Claims
- 1. A fiber optic communications module, comprising:a set of optical fibers supported in an optical ferrule having a set of alignment holes; a silicon substrate carrier including a set of alignment apertures which are etched into said silicon substrate using photolithography techniques and is adapted for cooperating with an alignment structure of said optical ferrule and aligning said silicon substrate carrier with said optical ferrule; a set of guide pins adapted for mating with said set of alignment holes and said set of alignment apertures; and an optoelectronic device having a set of photoactive components corresponding to said set of optical fibers in said optical ferrule which is mounted on so as to be precisely aligned with said set of alignment apertures so that said set of photoactive components are aligned for optical communication through a window section of said silicon substrate carrier with said set of optical fibers when said set of guide pins are mated with said set of alignment holes and said set of alignment apertures and said silicon substrate carrier is coupled to said optical ferrule, and wherein a transparent film layer is deposited on a surface of said silicon substrate carrier using photolithography techniques, and wherein said transparent film layer comprising at least one of silicon nitride, polysilicon, and polyimide.
- 2. The fiber optic communications module according to claim 1, wherein:photoactive components of said set of photoactive components are arranged in a first linear array, and optical fibers of said set of optical fibers are arranged in a second linear array corresponding to said first linear array.
- 3. The fiber optic communications module according to claim 1, further including:a second alignment structure for said optoelectronic device deposited on said silicon substrate carrier using photolithography techniques.
- 4. The fiber optic communications module according to claim 3, wherein:said second alignment structure comprises at least one metal trace.
- 5. The fiber optic communications module according to claim 1, wherein:said set of photoactive components comprise PIN photodiodes.
- 6. The fiber optic communications module according to claim 1, further including:a support block including one or more support passages formed therein to receive the set of guide pins for securely supporting said set of guide pins and said silicon substrate carrier in precisely aligned positions.
Parent Case Info
This is a division of application Ser. No. 09/954,130 filed Sep. 17, 2001 U.S. Pat. No. 6,739,760, which is hereby incorporated herein by reference.
US Referenced Citations (19)
Non-Patent Literature Citations (1)
Entry |
JP 402101406 A Inventor:Ito, Masataka, Assignee: NEC Corp. Application Date: Oct. 11, 1998. |