The disclosure generally relates to the field of forming of panels, e.g. building panels. More particular, the disclosure relates to a method of forming floor panels and floor panels produced by the method.
Embodiments of the present invention are particularly suitable for use in floating floors, which are formed of floorboards which are joined mechanically with a locking system and are made up of one or more upper layers of laminated decorative material, an intermediate core of wood-fibre-based material and a lower balancing layer on the rear side of the core. The following description of known technique, problems of known systems and objects and features of the disclosure will therefore, as a non-restrictive example, be aimed at this field of application and in particular at paper or powder based laminated floorings formed as rectangular floorboards intended to be mechanically joined on both long sides and short sides. However, it should be emphasized that embodiments of the invention may be used in all floor types which are installed with mechanical locking systems such as for example solid wood floors, LVT floors with a plastic surface layer and in wood based building panels, for instance in wall panels and furniture components
Traditional laminated panels, intended to be used for, e.g. flooring or furniture components, are produced by the following steps as shown in
Typical press parameters are 40 bar pressure and a temperature of 160-200° C. with a pressing time of 12-30 seconds.
This production method and product produced by such methods are generally referred to as the DPL process and DPL products (Direct Pressure Laminate) The upper and lower surface layers have generally at thickness of 0.1-0.2 mm
HDF (High density fibreboard) comprises wood fibre and a thermosetting resin that also is cured by heat and pressure to a board with a thickness of about 6-12 mm and a density of about 800 kg/m3.
The most common floor size is a rectangular panel of 1.3*0.2 m with a thickness of about 8 mm. The panels are packed and supplied in a packet that contains about 10 panels with a floor area of about 2 m2. The weight of each packet is about 16 kg.
Recently new floor panels with a wood powder based surface and backing have been developed. The paper is replaced with a powder backing 4 comprising wood fibres and melamine particles that is scattered on one side of a core 3 and a powder based surface layer 2 comprising wood fibres, thermosetting resins, preferably melamine particles, aluminium oxide particles and colour pigments, is scattered on the other side of the core that generally is a HDF board. The scattering is made by rollers and brushes and very accurate layers of about 100-800 gr/m2 may be scattered with high precision on the HDF core material that generally has a thickness of about 7-10 mm. The surface 2, the core 3 and the backing 4 are pressed under heat and pressure in a continuous or discontinuous press 5 to obtain a product with a paper free and solid surface layer and backing.
The pressed powder based layers may have a thickness of about 0.2-1.0 mm. Typical press parameters are similar to conventional laminate flooring and may be a pressure of 40-80 bar and a temperature of 160-200° C. with a pressing time of 10-40 seconds.
Such wood fibre based floors, generally referred to as WFF floors, have considerably better properties than traditional laminate floors since a thicker and more impact and wear resistant surface may be produced in a cost efficient way.
These two production methods may be combined.
A laminate floor with a paper based surface layer may have a powder based sub layer under the decorative paper in order to provide better impact resistance and deeper embossing. The paper backing may be replaced with a powder backing. The sub layer may be used to impregnate the decorative paper during pressing when the resins from the sub layer penetrate into the decorative paper.
WFF floor may also have several different layers on the upper side for example a high quality top layer 2a and a more cost efficient sub layer 2b under the top layer. The sub layer may comprise lower resin content and no aluminium oxide particles are needed.
A common feature for the paper or powder based surface layers, the paper or powder based backing layers and the HDF core is that all these materials comprise wood fibres and thermosetting binders, preferably melamine or urea, and that they are cured by heat and pressure. The wood fibres may be of the same type.
The layers are exposed to a first shrinking when the thermosetting resin in the upper and lower layer cures during pressing. The HDF core is also heated and becomes soft and easy to bend. The backing layer balances the tension that is created by the surface layer and the panel is substantially flat with a small convex backward bending when it leaves the press. The second temperature shrinking, when the panels is cooled from about 160-200° C. to room temperature, is also balanced by the backing layer and the panel 1 is essentially flat. A small convex backward bending is preferred since this counteracts upward bending of the edges in dry conditions when the relative humidity may go down to 20% or lower during wintertime.
This essentially flat pressed board comprises tension forces caused by the shrinking of the surface and balancing layers.
The board is generally cut and formed into several floor panels with locking systems on long and short edges as shown in
The surface layer 2 has about the same length and width as the backing layer 4 as shown in
The prices for wood fibres and thermosetting resins are increasing and major increases are expected in the future due to shortage and the possibility to use wood fibres for energy production.
Several methods have been used to save material and to reduce costs. Such methods are mainly aiming to make thinner products that comprise a minimum of resins. Further cost savings are limited by minimum quality requirements related to the floor panel and the geometry of locking system.
It would be a major advantage if it would be possible to reduce the weight and material content. The problem with the present laminate and WFF floors is that they must have a high density core such as HDF that is needed for the stability, impact resistance and the strength which is needed to resist the heat and pressure from the pressing operation.
Another problem is that the panels must have a minimum thickness and a core with high shear strength in order to allow the forming of a locking system with sufficient strength and geometry that allows easy installation.
It is known that grooves may be formed on the rear side of solid wood floors mainly in order to increase the flexibility of the panel. Such panels are easier to glue down to the sub floor. Grooves at the rear side of the panels are not used in laminate and WFF floors, which are installed with mechanical locking systems. The main reason is that such groove will have a negative impact on the stability of the panel and on the locking system since material will be removed from the balancing layer and the lower parts of the locking system.
In the following text, the visible surface of the installed floorboard is called “front side” or “surface”, while the opposite side of the floorboard, facing the subfloor, is called “rear side”. The starting board material that is used as a base material is called “core”. When the core is coated with a surface layer closest to the front side and preferably also a balancing layer closest to the rear side, it forms a semi manufacture, which is called “a board” that in a subsequent operation generally is divided and machined into a plurality of “floor panels”.
By “horizontal plane” is meant a plane, which extends parallel to the outer part of the surface layer. Immediately juxtaposed upper parts of two neighboring joint edges of two joined floorboards together define a “vertical plane” perpendicular to the horizontal plane.
The outer parts of the floorboard at the edge of the floorboard between the front side and the rear side are called “joint edge”. As a rule, the joint edge has several “joint surfaces” which may be vertical, horizontal, angled, rounded, beveled etc.
By “locking system” is meant co-acting connecting means, which connect the floor panel vertically and/or horizontally. By “mechanical locking system” is meant that joining may take place without glue.
By “up or upward” means toward the surface and by “down or downward” means toward the rear side. By “inwardly” is meant towards the centre of the floorboard and by “outwardly” means in the opposite direction.
By “carving” is meant a method to form a groove or a protrusion on an edge of a panel by carving a part of the edge to its final shape by one or several carving tool configurations comprising several non-rotating and fixed chip-removing surfaces located along the feeding direction
An objective of embodiments of the present invention is to provide laminated panels comprising thermosetting resins and a method to produce such panels with the aim to reduce the weight and material content of such panels, especially floor panels, and to combine such cost saving and material reducing methods with a high quality locking systems and a core that provides sufficient stability which is needed in the pressing operation and when the floor is used. A further objective is to provide solid wood floors with reduced weight and material content and increased stability.
A first aspect of the invention is building panels having a surface layer on the front side, an intermediate core and a backing layer on the rear side of the core, wherein the core and the layers all comprise wood fibres and thermosetting resins. The panels are provided with a locking system for vertical and horizontal locking of a first edge of a first building panel to an adjacent second edge of a second building panel. The upper parts of the first and the second edge in a locked position together define a vertical plane perpendicular to a horizontal plane, which is parallel to the surface. Said locking system comprises a tongue and a tongue groove configured to cooperate for vertical locking, and a strip, which is provided with a locking element and configured to cooperate for horizontal locking with a downwardly open locking groove formed in an adjacent edge. The backing layer and the core comprise several vertically extending core grooves with an opening towards the rear side. The area of the backing layer is less than about 90% of the area of the surface layer.
The backing layer may comprise at least three core grooves spaced horizontally and inwardly from the locking system at one pair of opposite edges.
The area of the backing layer may be less than 80% of the area of the surface layer.
The entire parts of at least one core groove may be located inside the vertical plane VP at all edges.
The panels may be rectangular with long edges and short edges and the core grooves may be parallel with the long edges.
The core grooves may have a groove depth that is at least 0.3 times the floor thickness.
The core grooves may comprise an opening that is large than an inner part of the grooves.
The backing layer may comprise essentially the same fibres as the core.
A second aspect of the invention is a method to produce a floor panels each having a surface layer on the front side, an intermediate core and a backing layer on the rear side of the core wherein the core and the layers all comprise wood fibres and thermosetting resins. The method comprises the steps of:
The mix may be scattered on the lower side of the core.
The mix may be scattered on the upper and lower side of the core.
The core may be HDF.
The core grooves may be formed prior to the forming of the locking system on long or short edges.
The core grooves may be formed by a jumping tool comprising several rotating saw blades or a carving tool.
The pressed board may be more convex than the floor panel.
The core grooves are used to create wood fibre material that may be used in a second step to form the upper or lower layers of the floor panel. The material that is removed from the core when forming the core grooves, reduces the weight of the panel in spite of the fact that the original panel thickness is maintained and that a panel which is thicker than the original core may be formed by using the chips from the forming of the core grooves. The whole floor panel including the upper and lower layers may be formed by materials comprising the material from the core.
The core and the layers may, as an alternative, comprise a thermoplastic material, such as PVC, PET or vinyl, preferably provided with a filler, and the chips created are, for this alternative, embodiment plastic chips.
The locking system may, as an alternative, comprise a protruding strip at the first or the second panel edge and a recess on a lower side of the other of said first or second panel edge. An upper surface of the protruding strip or a lower surface of the recess is preferably provided with an adhesive, such as an adhesive tape, preferably provided with a removable strip.
A third aspect of the invention is a wood based floor panel having an upper and a lower layer of solid wood. The lower layer comprises cavities and the upper layer forms an upper part of the cavities.
The panels may have a mechanical locking system at two opposite edges.
A fourth aspect of the invention is a method to produce essentially flat floor panels, each having a surface layer on a front side, a backing layer on a rear side, and an intermediate core, wherein the surface and backing layer comprise thermosetting resins and wherein the method comprises the steps of:
The core grooves may be formed after the dividing of the board into several floor panels.
The above objects are achieved wholly or partly by locking systems, floor panels and production methods according to embodiments of the invention.
The present invention will by way of example be described in more detail with reference to the appended schematic drawings, which shows embodiments of the present invention.
A first embodiment of floorboards provided with a mechanical locking system according to the invention is shown in
The forming of the grooves creates wood chips 21 that according to embodiments of the invention may be milled and sieved to wood powder that may be mixed with thermosetting resin and scattered on a core to form the surface and/or backing layer. The core grooves are mainly used to provide wood fibre material that may be used in the upper 2 or lower 4 layers in order to save material. They may also be used to decrease the weight of the floor panel.
The core grooves reduces the area A of the backing layer. The area A of the backing layer is in the shown embodiments about 60%-85% of the area A′ of the surface layer. This means that the balancing layer will lose 40-15% of its strength. A thicker backing layer or increased resin content may compensate such reduced backing area.
It is possible to form core grooves that reduce the backing area A with more than 50% compared to the initial area after pressing and the area A′ of the surface layer.
The milling or carving of the core grooves may be formed after pressing and prior to the sawing the large board into individual panels, after sawing but prior to the forming of the locking system, after the forming of the locking system on two opposite edges for example the long edges or as a final operation after the forming of the locking system. Such production steps may be combined and some grooves made be formed in several production steps.
The core grooves may easily provide sufficient wood fibre material for the various layers described above. The cured thermosetting resins from the chips are compatible with the melamine powder that is mixed into the wood powder and no separation of fibres and cured resins is needed. The backing and the surface may comprise new virgin thermosetting resins and already cured resins.
The core grooves may have different shapes and the inner core grooves 19b may be formed with a smaller groove depth GD than the outer grooves 19a in order to increase the stability of the panel. Core grooves 19c may also be formed with an undercut by for example a carving tool 20.
Core grooves with a groove depth GD of for example 0.8 times the panel thickness T may be formed in wall panels where the requirements on the impact resistance are much lower than in for floor panels.
The core grooves may provide sufficient material to for example produce a 0.5 mm backing layer and a 0.5 mm sub layer. A 7 mm HDF core may be used to produce an 8 mm floor panel by using the material from the core to form the backing layer and preferably at least parts of the surface layers. This may result in a material saving and weight reduction of about 15%.
An even larger material saving and weight reduction of about 20% may be reached if core grooves are formed such that they reduce the backing layer with 50% of the floor surface and with a groove depth GD of 40% of the floor thickness T.
The core grooves may be filled with material that preferably is cheaper than wood and/or that gives the floor other properties such as for example an increased sound reduction.
The chips may of course also be used completely or partly to create thermal energy. Embodiments of the invention may therefore also be used in floors that comprise a wood based core and where the core groves are used for weight reduction and the chips for energy or as filler in various applications.
Forming of core groves after pressing provides the advantage that the backing layer counteracts the shrinking of the top layer during pressing and cooling and the pressed board is at this production stage not affected by the core grooves that are formed in the floor panel after the pressing operation.
However, the forming of the core grooves removes a part of the balancing layer and this may result in that tension is released and that the panel edges bend upward after the forming of the grooves. Such a panel will not be completely flat and may be slightly concave along the length and the width.
The different wood types that are glued to each other may have about the same thickness. The locking system may be formed partly or completely in the lower layer 4. Core grooves 19 with an opening that points downwards may also be formed in the lower layer 4. The embodiment shown in
Core grooves or cavities formed in solid wood provide the advantages that the weight of the solid wood floor may be reduced and increased stability may be obtained.
The chips from the core grooves or cavities may be used for thermal energy or to produce wood fibres for other powder based floors or fibre based boards such as particleboards. It is also possible to mix the wood chips with a binder and to produce an artificial wood veneer that may be handled as a separate layer and glued against the opening of the core grooves.
The same technology may be used in a floor with a plywood based core and a veneered surface layer.
Core grooves may be combined with non-linear separation and locking systems that make it possible to divide the board into several panels that have geometry such that they may be positioned in the same horizontal plane HP with overlapping edges.
It is possible to form the whole floor panel from the wood material obtained from the core of other floor panels. Only melamine powder has to be added into the mix. The upper layer may be harder than the core since a higher density may be created during the pressing of the powder mix. Such panels may be formed with embossed structures and may be painted, lacquered or digitally printed in the factory or panted and/or lacquered after installation.
Embodiments
The present application is a U.S. application Ser. No. 15/085,535, filed on Mar. 30, 2016, which is a continuation of U.S. application Ser. No. 14/825,719, filed on Aug. 13, 2015, which is a continuation of U.S. application Ser. No. 13/932,406, filed on Jul. 1, 2013, now U.S. Pat. No. 9,140,010, which claims priority to U.S. Provisional Application No. 61/667,190 (VA084), filed on Jul. 2, 2012. The entire contents of U.S. application Ser. No. 15/085,535, U.S. application Ser. No. 14/825,719, U.S. application Ser. No. 13/932,406, U.S. Pat. No. 9,140,010, and U.S. Provisional Application No. 61/667,190 (VA084) are hereby incorporated herein by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
1925068 | Gray | Aug 1933 | A |
1995264 | Mason | Mar 1935 | A |
2026511 | Storm | Dec 1935 | A |
2062590 | Lundquist | Dec 1936 | A |
2113076 | Bruce | Apr 1938 | A |
2141708 | Elmendorf | Dec 1938 | A |
2149026 | McBride | Feb 1939 | A |
2269926 | Crooks | Jan 1942 | A |
2706164 | Hervey | Apr 1955 | A |
2717420 | Georges | Sep 1955 | A |
2740167 | Rowley | Apr 1956 | A |
2826521 | Robinson | Mar 1958 | A |
2914815 | Alexander | Dec 1959 | A |
3234074 | Bryant | Feb 1966 | A |
3333384 | Brady | Aug 1967 | A |
3363378 | Palfey | Jan 1968 | A |
3440790 | Nerem | Apr 1969 | A |
3488904 | Schneller et al. | Jan 1970 | A |
3548559 | Levine | Dec 1970 | A |
3732138 | Almog | May 1973 | A |
3841958 | Delorme | Oct 1974 | A |
3888061 | Kahr | Jun 1975 | A |
3895144 | Kiefer | Jul 1975 | A |
4093762 | Kiefer | Jun 1978 | A |
4122878 | Kohn | Oct 1978 | A |
RE30233 | Lane et al. | Mar 1980 | E |
4242390 | Nemeth | Dec 1980 | A |
4297817 | Bullock et al. | Nov 1981 | A |
4471012 | Maxwell | Sep 1984 | A |
4646494 | Saarinen et al. | Mar 1987 | A |
4694627 | Omholt | Sep 1987 | A |
4716700 | Hagemeyer | Jan 1988 | A |
4807416 | Parasin | Feb 1989 | A |
4937122 | Talbert | Jun 1990 | A |
5040582 | Hsu | Aug 1991 | A |
5098762 | Nakajima | Mar 1992 | A |
5103614 | Kawaguchi et al. | Apr 1992 | A |
5109898 | Schacht | May 1992 | A |
5255726 | Hasegawa et al. | Oct 1993 | A |
5295341 | Kajiwara | Mar 1994 | A |
5349796 | Meyerson | Sep 1994 | A |
5462623 | Day | Oct 1995 | A |
5493839 | Sax et al. | Feb 1996 | A |
5496648 | Held | Mar 1996 | A |
5497589 | Porter | Mar 1996 | A |
5526625 | Emblin et al. | Jun 1996 | A |
5540025 | Takehara | Jul 1996 | A |
5755068 | Ormiston | May 1998 | A |
5776580 | Rasmussen et al. | Jul 1998 | A |
5798160 | Kohn | Aug 1998 | A |
5879781 | Mehta et al. | Mar 1999 | A |
5899038 | Stroppiana | May 1999 | A |
5900099 | Sweet et al. | May 1999 | A |
5968625 | Hudson | Oct 1999 | A |
5985398 | Bellegarde | Nov 1999 | A |
6006486 | Moriau et al. | Dec 1999 | A |
6101778 | Martensson | Aug 2000 | A |
6148884 | Bolyard | Nov 2000 | A |
6182413 | Magnusson | Feb 2001 | B1 |
6209278 | Tychsen | Apr 2001 | B1 |
6212838 | Eda | Apr 2001 | B1 |
6247285 | Moebus | Jun 2001 | B1 |
6314759 | Nihashi | Nov 2001 | B1 |
6332733 | Hamberger et al. | Dec 2001 | B1 |
6412245 | Lane et al. | Jul 2002 | B1 |
6446405 | Pervan | Sep 2002 | B1 |
6505452 | Hannig et al. | Jan 2003 | B1 |
6532709 | Pervan | Mar 2003 | B2 |
6546691 | Leopolder | Apr 2003 | B2 |
6591568 | Palsson | Jul 2003 | B1 |
6606834 | Martensson et al. | Aug 2003 | B2 |
6676199 | Buisson et al. | Jan 2004 | B2 |
6679011 | Beck et al. | Jan 2004 | B2 |
6722809 | Hamberger et al. | Apr 2004 | B2 |
6761008 | Chen et al. | Jul 2004 | B2 |
6769218 | Pervan | Aug 2004 | B2 |
6769219 | Schwitte | Aug 2004 | B2 |
6772568 | Thiers | Aug 2004 | B2 |
6786019 | Thiers | Sep 2004 | B2 |
6804926 | Eisermann | Oct 2004 | B1 |
6895881 | Whitaker | May 2005 | B1 |
6922964 | Pervan | Aug 2005 | B2 |
6933043 | Son et al. | Aug 2005 | B1 |
6953105 | Rust et al. | Oct 2005 | B2 |
7021346 | Chang | Apr 2006 | B2 |
7337588 | Moebus | Mar 2008 | B1 |
7386963 | Pervan | Jun 2008 | B2 |
7506481 | Grafenauer | Mar 2009 | B2 |
7665263 | Yau | Feb 2010 | B2 |
7918062 | Chen | Apr 2011 | B2 |
7971401 | Preiss | Jul 2011 | B2 |
7993731 | Miller et al. | Aug 2011 | B2 |
8029880 | Liu | Oct 2011 | B2 |
8033075 | Pervan | Oct 2011 | B2 |
8061104 | Pervan | Nov 2011 | B2 |
8166718 | Liu | May 2012 | B2 |
8209841 | Kanade et al. | Jul 2012 | B2 |
8245477 | Pervan | Aug 2012 | B2 |
8381488 | Pervan | Feb 2013 | B2 |
8418427 | Strickland et al. | Apr 2013 | B2 |
8419877 | Pervan et al. | Apr 2013 | B2 |
8646183 | Tompkins et al. | Feb 2014 | B2 |
8720151 | Pervan | May 2014 | B2 |
8784587 | Lindgren et al. | Jul 2014 | B2 |
8850769 | Pervan | Oct 2014 | B2 |
8875464 | Pervan | Nov 2014 | B2 |
8935899 | Bergelin et al. | Jan 2015 | B2 |
9140010 | Pervan | Sep 2015 | B2 |
9194135 | Pervan | Nov 2015 | B2 |
9222267 | Bergelin | Dec 2015 | B2 |
9314936 | Pervan | Apr 2016 | B2 |
20020059765 | Nogueira et al. | May 2002 | A1 |
20020095894 | Pervan | Jul 2002 | A1 |
20020100231 | Miller | Aug 2002 | A1 |
20020170258 | Schwitte et al. | Nov 2002 | A1 |
20030010434 | Grenier | Jan 2003 | A1 |
20030033777 | Thiers et al. | Feb 2003 | A1 |
20030101681 | Tychsen | Jun 2003 | A1 |
20030115812 | Pervan | Jun 2003 | A1 |
20030233809 | Pervan | Dec 2003 | A1 |
20040226243 | Lin et al. | Nov 2004 | A1 |
20050069674 | Chang | Mar 2005 | A1 |
20050102937 | Pervan | May 2005 | A1 |
20050123728 | Reichwein et al. | Jun 2005 | A1 |
20050208255 | Pervan | Sep 2005 | A1 |
20060154015 | Miller et al. | Jul 2006 | A1 |
20060179773 | Pervan | Aug 2006 | A1 |
20060194015 | Sabater | Aug 2006 | A1 |
20070151189 | Yang | Jul 2007 | A1 |
20070292656 | Handojo | Dec 2007 | A1 |
20080008871 | Pervan | Jan 2008 | A1 |
20080028707 | Pervan | Feb 2008 | A1 |
20080184647 | Yau | Aug 2008 | A1 |
20080199676 | Bathelier et al. | Aug 2008 | A1 |
20090155612 | Pervan et al. | Jun 2009 | A1 |
20090183458 | Gibson | Jul 2009 | A1 |
20090269522 | Liu | Oct 2009 | A1 |
20100129611 | Sugimoto | May 2010 | A1 |
20100247861 | Mitchell | Sep 2010 | A1 |
20100281810 | Ruland | Nov 2010 | A1 |
20100297380 | Szakola et al. | Nov 2010 | A1 |
20100300030 | Pervan et al. | Dec 2010 | A1 |
20110023405 | Moriau et al. | Feb 2011 | A1 |
20110030303 | Pervan et al. | Feb 2011 | A1 |
20110154763 | Bergelin et al. | Jun 2011 | A1 |
20120015131 | Akarsu et al. | Jan 2012 | A1 |
20120042595 | De Boe | Feb 2012 | A1 |
20130047536 | Pervan | Feb 2013 | A1 |
20130065072 | Pervan | Mar 2013 | A1 |
20130145707 | Pervan | Jun 2013 | A1 |
20130199120 | Bergelin et al. | Aug 2013 | A1 |
20130260089 | Gorby | Oct 2013 | A1 |
20130273244 | Vetter | Oct 2013 | A1 |
20130283720 | Pervan et al. | Oct 2013 | A1 |
20140000197 | Pervan | Jan 2014 | A1 |
20140215952 | Pervan | Aug 2014 | A1 |
20150059927 | Brännström et al. | Mar 2015 | A1 |
20150090400 | Bergelin et al. | Apr 2015 | A1 |
20150345153 | Pervan | Dec 2015 | A1 |
20160194883 | Pervan | Jul 2016 | A1 |
20160265234 | Pervan | Sep 2016 | A1 |
Number | Date | Country |
---|---|---|
430631 | Oct 1945 | CA |
2 363 184 | Jul 2001 | CA |
2 463 192 | Oct 2005 | CA |
173818 | Dec 1934 | CH |
310904 | Nov 1955 | CH |
2401633 | Oct 2000 | CN |
908 913 | Apr 1954 | DE |
2 205 232 | Aug 1973 | DE |
33 43 601 | Jun 1985 | DE |
33 43 601 | Jun 1985 | DE |
43 13 037 | Aug 1994 | DE |
299 22 649 | Mar 2000 | DE |
201 08 358 | Sep 2001 | DE |
100 49 172 | Apr 2002 | DE |
10 2005 061 099 | Mar 2007 | DE |
0 621 128 | Oct 1994 | EP |
0 621 128 | Oct 1994 | EP |
0 652 340 | May 1995 | EP |
1 262 609 | Dec 2002 | EP |
21805 | Jan 1947 | FI |
1.464.112 | Jul 1966 | FR |
2 718 175 | Oct 1995 | FR |
291113 | Nov 1928 | GB |
519198 | Mar 1940 | GB |
2-194269 | Jul 1990 | JP |
121236 | Oct 1990 | JP |
5-21027 | Mar 1993 | JP |
6-158831 | Jun 1994 | JP |
6-280376 | Oct 1994 | JP |
7-102745 | Apr 1995 | JP |
7-310426 | Nov 1995 | JP |
8-021071 | Jan 1996 | JP |
8-068191 | Mar 1996 | JP |
8-300316 | Nov 1996 | JP |
9-38906 | Feb 1997 | JP |
10-299230 | Nov 1998 | JP |
11-324292 | Nov 1999 | JP |
2000-027418 | Jan 2000 | JP |
2000-226932 | Aug 2000 | JP |
2000-265652 | Sep 2000 | JP |
2000-317918 | Nov 2000 | JP |
2001-145980 | May 2001 | JP |
2001-329681 | Nov 2001 | JP |
2003-027731 | Jan 2003 | JP |
2003-080509 | Mar 2003 | JP |
2007-0000322 | Jan 2007 | KR |
1008945 | Oct 1999 | NL |
9604483-9 | Jun 1998 | SE |
9604487-7 | Jun 1998 | SE |
WO 9426999 | Nov 1994 | WO |
WO 9627719 | Sep 1996 | WO |
WO 9627721 | Sep 1996 | WO |
WO 9738187 | Oct 1997 | WO |
WO 9747834 | Dec 1997 | WO |
WO 9824994 | Jun 1998 | WO |
WO 9824995 | Jun 1998 | WO |
WO 9905073 | Feb 1999 | WO |
WO 9966152 | Dec 1999 | WO |
WO 0066856 | Nov 2000 | WO |
WO 0102669 | Jan 2001 | WO |
WO 0102671 | Jan 2001 | WO |
WO 0148331 | Jul 2001 | WO |
WO 0148332 | Jul 2001 | WO |
WO 0151733 | Jul 2001 | WO |
WO 0154897 | Aug 2001 | WO |
WO 03016655 | Feb 2003 | WO |
WO 03087498 | Oct 2003 | WO |
WO 2004080674 | Sep 2004 | WO |
WO 2004108373 | Dec 2004 | WO |
WO 2006027357 | Mar 2006 | WO |
WO 2006043893 | Apr 2006 | WO |
WO 2006134109 | Dec 2006 | WO |
WO 2007149051 | Dec 2007 | WO |
WO 2009065769 | May 2009 | WO |
WO 2009065769 | May 2009 | WO |
Entry |
---|
U.S. Appl. No. 15/085,535, Pervan. |
U.S. Appl. No. 14/946,429, Pervan. |
International Search Report issued in PCT/SE2013/050837, mailed Nov. 29, 2013, Patent-och registreringsverket, Stockholm, SE, 6 pages. |
Pervan, Darko (Author)/Valinge Innovation, Technical Disclosure entitled “VA073a Zip Loc,” Sep. 13, 2011, IP.com No. IPCOM000210869D, IP.com PriorArtDatabase, 36 pages. |
Correspondence from Bütec cited during opposition procedure at EPO in DE Patent No. 3343601, including announcement of Oct. 1984 re “Das Festprogram von Bütec: Mehrzweckbühnen, tanzplatten, Schonbeläge, Tanzbeläge, Bestuhlung”; letter of Nov. 7, 2001 to Perstorp Support AB with attached brochure published Oct. 1984 and installation instructions published Nov. 1984; and letter of Nov. 19, 2001 to Perstorp Support AB. |
Drawing Figures 25/6107 from Buetec GmbH dated Dec. 16, 1985. |
Pervan, Darko, U.S. Appl. No. 14/946,429 entitled “Floorboards for Floorings,” filed in the U.S. Patent and Trademark Office Nov. 19, 2015. |
Pervan, Darko, U.S. Appl. No. 15/085,535 entitled “Panel Forming,” filed in the U.S. Patent and Trademark Office on Mar. 30, 2016. |
Number | Date | Country | |
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20160265236 A1 | Sep 2016 | US |
Number | Date | Country | |
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61667190 | Jul 2012 | US |
Number | Date | Country | |
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Parent | 15085535 | Mar 2016 | US |
Child | 15164523 | US | |
Parent | 14825719 | Aug 2015 | US |
Child | 15085535 | US | |
Parent | 13932406 | Jul 2013 | US |
Child | 14825719 | US |