1. Field of the Invention
The present invention relates generally to image reject mixers, and more specifically to image reject mixers operating at frequencies reaching several tens of gigahertz and above.
2. Prior Art
As wireless communication progresses, the frequency of operation increases dramatically. Currently frequencies of tens of GHz are employed and are expected to increase over time. Operation at high frequencies is also known to be demanding in power as well as technology. That is, for the same design, the higher the frequency of operation the higher the power consumption. The higher frequency range also requires use of more esoteric manufacturing technologies, such as GaAs, that are capable of effectively addressing the frequency requirements, but such manufacturing technologies have a price from both a technology and a power perspective. As long as demand for such products is low, such technologies are tolerated, but as the need for mass production arises, it is required to utilize technologies that are more power friendly as well as less esoteric.
In order to reduce costs, there is a tendency to move from a more expensive process technology to a lower cost process technology, e.g., moving from GaAs to CMOS. However, a lower cost technology, such as CMOS, may suffer from other disadvantages. In the area of image reject mixers (IRMs) targeted to operate at frequencies in the range of tens of GHz, CMOS based technologies are not currently used, and hence the advantages associated with such technologies are not achieved. Moreover, active components are used, with the Gilbert cell being the prominent solution. An alternative approach is shown in
The current art is limited because of its inability to provide frequency mixers that are low on power consumption, are implemented on cost-effective integrated circuit (IC) technologies, and are capable of operating at high intermediate (IF) frequencies, preferably in the GHz range. It would therefore be advantageous to provide a solution that overcomes the prior art limitations.
The apparatus of the present invention is a complete passive implementation of an image reject mixer (IRM) that is capable of operating at very high frequency. Using a hybrid as part of the IRM circuit enables operation at very high frequencies that also employ a high intermediate frequency (IF). All the components of the design are passive and implementable in MOS technologies providing significant cost and implementation advantages. Furthermore, the apparatus is operative at frequencies that are higher than several tens of GHz.
In accordance with the principles of the invention, the mixer solution, depicted in
The passive mixer (passive meaning incapable of or at least not providing gain) and hybrid combination shown in
Notably, the MOS cell 110 of
To further understand the principles of the invention, reference is made to
In one embodiment of the invention (
The complete passive implementation of the IRM provides significant advantage for low power implementations and especially the use of pervasive CMOS manufacturing technologies. Specifically, it allows an implementation of the IRM for very high frequencies, for example, a 90 nanometer CMOS technology allows for a 60 GHz IRM, otherwise not implementable in such a technology. The use of the hybrid 230 enables high-frequency IF, in the range of a few GHz, a range which is compatible with an RF frequency as high as 60 GHz. Using prior art solutions, the combination of an active mixer with a hybrid would not be operative for such a high RF. Vice versa, the combination of a passive mixer with an operational amplifier instead of the hybrid, is not suitable for such an IF range. Hence the invention overcomes the deficiencies of the prior art. By further using a Lange coupler to implement the phase shifter in combination with the MOS switches and the hybrids, all for an all in a Silicon-based process, without compromising the performance necessary for a mixer operative in an RF range of several tens of GHz and an IF in the range of several GHz, and implementing the circuit on an IC.
While certain preferred embodiments of the present invention have been disclosed and described herein for purposes of illustration and not for purposes of limitation, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention. Specifically, the circuit disclosed is applicable to any Silicon-based manufacturing process, including MOS, BiCMOS and CMOS processes. The upper limit of the RF is determined by the process geometry.
This application claims the benefit of U.S. Provisional Patent Application No. 61/213,756 filed Jul. 10, 2009.
The work that led to the development of this invention was co-financed by Hellenic Funds and by the European Regional Development Fund (ERDF) under the Hellenic National Strategic Reference Framework (NSRF) 2007-2013, according to Contract no. MIKRO2-34 of the project “Next Generation Millimeter Wave Backhaul Radio-THETA”, within the Program “Hellenic Technology Clusters in Microelectronics-Phase-2 Aid Measure”.
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