This invention relates generally to air conditioning and refrigeration systems and, more particularly, to parallel flow evaporators thereof.
A definition of a so-called parallel flow heat exchanger is widely used in the air conditioning and refrigeration industry now and designates a heat exchanger with a plurality of parallel passages, among which refrigerant is distributed and flown in the orientation generally substantially perpendicular to the refrigerant flow direction in the inlet and outlet manifolds. This definition is well adapted within the technical community and will be used throughout the text.
Refrigerant maldistribution in refrigerant system evaporators is a well-known phenomenon. It causes significant evaporator and overall system performance degradation over a wide range of operating conditions. Maldistribution of refrigerant may occur due to differences in flow impedances within evaporator channels, non-uniform airflow distribution over external heat transfer surfaces improper heat exchanger orientation or poor manifold and distribution system design. Maldistribution is particularly pronounced in parallel flow evaporators due to their specific design with respect to refrigerant routing to each refrigerant circuit. Attempts to eliminate or reduce the effects of this phenomenon on the performance of parallel flow evaporators have been made with little or no success. The primary reasons for such failures have generally been related to complexity and inefficiency of the proposed technique or prohibitively high cost of the solution.
In recent years, parallel flow heat exchangers, and brazed aluminum heat exchangers in particular, have received much attention and interest, not just in the automotive field but also in the heating, ventilation, air conditioning and refrigeration (HVAC&R) industry. The primary reasons for the employment of the parallel flow technology are related to its superior performance, high degree of compactness and enhanced resistance to corrosion. Parallel flow heat exchangers are now utilized in both condenser and evaporator applications for multiple products and system designs and configurations. The evaporator applications, although promising greater benefits and rewards, are more challenging and problematic. Refrigerant maldistribution is one of the primary concerns and obstacles for the implementation of this technology in the evaporator applications.
As known, refrigerant maldistribution in parallel flow heat exchangers occurs because of unequal pressure drop inside the channels and in the inlet and outlet manifolds, as well as poor manifold and distribution system design. In the manifolds, the difference in length of refrigerant paths, phase separation, gravity and turbulence are the primary factors responsible for maldistribution. Inside the heat exchanger channels, variations in the heat transfer rate, airflow distribution, manufacturing tolerances, and gravity are the dominant factors. Furthermore, the recent trend of the heat exchanger performance enhancement promoted miniaturization of its channels (so-called minichannels and microchannels), which in turn negatively impacted refrigerant distribution. Since it is extremely difficult to control all these factors, many of the previous attempts to manage refrigerant distribution, especially in parallel flow evaporators, have failed.
In the refrigerant systems utilizing parallel flow heat exchangers, the inlet and outlet manifolds or headers (these terms will be used interchangeably throughout the text) usually have a conventional cylindrical shape. When the two-phase flow enters the header, the vapor phase is usually separated from the liquid phase. Since both phases flow independently, refrigerant maldistribution tends to occur.
If the two-phase flow enters the inlet manifold at a relatively high velocity, the liquid phase (droplets of liquid) is carried by the momentum of the flow further away from the manifold entrance to the remote portion of the header. Hence, the channels closest to the manifold entrance receive predominantly the vapor phase and the channels remote from the manifold entrance receive mostly the liquid phase. If, on the other hand, the velocity of the two-phase flow entering the manifold is low, there is not enough momentum to carry the liquid phase along the header. As a result, the liquid phase enters the channels closest to the inlet and the vapor phase proceeds to the most remote ones. Also, the liquid and vapor phases in the inlet manifold can be separated by the gravity forces, causing similar maldistribution consequences. In either case, maldistribution phenomenon quickly surfaces and manifests itself in evaporator and overall system performance degradation.
Briefly, in accordance with one aspect of the invention, the insertion depth of the individual parallel channels into the inlet manifold is varied so as to obtain a more uniform refrigerant distribution to the individual channels by way of the differential pressure drop that is created by the variable insertion depth. In this way, a two-phase refrigerant mixture is more uniformly distributed among the channels.
In accordance with another aspect of the invention, the insertion depth of the individual channels is progressively smaller toward the downstream end of the inlet manifold such that the hydraulic resistance to flow is progressively lower toward the downstream channels.
In accordance with another aspect of the invention, the variable insertion depth of the individual channels is accommodated by appropriately enlarging the diameter of the inlet manifold. The enlargement can be uniform in a cross-section perpendicular to the refrigerant flow to result in a cylindrical inlet manifold or it can be variable such that the portions immediately surrounding the individual channels are larger and the portions therebetween are smaller.
In accordance with yet another aspect of the invention, the insertion depth of the individual channels into the outlet manifold is also varied to compensate for variable flow impedance in the outlet manifold as well.
In the drawings as hereinafter described, preferred and alternate embodiments are depicted; however, various other modifications and alternate constructions can be made thereto without departing from the true spirit and scope of the invention.
Referring now to
The usual manner of attaching the parallel channels 13 to the inlet manifold 11 and the outlet manifold 12 is to insert the channels 13 so that they extend into the internal cavities of the inlet and outlet manifolds 11 and 12 as shown by the dotted lines. The usual practice is to have equal insertion depth for each of the channels 13. They are then fixed in position by way of brazing or the like.
In operation, two-phase refrigerant flows into the inlet opening 14 and into the internal cavity 16 of the inlet header 11. From the internal cavity 16, the refrigerant, in the form of a liquid, a vapor or a mixture of liquid and vapor (the most typical scenario) enters the tube openings 17 to pass through the channels 13 to the internal cavity 18 of the outlet header 12. From there, the refrigerant, which is now usually in the form of a vapor, passes out the outlet opening 19 and then to the compressor (not shown).
As discussed hereinabove, it is desirable that the two-phase refrigerant passing from the inlet header 11 to the individual channels 13 do so in a uniform manner (or in other words, with equal vapor quality) such that the full heat exchange benefit of the individual channels can be obtained and flooding conditions are not created and observed at the compressor suction (this may damage the compressor). However, because of various phenomena as discussed hereinabove, a non-uniform flow of refrigerant to the individual channels 13 (so-called maldistribution) occurs. In order to address this problem, the applicants have introduced design features that will create different pressure drop for flow of refrigerant from the inlet manifold to the individual channels to thereby bring about a more uniform flow of refrigerant into the channels 13. Additionally, increased velocity of the refrigerant flow in the inlet manifold promotes more homogeneous conditions through mixing and jetting effects.
Referring now to
In operation, the two-phase refrigerant enters the internal cavity 16 by way of the inlet 14 and, because of the limited distance between the penetrating end 24 of tube 21 and the opposing wall 28 of the inlet manifold 11, there would be increased hydraulic resistance and therefore restricted flow into the channel 21. The next channel 22, with its reduced insertion depth, provides a greater distance between the end 26 and the wall 28. The next downstream channel 23 has its end 27 inserted an even smaller distance into the cavity, and any subsequent channels are progressively decreased in their insertion depth. Therefore, the problem of the more upstream tubes receiving a greater portion of the refrigerant is overcome by selectively varying the impedance to the flow at the entrance into each of the channels. Additionally, increased velocity of the refrigerant flow in the inlet manifold 16 may promote more homogeneous conditions through mixing and jetting effects.
It has to be noted that if it becomes difficult to control the insertion depth of the individual channels during the manufacturing processes due to a sufficiently large number of channels, then the insertion depth can be controlled in sections with each section having equal insertion depth and with the insertion depth varying from section to section and decreasing in the downstream direction along the inlet manifold. In such case, each individual channel shown in
The
As is seen in
Rather than increasing the diameter D of the inlet manifold 11 along its entire longitudinal axis, an alternative design is shown in
Alternatively, as shown in
Furthermore, as shown in
Furthermore, it should be noted that both vertical and horizontal channel orientations will take advantage from the teaching of the present invention, although higher benefits will be obtained for the latter configuration. Also, although the teachings of this invention are particularly advantageous for the evaporator applications, refrigerant system condensers may benefit from them as well.
While the present invention has been particularly shown and described with reference to preferred and alternate embodiments as illustrated in the drawings, it will be understood by one skilled in the art that various changes in detail may be effected therein without departing from the true spirit and scope of the invention as defined by the claims.