Patch antenna

Information

  • Patent Grant
  • 6657592
  • Patent Number
    6,657,592
  • Date Filed
    Friday, April 26, 2002
    22 years ago
  • Date Issued
    Tuesday, December 2, 2003
    21 years ago
Abstract
A patch antenna may be integrated into a mobile terminal by associating the patch antenna with a ground plane adapted to remove eddy currents and isolate the antenna from spurious electromagnetic signals. The patch antenna may comprise a kink. Together the patch antenna and ground plane form a surface on which other electrical components may be mounted, such as the transceiver circuitry of the mobile terminal.
Description




FIELD OF THE INVENTION




The present invention relates to an antenna for use in a mobile terminal and specifically to a patch antenna structure that serves a dual purpose within the mobile terminal.




BACKGROUND OF THE INVENTION




First there were pagers, then wireless phones, and more recently, personal digital assistants. Recent events have led to a convergence of these devices under the general appellation of a mobile terminal. Common to these devices in the latest generation is the ability to communicate wirelessly with a remote location.




These mobile terminals are becoming ubiquitous throughout the world. While telecommunication standards may vary from country to country, the wireless revolution is in full swing. Mobile terminals can now be seen almost everywhere, and are becoming the pervasive computing devices envisioned.




Since the initial car and bag phones were introduced, there has been constant pressure on the part of mobile terminal manufacturers to make the mobile terminals smaller. Keypads, batteries, and electrical components have all been reduced in size to make mobile terminals with smaller profiles.




One area that historically has been resistant to changes in size is the antenna of the mobile terminal. This has been due to the need to isolate the antenna from other sensitive electronic components within the mobile terminal from cross talk and other electromagnetic compatibility issues. For example, positioning an antenna close to the electronic components may cause spurious emissions exceeding allowable FCC standards.




A concurrent trend in the mobile terminal industry is to modularize components such that only a few modules contain all of the electrical components for the mobile terminal. Coupled with this modularization effort are efforts to integrate the electrical components into a single chip such that manufacturing costs are decreased.




Heretofore, efforts to remove the traditional stub antenna and integrate an antenna into the body of the mobile terminal have failed.




SUMMARY OF THE INVENTION




The present invention enables an antenna to be integrated within the body of a mobile terminal. Specifically, the present invention takes advantage of a ground plane structure that dissipates eddy currents and isolates a patch antenna from spurious electromagnetic signals. This structure then forms a substrate for other electrical components, such as those that comprise a transceiver front end for the mobile terminal.




In one embodiment, the antennas include a kink to increase the electrical length thereof and to perform impedance matching.











Those skilled in the art will appreciate the scope of the present invention and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.




BRIEF DESCRIPTION OF THE DRAWING FIGURES




The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the invention, and together with the description serve to explain the principles of the invention.





FIG. 1

illustrates a schematic drawing of a mobile terminal such as may be used with the present invention;





FIG. 2

illustrates a top plan view of an exemplary embodiment of the antenna of the present invention;





FIG. 3

illustrates a cross-sectional side view of the embodiment of

FIG. 2

; and





FIG. 4

illustrates a top plan view of a second embodiment of the antenna of the present invention;





FIG. 5

illustrates an alternate embodiment with square overlapping plates;





FIG. 6

illustrates another alternate embodiment with triangular overlapping plates; and





FIG. 7

illustrates a third alternate embodiment with hexagonal overlapping plates.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the invention and illustrate the best mode of practicing the invention. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the invention and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.




The present invention is preferably incorporated in a mobile terminal


20


, such as a cellular telephone, personal digital assistant, or the like. The basic architecture of a mobile terminal


20


is represented in FIG.


1


and may include a receiver front end


22


, a radio frequency transmitter section


24


, an antenna


26


, a duplexer or switch


28


, a baseband processor


30


, a control system


32


, a frequency synthesizer


34


, and an interface


36


. The receiver front end


22


receives information bearing radio frequency signals from one or more remote transmitters provided by a base station. A low noise amplifier


38


amplifies the signal. A filter circuit


40


minimizes broadband interference in the received signal, while downconversion and digitization circuitry


42


downconverts the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams. The receiver front end


22


typically uses one or more mixing frequencies generated by the frequency synthesizer


34


.




The baseband processor


30


processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations. As such, the baseband processor


30


is generally implemented in one or more digital signal processors (DSPs).




On the transmit side, the baseband processor


30


receives digitized data, which may represent voice, data, or control information, from the control system


32


, which it encodes for transmission. The encoded data is output to the radio frequency transmitter section


24


, where it is used by a modulator


44


to modulate a carrier signal that is at a desired transmit frequency. Power amplifier circuitry


46


amplifies the modulated carrier signal to a level appropriate for transmission from the antenna


26


.




The amplified signal is sent to the switch


28


and antenna


26


through an impedance matching circuit


48


, which is configured to set the overall load impedance for the amplifier circuitry


46


to optimize values based on the type or speed of information being transmitted. Typically, the switch


28


and antenna


26


provide a relatively constant load impedance, which is combined with the impedance of the impedance matching circuit


48


to establish an overall load impedance for the amplifier circuitry


46


.




Receiver front end


22


, the radio frequency transmitter section


24


, the frequency synthesizer


34


, the baseband processor


30


, and the control system


32


are sometimes referred to herein as the transceiver circuitry. Since the operation of this circuitry is well understood for those of ordinary skill in the art, any further discussion is omitted.




A user may interact with the mobile terminal


20


via the interface


36


, which may include interface circuitry


52


associated with a microphone


54


, a speaker


56


, a keypad


58


, and a display


60


. The interface circuitry


52


typically includes analog-to-digital converters, digital-to-analog converters, amplifiers, and the like. Additionally, it may include a voice encoder/decoder, in which case it may communicate directly with the baseband processor


30


.




The microphone


54


will typically convert audio input, such as the user's voice, into an electrical signal, which is then digitized and passed directly or indirectly to the baseband processor


30


. Audio information encoded in the received signal is recovered by the baseband processor


30


, and converted into an analog signal suitable for driving speaker


56


by the I/O and interface circuitry


52


. The keypad


58


and display


60


enable the user to interact with the mobile terminal


20


, such as inputting numbers to be dialed, address book information, or the like, as well as monitor call progress information.




Other conventional circuitry may be integrated into the mobile terminal


20


as is well understood. For example, a global positioning satellite (GPS) receiver may be integrated into the mobile terminal


20


. A Bluetooth module may be integrated into the mobile terminal


20


along with other short-range communication circuits, such as an IR circuit. The mobile terminal


20


operates according to conventional telecommunications standards such as GSM, AMPS, D-AMPS, and other similar international telecommunications standards as needed or desired.





FIG. 2

illustrates one embodiment of the present invention wherein the antenna


26


is seen positioned over a substrate structure


70


. In the embodiment shown, antenna


26


comprises a first radiating element


72


and a second radiating element


74


. First and second radiating elements


72


,


74


may be used together for diversity reception and transmission, or the first radiating element


72


may be used for transmission and the second radiating element


74


may be used for reception. Greater or lesser numbers of radiating elements may be used as needed or desired.




In the embodiment shown, the radiating elements


72


,


74


each comprise a u-shaped kink


76


and are positioned over a first ground plane


78


. The first ground plane


78


is comprised of two distinct levels of overlapping conductive plates


80


,


82


(better seen in FIG.


3


). For a full explanation of the first ground plane


78


, reference is made to U.S. Pat. No. 6,262,495, which is hereby incorporated by reference in its entirety. The overlapping conductive plates


80


,


82


are arranged in two distinct levels to reduce eddy currents within the first ground plane


78


and help provide directionality for the radiating elements


72


,


74


as explained in the incorporated '495 patent.




The u-shaped kink


76


may be used to extend the electrical length of the radiating elements


72


,


74


, thereby effectively tuning the antenna


26


. The kink


76


may also be used for impedance matching, or to provide dual band functionality for the antenna


26


. The kink


76


adds inductive loading to the radiating elements


72


,


74


while also increasing the capacitive coupling between the radiating elements


72


,


74


and the first ground plane


78


. Likewise, the kink


76


may be an electric short (i.e., the electromagnetic current on the radiating elements


72


,


74


couples across the kink


76


rather than passing around the kink


76


) at certain frequencies, thus creating a short antenna


26


at one frequency where the kink is shorted and a longer antenna


26


at other frequencies where the kink


76


is not bypassed. Geometries other than the kink


76


may be used as needed or desired.




The substrate structure


70


is also illustrated in

FIG. 3

, wherein the layered relationship of the various components is better illustrated. Specifically, the substrate structure


70


comprises the antenna


26


, the first ground plane


78


, a second ground plane


84


, and an RF circuit element


86


. Distinct plies


88


of dielectric material


88


A,


88


B,


88


C, and


88


D separate the various electric components. In an exemplary component, the plies


88


are formed from FR


4


. Other dielectric materials may also be used, and material type may vary between plies


88


if needed or desired.




The RF circuit element


86


may comprise as much of the transceiver circuitry as needed or desired. In an exemplary embodiment, the RF circuit element


86


comprises at least the duplexer


28


, and may also comprise the radio frequency transmitter section


24


and the receiver front end


22


. Still further, the frequency synthesizer


34


and baseband processor


30


may be considered an RF circuit element


86


for the purposes of the present invention. Preferably the RF circuit element


86


is printed or mounted on the ply


88


D using conventional integrated circuit printing technology, or is mounted thereon using conventional fabrication techniques.




The antenna


26


may be electrically connected to the RF circuit element


86


using any appropriate electrical connections. In an exemplary embodiment, a through-hole via


90


is used to connect the antenna


26


to the RF circuit element


86


. Other via connectors may also be used so long as the electrical connection therebetween is not shorted by inadvertent contact with either the first ground plane


78


or the second ground plane


84


. The first ground plane


78


is electrically connected to the second ground plane


84


using via connectors


92


as is explained in the incorporated '495 patent.




The second ground plane


84


acts as a ground plane for any of the electronic components of the RF circuit element


86


as would be well understood. Thus, electrical connections may exist between RF circuit element


86


and the second ground plane


84


as needed or desired.




The two distinct levels of overlapping conductive plates


80


,


82


are illustrated in

FIG. 2

as octagons. Please note that other polygonal and irregular shapes are contemplated. Specifically, triangles, hexagons, squares and circles are also acceptable plate shapes (see FIGS.


5


-


7


). The octagonal shapes illustrated do allow for spaces therebetween such that the through-hole via


90


may pass therethrough without intersecting either set of plates


80


,


82


. If the through-hole via


90


does pass through a plate


80


,


82


, clearances must be made so as to avoid a short circuit therebetween.




Collectively, the substrate structure


70


is well-suited for incorporation into a mobile terminal


20


in that a single modular substrate structure


70


may have a footprint not much larger than one and one half inches squared (3.81 cm×3.81 cm). The size of the radiating elements


72


,


74


may be varied according to the desired operating frequencies. This modular structure has the antenna


26


, a ground plane, and as much of the transceiver circuitry as desired for easy incorporation into a mobile terminal


20


.




While substantially similar to the radiating elements


72


,


74


, a second embodiment relies on inverted F radiating elements


72


A,


74


A as illustrated in FIG.


4


. It should be appreciated that the placement of the radiating elements


72


A,


74


A relative to one another may be varied to provide for optimal matching and minimal crosstalk as needed or desired. For example, the radiating elements


72


A,


74


A might be rotated in the plane in which they lie so that the bars of the F both faced in, if desired. Other configurations are likewise within the scope of the present invention.




Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present invention. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.



Claims
  • 1. An antenna structure, comprising:a substrate structure; a radiating element; a ground plane positioned proximate said radiating element and secured to a first side of said substrate structure, said ground plane comprising a bi-leveled sequence of staggered, overlapping conductive plates; at least one RF circuit element secured to a second side of said substrate structure, opposite said first side; and said radiating element operatively connected to said RF circuit element.
  • 2. The antenna structure of claim 1 wherein said at least one RF circuit element is selected from the group consisting of:a power amplifier; a receiver; a transmitter; a duplexer; a frequency synthesizer; a baseband processor; and a modulator.
  • 3. The antenna structure of claim 1 wherein said at least one RF circuit element is operatively connected to said radiating element with a via extending through the ground plane.
  • 4. The antenna structure of claim 1 wherein said radiating element comprises a patch antenna.
  • 5. The antenna structure of claim 4 wherein said patch antenna comprises a kink.
  • 6. The antenna structure of claim 1 wherein said radiating element comprises an inverted F antenna.
  • 7. A method of constructing an antenna structure, comprising:forming a ground plane from a bi-leveled sequence of staggered, overlapping plates; positioning a radiating element over the ground plane on one side of a substrate structure; securing at least one RF circuit element to an opposite side of the substrate structure; electrically connecting said radiating element to said at least one RF circuit element.
  • 8. The method of claim 7 wherein electrically connecting said radiating element to said at least one RF circuit element comprises electrically connecting said radiating element to a power amplifier.
  • 9. The method of claim 7 wherein positioning a radiating element over a ground plane comprises positioning a patch antenna over a ground plane.
  • 10. The method of claim 9 wherein positioning a patch antenna over a ground plane comprises positioning a patch antenna with a kink over a ground plane.
  • 11. The method of claim 7 wherein positioning a radiating element over a ground plane comprises positioning an inverted F antenna over a ground plane.
  • 12. An antenna structure comprising:a substrate structure comprising a first side and a second side; a first ground plane comprising a plurality of staggered, overlapping plates positioned on two distinct levels, said first ground plane positioned on said first side; a patch antenna comprising a kink positioned generally parallel to and over said first ground plane on said first side; and an RF circuit element secured to said second side and electrically connected to said patch antenna with a through-hole via.
  • 13. The antenna structure of claim 12 wherein said overlapping plates comprise overlapping octagonal plates.
  • 14. The antenna structure of claim 12 wherein said overlapping plates comprise overlapping triangular plates.
  • 15. The antenna structure of claim 12 wherein said overlapping plates comprise overlapping hexagonal plates.
  • 16. The antenna structure of claim 12 wherein said overlapping plates comprise overlapping square plates.
  • 17. The antenna structure of claim 12 wherein said substrate structure comprises FR4.
  • 18. The antenna structure of claim 12 wherein said substrate structure comprises a plurality of plies of dielectric material;a first ply positioned between said two distinct levels of overlapping plates; a second ply positioned between an upper of said two distinct levels of overlapping plates and said patch antenna; and a third ply positioned between a lower of said two distinct levels of overlapping plates and said RF circuit element.
  • 19. An antenna structure comprising:a substrate structure comprising a first side and a second side; a first ground plane comprising a plurality of overlapping plates positioned on two distinct levels, said first ground plane positioned on said first side; a patch antenna comprising a kink positioned generally parallel to and over said first ground plane on said first side; an RF circuit element positioned on said second side and electrically connected to said patch antenna with a through-hole via; and a second ground plane positioned between said ground plane of overlapping plates and said RF circuit element.
  • 20. An antenna structure comprising:a substrate structure comprising a first side and a second side; a first ground plane comprising a plurality of overlapping plates positioned on two distinct levels, said first ground plane secured to said first side; an inverted F antenna positioned generally parallel to and over said first ground plane on said first side; and an RF circuit element secured to said second side and electrically connected to said inverted F antenna with a through-hole via, wherein the overlapping plates have spaces therebetween such that the through-hole via may pass therethrough without insecting either set of plates.
US Referenced Citations (7)
Number Name Date Kind
6166705 Mast et al. Dec 2000 A
6262495 Yablonovitch et al. Jul 2001 B1
6300907 Lazar et al. Oct 2001 B1
6426722 Sievenpiper et al. Jul 2002 B1
6469673 Kaiponen Oct 2002 B2
6483481 Sievenpiper et al. Nov 2002 B1
6552686 Ollikainen et al. Apr 2003 B2
Non-Patent Literature Citations (1)
Entry
Broas, Romulo F. Jimenez, Sievenpiper, Daniel F., and Yablonovitch, Eli, “A High-Impedence Ground Plane Applied to a Cellphone Handset Geometry,” IEEE Transactions on Microwave Theory and Techniques, vol. 49, No. 7, Jul. 2001, pp. 1262-1265.