, it may be seen that in Case 3, the inclination of the disk holder 130 changes more irregularly than in Case 1 and Case 2. This is because a position of the conditioning portion 12 with respect to the polishing pad 4 may be changed according to rotation of the pad conditioner 7. That is, when a position of the conditioning portion 12 with respect to a central region (e.g., center) of the polishing pad 4 is changed, a force pressed on the disk holder 130 by the rotating polishing pad 4 may be changed in size and direction together. Accordingly, the disk holder 130 may be tilted irregularly.

FIG. 10 and FIG. 11 are graphs showing a result of controlling the degree of the inclination of the disk holder (e.g., the disk holder 130) through the posture adjusting member.

FIG. 10 shows a measured value of the inclination in one direction intersecting (e.g., crossing) the vertical direction, and FIG. 11 shows a measured value of the inclination in a direction intersecting (e.g., crossing) the vertical direction and the measurement direction of FIG. 10.

The measured values of FIGS. 10 and 11 are measured in a state in which the pad conditioner 7 is rotated with respect to the base 2 while the disk holder 130 is rotated and the platen 3 and the polishing pad 4 are rotated.

In FIG. 10 and FIG. 11, “Control off” refers to adjusting the degree of the inclination of the disk holder 130 in a state in which the closed-loop control is turned off. That is, “Control off” is a result of adjusting a posture of the disk holder 130 in a state where the controller 16 is set so that an internal pressure of the posture adjusting member 190 (e.g., the plurality of posture adjusting members 190a, 190b, 190c, and 190d) is changed according to a predetermined control value. “Control on” is a result of adjusting a posture of the disk holder 130 in a state where the closed-loop control is turned on so that the signal sensed by the posture sensor 200 (e.g., the plurality of posture sensors 200a, 200b, 200c, and 200d) and the control of the posture adjusting member 190 (e.g., the plurality of posture adjusting members 190a, 190b, 190c, and 190d) form the closed-loop control.

Referring to FIG. 10 and FIG. 11, it may be confirmed that in a state of “Control on”, the inclination of the disk holder 130 converges within a certain range (smaller than a range of the inclination in the state of “Control off”).

According to the pad conditioner 7 according to some embodiments, inclinations of the disk holder 130 and the conditioning disk 130a may be reduced (e.g., minimized) during the process.

In addition, as the inclinations of the disk holder 130 and the conditioning disk 130a are reduced (e.g., minimized), use life spans of the polishing pad 4 and the conditioning disk 130a may be increased. Specifically, when a load pressed on the polishing pad 4 by the pad conditioner 7 is increased, the inclination of the disk holder 130 may be reduced. However, an increase in the load pressed on the polishing pad 4 by the pad conditioner 7 may increase wear speed of the polishing pad 4. The increase in the wear speed of the polishing pad 4 may cause a decrease in lifespan of the polishing pad 4. According to some embodiments of the present disclosure, on the other hand, even if the load pressed on the polishing pad 4 by the pad conditioner 7 is reduced, the inclination of the disk holder 130 may be reduced. Accordingly, the load pressed on the polishing pad 4 by the pad conditioner 7 may be adjusted as a reduced (e.g., minimum) load value required for the conditioning disk 130a to maintain a state of the polishing pad 4 (e.g., to extend the use life span of the polishing pad 4).

FIG. 12 is a schematic diagram showing a control relationship of the pad conditioner according to some embodiments.

Referring to FIG. 12, the controller 16 may control a lifting and lowering driving member 300 without going through a gas control member 231. For example, the lifting and lowering driving member 300 may be provided as a linear motor, a motor, or the like.

The gas control member 231 may be connected to the posture adjusting member 190 (e.g., the plurality of posture adjusting members 190a, 190b, 190c, and 190d). The controller 16 may control the posture adjusting member 190 through the gas control member 231.

A method of controlling the posture adjusting member 190 by the controller 16 through the gas control member 231, a method of controlling the rotation driving member 140 by the controller 16, and a method of controlling the arm driving member 15 by the controller 16 may be the same as or similar to those described above with reference to FIG. 8, so that a repeated description thereof is omitted.

FIG. 13 is a flowchart illustrating a process in which the controller detects (or senses) an abnormal state of the chemical mechanical polishing device or the pad conditioner, and FIG. 14 is a graph schematically showing a sensing value monitored by the controller.

Referring to FIGS. 13 and 14, the controller 16 may monitor a sensing value detected (or sensed) by a sensor (e.g., at least one among the load sensor 120 and the posture sensors 200a, 200b, 200c, and 200d) (S10). The sensor may include the load sensor 120, the posture sensor 200, or the like. Specifically, the controller 16 may extract a vibration signal from a signal detected by the sensor. The vibration signal has a frequency. Accordingly, the controller 16 may measure the signal detected by the sensor according to a frequency. In addition, the controller 16 may measure and monitor a size of the signal detected by the sensor according to the frequency. Fourier transform may be used to measure the detected signal according to the frequency. Accordingly, an operating frequency (e.g., a first operating frequency fw1 or a second operating frequency fw2) and a size of the operating frequency are detected as the sensing value monitored by the controller 16. The operating frequency may correspond to a vibration generated from a constituent element itself of the CMP device 1 and/or the pad conditioner 7 while the CMP device 1 and/or the pad conditioner 7 operates. In some embodiments, the operating frequency may be a frequency of the vibration generated during an operation of a configuration providing power required for the operation of the CMP device 1 or the pad conditioner 7.

For example, the first operating frequency fw1 may be a frequency of a vibration generated while the arm driving member 15 operates. The first operating frequency fw1 may correspond to an RPM value of the arm driving member 15. The second operating frequency fw2 may be a frequency of a vibration generated while the rotation driving member 140 operates. The second operating frequency fw2 may correspond to an RPM value of the rotation driving member 140.

An interval excluding the operating frequency from the sensing value may have a noise generated by mutual friction between constituent elements of the CMP device 1 and/or the pad conditioner 7 during the operation of the CMP device 1 and/or the pad conditioner 7.

The controller 16 may determine whether an abnormal state detection signal is generated from the sensing value (S20).

FIGS. 15 to 17 are graphs illustrating when the abnormal state is detected in the sensing value.

FIG. 15 is the graph showing when an abnormal state is detected at the operating frequency.

FIG. 16 is the graph showing when an abnormal state is detected at a noise frequency.

FIG. 17 is the graph showing when an abnormal state is detected at a high frequency noise frequency.

Referring to FIGS. 15 to 17, the controller 16 may determine whether the abnormal state detection signal is generated from the monitored sensing value. The abnormal state detection signal may be a change in a size of the signal according to the frequency.

The abnormal state detection signal may be a change in a signal size of the operating frequency (e.g., the first operating frequency fw1 or the second operating frequency fw2). If a size of the first or second operating frequency fw1 or fw2 is out of a range between a first or second operating frequency upper limit value Bu2 or Bu1 and/or a first or second operating frequency lower limit value Bd2 or Bd1, the controller 16 may determine this as the abnormal state detection signal. In the first and second operating frequencies fw1 and fw2, the first and second operating frequency upper limit values Bu2 and Bu1 and the first and second operating frequency lower limit values Bd2 and Bd1 may be individually set. Specifically, the controller 16 may set the first operating frequency upper limit value Bu1 and the first operating frequency lower limit value Bd1 with respect to the first operating frequency fw1. In addition, if the first operating frequency fw1 is out of the range between the first operating frequency upper limit value Bu1 and the first operating frequency lower limit value Bd1, the controller 16 may determine this as the abnormal state detection signal.

The controller 16 may set the second operating frequency upper limit value Bu2 and the second operating frequency lower limit value Bd2 with respect to the second operating frequency fw2. In addition, if the second operating frequency fw2 is out of the range between the second operating frequency upper limit value Bu2 and the second operating frequency limit lower value Bd2, the controller 16 may determine this as the abnormal state detection signal.

The abnormal state detection signal generated at the first or second operating frequency fw1 or fw2 may be caused by a decrease in output, a damage, or another problem due to aging of the configuration providing power required for the operation of the CMP device 1 and/or the pad conditioner 7.

In addition, the abnormal state detection signal may be a signal in which a size of a frequency included in a noise band is equal to or greater than a malfunction upper limit value mf. The controller 16 may set a frequency band other than the first or second operating frequency fw1 or fw2 as the noise band. In addition, if a size of a noise frequency fn included in the noise band exceeds the malfunction upper limit value mf, this may be determined as the abnormal state detection signal. The malfunction upper limit value mf may be set to 1, or may be set differently for each frequency band.

The abnormal state detection signal generated in the frequency band other than the first or second operating frequency fw1 or fw2 may appear when the damage occurs in a configuration other than the configuration providing power.

In addition, the abnormal state detection signal may include a frequency included in a high frequency noise band fh. When the frequency included in the high frequency noise band fh is detected, the controller 16 may determine this as the abnormal state detection signal. For example, when a stick-slip occurs between the conditioning disk 130a and the polishing pad 4, high-frequency vibration may occur. The stick-slip may be caused by a change in a friction characteristic of the conditioning disk 130a and a change in a friction characteristic of the polishing pad 4 due to an abnormality in the friction characteristic of the conditioning disk 130a, an abnormality in the friction characteristic of the polishing pad 4, and/or the like.

The controller 16 may output that the abnormal state is detected when it is detected that the abnormal state detection signal is generated (S30). In this case, the controller 16 may output the frequency band in which the abnormal state detection signal is detected or a type of the abnormal state detection signal. Accordingly, when the abnormal state detection signal is generated at the first or second operating frequency fw1 or fw2, a worker (an user) may preferentially check the configuration providing power required for the operation of the CMP device 1 and/or the pad conditioner 7. In addition, when the abnormal state detection signal occurs in the noise band, the worker (the user) may proceed to check another configuration of the CMP device 1 and/or the pad conditioner 7. In addition, when the abnormal state detection signal occurs in the high frequency noise band fh, the worker (the user) may proceed to check the conditioning disk 130a and/or the polishing pad 4.

While the embodiments of the present disclosure have been described in connection with what are presently considered to be practical embodiments, it is to be understood that the disclosure is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

PAD CONDITIONERS

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CPC

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Priority Claims (1)