Claims
- 1. A method for subjecting a part to a predetermined process on a processing section comprising the steps of:(a) supplying a first part placed at a first handling section located at a first side of the processing section; (b) subjecting a second part to the predetermined process at the processing section; (c) after step (b), moving the second part from the processing section to a second handling section located at a second side of said processing section; (d) contemporaneously with step (c) moving the first part from the first handling section to the processing section; (e) after step (d), subjecting the first part to the predetermined process at the processing section; (f) after step (c), discharging the second part at the second handling section; (g) after step (f), supplying a third part at the second handling section; (h) after step (g), moving the third part from the second handling section to the processing section; (i) contemporaneously with step (h), moving the first part from the processing section to the first handling section; (j) after step (h), subjecting the third part to the predetermined process at the processing section; and (k) after step (i), discharging the first part at the first handling section.
- 2. A method according to claim 1, further comprising the steps of:(l) repeating steps(a)-(k) a predetermined number of times.
- 3. A method according to claim 1,wherein in step (a), the first part is placed at a first handling section by movement parallel to a first axis, wherein in step (f), the second part is discharged at the second handling section by movement parallel the first axis, wherein in step (c), the second part is moved parallel to a second axis and a third axis, wherein in step (d) the first part is moved parallel to the second axis and the third axis, wherein the first axis is orthogonal to the second axis, wherein the second axis is orthogonal to the third axis, and wherein the first axis is orthogonal to the third axis.
- 4. A method for subjecting a part to a predetermined process on a processing section between a first handling section and a second handling section, each including a supply stage that supplies a part before applying the predetermined process to the part, and a discharge stage that receives a part after applying the predetermined process to the part, the method comprising the step of:(a) supplying a first part to the first handling section; (b) subjecting a second part to the predetermined process at the processing section; (c) after step (b), moving the second part from the processing section to the second handling section; (d) contemporaneously with step (c), moving the first part from the first handling section to the processing section; (e) after step (d), subjecting the first part to the predetermined process at the processing section; (f) contemporaneously with step (e), moving the first handling section to a supply side; (g) contemporaneously with step (e), moving the second handling section to a discharge side; (h) after step (f), supplying a third part to a first supply stage of the first handling section; (i) after step (g), removing the second part from a second discharge stage of the second handling section; (j) after step (i), moving a fourth part from the second handling section to the processing section; (k) contemporaneously with step (j), moving the first part from the processing section to the first handling section; (l) after step (j), subjecting the fourth part to the predetermined process at the processing section; (m) contemporaneously with step (l), moving the first handling section to the discharge side; (n) contemporaneously with step (l), moving the second handling section to the supply side; (o) after step (m), removing the first part from a first discharge stage of the first handling section; and (p) after step (n), supplying a fifth part to a second supply stage of the second handling section.
- 5. A method according to claim 4, further comprising the step of:(q) repeating steps (a)-(p) a predetermined number of times.
- 6. A method according to claim 4,wherein in step (c), the second part is moved parallel to a second axis and a third axis, wherein in step (d), the first part is moved parallel to the second axis and the third axis, wherein in step (f), the first handling section is moved to the supply side by movement parallel to a first axis, wherein in step (g), the second handling section is moved to the discharge side by movement parallel to the first axis, wherein the first axis is orthogonal to the second axis, wherein the second axis is orthogonal to the third axis, and wherein the first axis is orthogonal to the third axis.
- 7. A method according to claim 4,wherein in step (c), the second part is moved by a second holding section movable between the processing section and the second handling section for holding the second part, wherein in step (d), the first part is moved by a first holding section movable between the processing section and the first handling section for holding the first part, the first holding section and the second holding section are moved by a main motor for driving the first holding section and the second holding section to reciprocate alternately between the first handling section and the processing section and between the second handling section and the processing section, respectively.
- 8. A method according to claim 7, wherein the main motor is a single driving system so constructed as to move the first holding section and the second holding section in the same direction at similar speeds.
- 9. A method according to claim 7, wherein the main motors are separately constructed so as to separately control the first holding section and the second holding section.
- 10. A method for inspecting an integrated circuit device at an inspection section between a first handling section and a second handling section, each including a supply stage that supplies an integrated circuit device before inspecting the integrated circuit device and a discharge stage that receives an integrated circuit device after inspecting the integrated circuit device, the method comprising the step of:(a) supplying a first integrated circuit device to the first handling section; (b) inspecting a second integrated circuit at the inspection section; (c) after step (b), moving the second integrated circuit from the inspection section to the second handling section; (d) contemporaneously with step (c), moving the first integrated circuit device from the first handling section to the inspection section; (e) after step (d), inspecting the first integrated circuit device at the inspection section; (f) contemporaneously with step (e), moving the first handling section to a supply side; (g) contemporaneously with step (e), moving the second handling section to a discharge side; (h) after step (f), supplying a third integrated circuit device to a first supply stage of the first handling section; (i) after step (g), removing the second integrated circuit device from a second discharge stage of the second handling section; (j) after step (i), moving a fourth integrated circuit device from the second handling section to the inspection section; (k) contemporaneously with step (j), moving the first integrated circuit device from the inspection section to the first handling section; (l) after step (j), inspecting the fourth integrated circuit device at the inspection section; (m) contemporaneously with step (l) moving the first handling section to the discharge side; (n) contemporaneously with step (l) moving the second handling section to the supply side; (o) after step (m), removing the first integrated circuit device from a first discharge stage of the first handling section; and (p) after step (n), supplying a fifth integrated circuit device to a second supply stage of the second handling section.
- 11. A method according to claim 10, further comprising the step of:(q) repeating steps (a)-(p) a predetermined number of times.
- 12. A method according to claim 10,wherein in step (c), the second integrated circuit device is moved parallel to a second axis and a third axis, wherein in step (d), the first integrated circuit device is moved parallel to the second axis and a third axis, wherein in step (f), the first handling section is moved to the supply side by movement parallel to a first axis, wherein in step (g), the second handling section is moved to the discharge side by movement parallel to the first axis, wherein the first axis is orthogonal to the second axis, wherein the second axis is orthogonal to the third axis, and wherein the first axis is orthogonal to the third axis.
- 13. A method for manufacturing an integrated circuit device comprising an inspecting process for supplying and discharging an integrated circuit device to an inspection section with the inspection method as described in claim 10.
- 14. A method for inspecting an integrated circuit device on a inspection section comprising the steps of:(a) supplying a first integrated circuit device at a first handling section; (b) inspecting a second integrated circuit device at the inspection section; (c) after step (b), moving the second integrated circuit device from the inspection section to a second handling section; (d) contemporaneously with step (c) moving the first integrated circuit device from the first handling section to the inspection section; (e) after step (d), inspecting the first integrated circuit device at the inspection section; (f) after step (c), discharging the second integrated circuit device at the second handling section; (g) after step (f), supplying a third integrated circuit device at the second handling section; (h) after step (g), moving the third integrated circuit device from the second handling section to the inspection section; (i) contemporaneously with step (h), moving the first integrated circuit device from the inspection section to the first handling section; (j) after step (h), inspecting the third integrated circuit device at the inspection section; and (k) after step (i), discharging the first integrated circuit device at the first handling section.
- 15. A method according to claim 14, further comprising the steps of:(l) repeating steps (a)-(k) a predetermined number of times.
- 16. A method according to claim 14,wherein in step (a), the first integrated circuit device is placed at a first handling section by movement parallel to a first axis, wherein in step (f), the second integrated circuit device is discharged at the second handling section by movement parallel to the first axis, wherein in step (c), the second integrated circuit device is moved parallel to a second axis and a third axis, wherein in step (d), the first integrated circuit device is moved parallel to the second axis and the third axis, wherein the first axis is orthogonal to the second axis, wherein the second axis is orthogonal to the third axis, and wherein the first axis is orthogonal to the third axis.
- 17. A method for subjecting a part to a predetermined process on a processing section comprising the steps of:(a) supplying a first part at a first handling section; (b) subjecting a second part to the predetermined process at the processing section; (c) after step (b), moving the second part from the processing section to a second handling section; (d) contemporaneously with step (c) moving the first part from the first handling section to the processing section; (e) after step (d), subjecting the first part to the predetermined process at the processing section; (f) after step (c), discharging the second part at the second handling section; (g) after step (f), supplying a third part at the second handling section; (h) after step (g), moving the third part from the second handling section to the processing section; (i) contemporaneously with step (h), moving the first part from the processing section to the first handling section; (j) after step (h), subjecting the third part to the predetermined process at the processing section; and (k) after step (i), discharging the first part at the first handling section.
- 18. A method according to claim 17, further comprising the steps of:(l) repeating steps (a)-(k) a predetermined number of times.
- 19. A method according to claim 17,wherein in step (a), the first part is placed at a first handling section by movement parallel to a first axis, wherein in step (f), the second part is discharged at the second handling section by movement parallel the first axis, wherein in step (c), the second part is moved parallel to a second axis and a third axis, wherein in step (d) the first part is moved parallel to the second axis and the third axis, wherein the first axis is orthogonal to the second axis, wherein the second axis is orthogonal to the third axis, and wherein the first axis is orthogonal to the third axis.
Priority Claims (2)
Number |
Date |
Country |
Kind |
8-185200 |
Jul 1996 |
JP |
|
9-127691 |
May 1997 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
This applicationThis reissue application is a continuation of U.S. Reissue patent application Ser. No. 09/754,968, filed Jan. 5, 2001 (now abandoned), which is a reissue application of U.S. patent application Ser. No. 09/234,727, filed Jan. 21, 1999(now issued as U.S. Pat. No. 6,036,431), which is a divisional application of U.S. patent application Ser. No. 08/890,266, filed Jul. 9, 1997 (now issued as U.S. Pat. No. 5,919,024), which is incorporated herein in its entirety by reference.
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Country |
118775 |
Sep 1989 |
CN |
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Apr 1993 |
CN |
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Jan 1997 |
CN |
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Jan 1996 |
DE |
6-64180 |
Sep 1994 |
JP |
6-293434 |
Oct 1994 |
JP |
7-239367 |
Sep 1995 |
JP |
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Entry |
The Collection of Mechanical Automatic Device Illustrations, Nicholas P. Chironis, p. 105, Mar. 1980. |
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Divisions (1)
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Number |
Date |
Country |
Parent |
09/234727 |
Jan 1999 |
US |
Child |
10/232179 |
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US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09/754968 |
Jan 2001 |
US |
Child |
09/234727 |
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US |
Reissues (1)
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Number |
Date |
Country |
Parent |
09/234727 |
Jan 1999 |
US |
Child |
10/232179 |
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US |