The design and manufacture of even the simplest product can be a very complex process. Some of the complexity arises from constraints that are imposed on the design and/or on the manufacturing process. For example, the function or use of the product general imposes certain constraints on the design. Aesthetics, cost, availability of materials, safety and numerous other considerations typically impose further constraints on the design.
Generally speaking, engineering design is concerned with the efficient and economical development, manufacturing and operation of a process, product or a system. In several engineering disciplines such as aerospace, chemical, mechanical, semiconductor, biomedical and civil, the design is a creative, albeit trial-and-error, process. With increasing emphasis on economical, efficient and optimized design, development of an automated or even semi-automated engineering design process can lead to improvements in cost, performance and/or manufacturing for a process, product or system, along with providing efficiencies and optimizations.
The systems and methods described in this application provide a semi-automated methodology that can lead to an economical, efficient and optimized design of a variety of engineering processes, products and systems. In particular, these systems and methods involve generating a topology for a material by parametrizing one or more material properties of the material using virtual testing and generating a topology for the material based on the parametrizing.
a) and 3(b) respectively show an example design domain and an example possible optimal topology.
a) and 4(b) show example virtual tests for parametrizing certain material properties.
a) and 7(b) respectively show an example initial problem domain and an example optimal topology.
The concepts and techniques described herein can be used in conjunction with a wide variety of design and manufacturing systems and processes and should not be viewed as being limited to any particular design and/or manufacturing system or process. The concepts and techniques are particularly useful when used in conjunction with so-called volumetrically controlled manufacturing (VCM) as described in U.S. Pat. No. 5,594,651 and application Ser. No. 09/643,982, the contents of each of which are incorporated herein in their entirety. The VCM process can be used as a rapid prototyping method for composite materials and enables determination of the proper sequence and orientation of material property coefficients that must exist within a synthetic material to meet predefined tolerance specifications. The VCM process can be used for mechanical, thermal, electro-magnetic, acoustic, and optic applications and is scalable to Macro, Micro, and Nano levels.
One of the advantages of the VCM methodology is that it enables design optimization of many variable raw materials in conjunction with each other, such as ceramics, resins and fiber. In addition to raw material types, the VCM methodology can also account for such variable parameters as volume, weight, density, and cost. Once the solutions to the model converge, the material property sequencing then translates directly into formats that can serve as inputs for manual, semi-automated, and automated machine control systems, to fabricate parts with near optimum material properties.
The output of design equipment 150 includes control instructions which are supplied to a control system 160. Control system 160 may be a processor-equipped device that uses the control instructions to generate control signals appropriate for controlling manufacturing equipment 170. These control signals may control manufacturing parameters such as temperature, pressure, supply of raw materials, mixtures of raw materials, and the like. Feedback from various sensors (e.g., temperature, pressure and the like) provided in manufacturing equipment 170 is supplied to control system 160 so that control system 160 can generate control signals to maintain temperature and pressure, for example, in certain ranges during the manufacturing process.
The control instructions are appropriately sequenced to allow the designed object to be manufactured according to the results of the design process. By way of example without limitation, the control instructions may control the properties of fibers (e.g., number, composition, size, etc.) laid into an epoxy to form a composite material. Additionally or alternatively, the control instructions may vary the properties of the epoxy to provide the object designed by the manufacturing process. By way of further example without limitation, the control instructions may control the introducing of alloy constituents in an alloy extrusion process.
By way of non-limiting example, the discussion below makes reference to a topology optimization problem as conceptualized in
As an example, one typical problem is to design a structure for minimum compliance with given amount of material. Minimizing compliance is akin to maximizing stiffness. While the following description is provided in terms of mechanical stiffness, this is merely by way of example. The described techniques and methodology are equally applicable to electrical, magnetic, thermal, optical, fluid and acoustical designs and combinations thereof and are scalable to macro-, micro- and nano-applications.
a) shows an example structure. This problem of minimizing compliance takes the following form (discussed in greater detail below):
minimize compliance≡ƒ(x) (1)
subject to weight (x)≦w0 (2)
and 0≦x≦≦1 (3)
where x represents the set of parameters that the designer needs to compute.
Looking at the compliance minimization problem in equations (1)-(3), it is apparent that it is necessary to express compliance and weight as functions of a design variable vector x, where x=[x1, x2, . . . , xn]T, wherein n equals the number of design variables. In simple terms, when a particular xi=0, the material in a certain region vanishes, or when xi=1, the corresponding region is dense (solid). Weight is defined as:
where ρj is the homogenized density or density of the “macroscopic” bulk material, cj is a constant, and j is summed to cover the entire domain.
It is convenient to express density ρj as a function of x or
ρj=ρj(x) (5)
to reflect the fact that the density varies as material is re-distributed. Equation (5) denotes “parametrization”—that is, to express density in terms of a finite number of parameters.
Consider the compliance function in Equations (1)-(3) defined by the product of force and displacement as
ƒ=FTU (6)
where U is the displacement vector, obtained by solving finite element equilibrium equations
KU=F (7)
where K is the stiffness matrix for the structure. It will be appreciated K may have different meanings depending on the design consideration. By way of example, for a thermal design consideration, K may be a thermal conductivity matrix for the structure. By way of further example, for an electromagnetic design consideration, K may be a reluctivity matrix for the structure.
Stiffness K is dependent on material properties of the bulk material, such as Young's modulus E, Poisson's ratio v, etc. Again, material re-distribution must reflect changes in these properties. Thus, E, v, etc. must be parametrized as:
E=E(x),v=v(x), (8)
After parametrization as discussed above, a “nonlinear programming” problem of the following form is obtained:
minimize ƒ(x)
subject to gi(x)≦0,i=1, . . . ,m
and xL≦x≦xU (9)
where gi are constraints and xL and xU are design variable lower and upper limits, respectively.
Using either gradient or non-gradient optimizers as described in Belegundu et al., Optimization Concepts and Applications in Engineering, Prentice-Hall, 1999 and Belegundu et al., “Parallel Line Search in Method of Feasible Directions”, Optimization and Engineering, vol. 5, no. 3, pp. 379-388, September 2004, the contents of each of which are incorporated herein in their entirety, an optimum topology denoted by x* can be obtained. In the case when there is only a single constraint or m=1, such as a mass restriction in Equations (1)-(3), optimality criteria methods have proved to be efficient.
After solving equation (9), density contours, i.e. contours of ρ(x*), provide a topological form for the structure. Penalty functions can be introduced into equation (9) above to aid in reducing “grey” or “in-between” phases to visualize a sharper outline of the structural form as
ƒ→ƒ+rP (10)
where P(x) is a penalty function and r is a penalty parameter.
These ideas can be easily extended into other engineering areas. For example, in a multiphysics design scenario, it may be necessary to find material properties in a domain, so that (a) heat conduction is minimal and the material is both light and strong, or (b) heat conduction is good and the fatigue life is long, etc.
Existing methods of parametrization include a homogenization theory approach. Topology optimization was initiated with homogenization theory in 1988. See, Bendsoe et al., “Generating Optimal Topologies in Structural Design Using a Homogenization Method”, Computer Methods in Applied Mechanics and Engineering, 71, pp. 197-224 (1988), the contents of which are incorporated herein in their entirety. Further details are available in Eschenauer et al., “Topology Optimization of Continuum Structures: A Review”, Appl Mech Rev, 54(4), pp. 331-390 (2001) and Bendsoe et al., Topology Optimization: Theory, Methods and Applications, Springer, Berlin (2003), the contents of each of which are incorporated herein in their entirety.
In this approach, first, a repeating microstructure is assumed. If the goal is to design a material that has only two phases with one solid and the other void, then a microstructure may be defined by a unit cell with a void. The void can be of any shape such as, but not limited to, a rectangle or a circle.
Homogenization theory suffers from two drawbacks. First, its mathematical complexity is formidable. This has led to a less powerful yet easier parametrization approach as discussed below. Second, thus far, properties relating to the elastic constitutive behavior of the material such as Young's or shear moduli, dielectric constant, and thermal conductivity have been homogenized. See, e.g., Sigmund et al., “Composites with External Thermal Expansion Coefficients”, Applied Physical Letters, 69(21), November 1996. Strength-related properties such as yield strength, fracture strength, hardness, etc. have not been considered. This is also due to the limitations of homogenization theory: (i) mathematical complexity, and (ii) limitations of the central assumption that the unit cell in the repeated microstructure governs properties of the continuum.
A second approach is an artificial parametrization called “SIMP” (Solid Isotropic Material with Penalization). See Bendsoe, Topology Optimization. “Artificial” refers to the fact that no underlying microstructure is assumed. Instead, a parametrization as E(x)=E0 xr is directly adopted, where x is the solid volume fraction. Typically, r=3. The idea here is that a cubic parametrization will tend to drive the design to the final state of xj=0 or xj=1. Although based on an artificial model, the approach is effective on single phase, solid-void topology optimization.
However, the SIMP approach does not provide parametrization of strength properties simultaneously in any meaningful way. Further, there is difficulty in handling three or more phases simultaneously.
The systems and methods of this application perform parametrization based on virtual testing. As with the homogenization theory approach, an underlying microstructure is assumed. The essential difference is in the technique used for parametrization of the homogenized properties of the macroscopic or bulk material. The virtual testing approach leads to two distinct advantages over homogenization and SIMP methodologies. First, it is much easier to obtain the parametrization form. Second, in addition to material properties that enter into the constitutive equations such as moduli, dielectric constant, conductivities, etc., strength-related material properties such as yield strength, ultimate strength, fracture toughness, hardness can just as easily be parametrized.
The virtual testing approach is based on an observation that actual laboratory tests have been developed to determine each material property, which are then published in various handbooks and databases. By mimicking each actual test on the computer via finite element (e.g., classical or inverse) or other numerical simulations, a corresponding “virtual test” can therefore be developed for these multi-phase microstructure systems.
For example, a virtual tensile test will provide Young's modulus E, yield strength σy, and ultimate strength σu. Other tests will provide shear modulus, dielectric constant, hardness etc. Repeating such tests for different microstructure sizes/shapes (parametrized by xi) will yield the required parametrization or functional relationships as E(x), σy(x), G12(x), etc.
To illustrate the virtual testing approach, consider a repeating microstructure including a square void within a unit cell. The homogenized or bulk properties will be those of an orthotropic material with three independent constants, viz. E, v, and G12. Of course, while this example involves an orthotropic material, the virtual testing approach is also applicable to materials that are isotropic, anisotropic, transversely isotropic, etc. E0, v0, and G120 are denoted as the properties of the non-void material, and E/E0, v/v0, and G12/G120 as the ‘normalized’ values. Also, letting x be the volume fraction of solid material, the normalized material constants can be seen to vary from 0 to 1 as x varies from 0 to 1, respectively.
a) and 4(b) show two virtual finite element analyses (FEA) models. The
The virtual testing approach agrees well with homogenization theory as seen in
The virtual testing approach provides numerous advantages. For example, hitherto, strength properties have not been homogenized or parametrized in any clear way. A consequence of this is that only global response has been incorporated into an optimization problem such as involving displacement. Local responses such as involving stress have not been tackled. The ability to parametrize strength properties using the virtual testing approach as described above allows general design problems to be tackled, hitherto untenable. This follows from the equations (11) below:
displacement based on homogenized material constants≦specified displacement limit
stress based on homogenized material constants≦strength obtained from virtual tensile test
constraints based on fatigue, fracture, hardness composite ply failures, etc.
This is a consistent homogenization approach for both stress and strength quantities. Constraint in (11), denoted by g≦0 is implemented in finite element i as
to overcome a singularity. This ensures that the stress constraint is not active where there is no material.
Further, multiobjective (i.e., multiattribute) optimization problems can be formulated and solved as discussed in Grissom et al., Conjoint Analysis Based Multiattribute Optimization, Journal of Structural Optimization (2005), the contents of which are incorporated herein. An example problem involving topology optimization with von Mises yield stress and displacement constraints is shown in
Example virtual tests for axial and transverse thermal conductivity of a unidirectional graphite/epoxy composite will now be discussed. The same finite element model used for mechanical property estimation can also be used for finding the thermal properties of composite materials. The axial and transverse conductivities can be calculated using Fourier's Law in equation 13 below. By obtaining the unidirectional flux Q from the finite element model to which a temperature gradient is applied in the direction in which the conductivity K is to be calculated, the following equation results:
where ΔT is the temperature change and Δx is the length (distance) through which this temperature change occurs.
This same procedure can also be used for obtaining other thermal properties such as coefficient of thermal expansion (CTE) and the like. A sample set of CTE values are shown in
Advantages of the virtual testing approach include:
Generally speaking, the techniques described herein may be implemented in hardware, firmware, software and combinations thereof. The software or firmware may be encoded on a storage medium (e.g., an optical, semiconductor, and/or magnetic memory) as executable instructions that are executable by a general-purpose, specific-purpose or distributed computing device including a processing system such as one or more processors (e.g., parallel processors), microprocessors, micro-computers, microcontrollers and/or combinations thereof. The software may, for example, be stored on a storage medium (optical, magnetic, semiconductor or combinations thereof) and loaded into a RAM for execution by the processing system. Further, a carrier wave may be modulated by a signal representing the corresponding software and an obtained modulated wave may be transmitted, so that an apparatus that receives the modulated wave may demodulate the modulated wave to restore the corresponding program. The systems and methods described herein may also be implemented in part or whole by hardware such as application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), logic circuits and the like.
While the above description is provided in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the systems and methods described herein are not to be limited to the disclosed embodiment, but on the contrary, are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
This is application is a divisional of U.S. patent application Ser. No. 11/542,647, filed Oct. 4, 2006 which is a non-provisional of application No. 60/722,985, filed Oct. 4, 2005, the contents of each of which are incorporated herein in their entirety.
Number | Date | Country | |
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60722985 | Oct 2005 | US |
Number | Date | Country | |
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Parent | 11542647 | Oct 2006 | US |
Child | 13891964 | US |