This application relates to optics and laser processing, and more particularly to a high-speed partition laser assembling (PLA) system and method based on vector graphic structure and optical field modulation.
In the fabrication of structures using the existing laser micromachining technologies, it is required to first read in the pattern of the target structure, and then convert the pattern into the point cloud information of coordinates, and finally the coordinate point clouds to be processed are irradiated by the laser point by point to obtain the desired planar structure. Multiple planar structures are fabricated layer by layer to reach the desired three-dimensional structure.
Usually, the spot used in laser processing is a tiny point-like spot (e.g., Gaussian beam and Bessel-Gaussian beam). In the point-by-point processing, the positioning accuracy, alignment jitter, and control precision of the processing time of the laser focus will inevitably affect the uniformity and surface smoothness of the fabricated structure.
In view of the deficiencies in the prior art, this application provides a partition laser assembling (PLA) system and method based on vector graphic structure and optical field modulation.
Technical solutions of this application are described as follows.
In a first aspect, this application provides a partition laser assembling (PLA) based on vector graphic structure and optical field modulation, including:
In an embodiment, the beam modulation module is a phase-only reflective spatial light modulator.
In an embodiment, the shaping and polarization state modulation includes spatial light filtering, beam expansion and polarization state modulation.
In an embodiment, the partition laser assembling system further includes: a first reflector;
This application further provides a partition laser assembling method by using the partition laser assembling system, including:
In an embodiment, a generation of the holographic phase maps includes:
In an embodiment, the generation of the holographic phase maps further includes:
In an embodiment, the basic shapes include circle, ellipse, line, arc, and dot;
In an embodiment, in the generation of the holographic phase maps of the basic shapes, the dot-type phase map is generated based on a Bessel-Gaussian beam phase;
In an embodiment, the step of “focusing the laser spots of basic shapes to the target structure to perform partition laser assembling on the target structure” includes:
Compared to the prior art, this application has the following beneficial effects.
Based on the combination of light field modulation technology and vector path, a complex pattern (miscellaneous spot structure, such as circles, line segments, or arcs whose shape and size can be freely defined) can be decomposed into basic shapes, and then the complex pattern is fabricated according to these basic shapes. This technology changes the previous point processing into partition laser assembling of the structure, which will greatly improve the processing efficiency, precision, uniformity, and smoothness. This application can directly fabricate the complex structure composed of basic shapes, significantly reducing the uncertainty caused by point-by-point processing, greatly improving the processing efficiency, precision, uniformity, and smoothness. Therefore, this application has a great significance in promoting the development of macro-processing and micro-processing technology.
The disclosure will be described in detail below in combination with the accompanying drawings and embodiments to make the technical solutions, objects and advantages of the disclosure clearer. It should be understood that described below are merely some embodiments of the disclosure, which are not intended to limit the disclosure.
As shown in
The laser 1 emits a beam with the corresponding wavelength to the beam shaping-polarization modulation module 2. The beam shaping-polarization modulation module performs shaping and polarization state modulation on the beam to generate a laser beam with linear polarization and collimation and emits the laser beam with linear polarization and collimation to the beam modulation module (liquid crystal spatial light modulator) through a first reflector 3. Then, the beam modulated by the beam modulation module is incident to the pupil plane of the objective lens 7 through the dichroic mirror 6.
The beam shaping-polarization modulation module 2 performs the shaping and polarization state modulation on the beam emitted by the laser 1, such as spatial light filtering, beam expansion, and polarization state modulation.
The beam modulation module modulates the modulated beam to generate a series of laser spots according to basic shapes in sequence and emits these spots into the pupil plane of the objective lens 7 in real time. The objective lens 7 focuses these spots on the pupil plane to the target material. The beam modulation module is a reflective phase-only spatial light modulator used for real-time control of the generation of beam shapes.
The aperture diaphragm 5 is used to block the zero-order spot generated by the beam modulation module.
The reflectors are used to reflect the light beam to the phase-only spatial light modulator and the entrance pupil of the objective lens, respectively.
The translation platform 8 is used to move spatially the target structure.
The dichroic mirror 6 is used to reflect the modulated laser beam and transmit the fluorescence emitted by the photoresist.
The control system 9 is used to control the micro-nanometer translation platform to move in the appropriate area and to control the spatial light modulator to load the holographic phase maps in real time according to the processing flow, so as to generate the laser spots of basic shapes corresponding to the processing path.
A camera is used to observe the lithographic structure in real time.
In this embodiment, a high-speed partition laser assembling method based on vector graphic structure and optical field modulation is provided. The method includes the following steps.
(S1) A laser emits a laser beam with a corresponding wavelength to the beam shaping-polarization modulation module.
(S2) The beam shaping-polarization modulation module performs shaping and polarization state modulation on the laser beam to generate a linearly-polarized and collimated laser beam. The shaping and polarization state modulation includes spatial light filtering, beam expansion, and polarization state modulation. Then, the linearly-polarized and collimated laser beam is incident to the beam modulation module through the reflector.
(S3) The linearly-polarized and collimated laser beam is modulated by the beam modulation module to generate the laser spots of basic shapes, which are reflected by the dichroic mirror to the pupil plane of the objective lens.
Further, referring to
(S301) A size and a structure of a vector graphic of the target structure are analyzed.
Further, after the size is resolved, the vector graphic is partitioned according to the optical system (including parameters of the light source, objective lens, spatial light modulator), and the complex vector graphic is resolved into n partitions.
Further, the resolving structure refers to resolve the basic shapes in the vector graphic. The resolving structure is used to resolve the complex vector graphic into the basic shapes, such as circles, ellipses, straight lines, arcs, dots, etc. As shown in
(S302) A structure partition 1 in
(S303) Similarly, the structure partition is moved to the structure partition 2 by the translation platform. The corresponding basic shape is found by matching the vector graphic for the structure partition 2. The processing of other partitions in the complex vector graphic is the same as that in step (S302). Then the structure partition 2 is processed. The corresponding arced shape is found by matching the vector graphic for the structure partition 2. The processing of other partitions in the graphic in
(S304) A series of phase maps of basic shapes to be loaded are generated from the structures in all the partitions. All the partitions in
(S305) It is judged whether these phase maps to be loaded satisfy the maximum loading amount of the hologram loading software: if satisfied, proceed to the next step; if not, the series of phase maps will be loaded in segments. After these partitions are processed, the phase maps used for subsequent partitions are loaded.
Further, in step (S303), a generation of the holographic phase map of the basic shapes includes the following steps.
(S303-1) The phase map for dot-type spot is generated based on the Bessel-Gaussian beam phase, and the phase distribution is expressed as:
φ1=exp(ikηr);
(S303-2) The phase map for a line spot is obtained by adding a rotation transformation to the Airy beam, and the transformation formula is expressed as:
where kx and ky are the spatial frequencies; and k′x and k′y are the transformed spatial frequencies. The linear spot phase-only distribution is expressed as:
(S303-3) The arced light spot is obtained as follows.
Firstly, a perfect vortex beam is generated through the phase transformation of the axicon. The desired arced light spot is attained by superimposing the discrete phases and discretizing the undesired regions.
The arced light spot with an arbitrary curvature can be obtained by changing the coordinate ratios of x and y, and the rotation matrix.
(S303-4) The closed curve can be obtained as follows.
Firstly, the arced light spots are generated based on the step S303-3. Then, these arced light spots are assembled into enclosed curves varying in size and curvature to obtain the desired closed curve.
In some embodiments, the circular phase map is generated by the perfect vortex light obtained by the axicon phase. The size of the diameter of the perfect vortex spot can be adjusted by adjusting the bottom angle of the axicon. The elliptical spot can be obtained by the perfect vortex spot by rotating the rotational matrix and can also be obtained by the arc-shaped splicing.
(S303-5) The phase map in
φ1=exp[i(lφ+ηr)];
The arced spot shown in
The closed curve shown in
(S4) The light beam modulated in the step (S3) is reflected by the dichroic mirror to the pupil plane of the objective lens and then focused by the objective lens to the target structure for processing. The target material is processed through the following steps.
(S401) The laser is turned on. The vector graphic sequence decomposed in
(S402) The control system moves the translation platform to the next structure partition, and the step (S401) is repeated.
(S403) Steps (S401) and (S402) are repeated to realize single-layer planar fabrication (two-dimensional processing), namely, realize the fabrication of the graphics in
(S5) The control system controls the translation platform to move vertically, and step (S4) is repeated to realize the fabrication of the three-dimensional structure.
(S6) The partition boundary can be repaired as needed by using the curve approximation method, so as to make the fabricated structure more complete, smooth and uniform.
The complex pattern can be quickly generated and fabricated through the laser spots of basic shapes. It can be obtained from the comparison between
In summary, the high-speed partition laser assembling system in the disclosure obtains basic shapes, dimensions, and positional information of the target structure by analyzing vector graphic information, designs the corresponding holographic phase map of the spatial light modulator, and loads the holographic phase map through the spatial light modulator in the laser processing system to carry out the phase modulation. The laser spots of basic shapes (including but not limited to points, line segments, circles, ellipses, curves) corresponding to these basic shapes are directly generated in the focusing plane of the objective lens. Then, the basic structures are automatically performed partition laser assembling on the material, realizing planar fabrication of complex structures. Finally, combining with the layer-by-layer processing technology, three-dimensional processing of complex structures is realized, which significantly reduces the uncertainty, and greatly improves the processing efficiency, precision, uniformity, and smoothness. The method and system proposed in the disclosure can be better applied to industrial manufacturing, micro-nano manufacturing, material manufacturing and other fields.
Described above are merely preferred embodiments of the disclosure, which are not intended to limit the disclosure. It should be understood that any modifications and replacements made by those skilled in the art without departing from the spirit of the disclosure should fall within the scope of the disclosure defined by the appended claims.
Number | Date | Country | Kind |
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202210994800.4 | Aug 2022 | CN | national |
This application is a continuation of International Patent Application No. PCT/CN2023/101695, filed on Jun. 21, 2023, which claims the benefit of priority from Chinese Patent Application No. 202210994800.4, filed on Aug. 18, 2022. The content of the aforementioned application, including any intervening amendments thereto, is incorporated herein by reference in its entirety.
Number | Date | Country | |
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Parent | PCT/CN2023/101695 | Jun 2023 | US |
Child | 18471433 | US |