Pattern wafer

Information

  • Patent Grant
  • D791091
  • Patent Number
    D791,091
  • Date Filed
    Friday, June 24, 2016
    8 years ago
  • Date Issued
    Tuesday, July 4, 2017
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • D06 309
    • CPC
    • C30B25/02
    • C30B25/04
    • C30B25/12
    • C30B25/18
    • C30B25/186
    • C30B25/20
    • H01L21/2018
    • H01L21/2003
    • H01L21/02367
    • H01L21/0237
    • H01L21/02428
    • H01L21/0243
    • H01L21/02433
    • H01L21/02436
    • H01L21/31116
    • H01L21/32139
    • H01L21/31144
    • H01L21/0337
    • H01L21/31138
    • H01L21/02439
    • H01L21/3213
    • H01L21/32131
    • H01L21/32133
    • H01L21/32135
    • H01L21/823807
    • H01L21/84
    • H01L21/31055
    • H01L21/31053
    • H01L21/76819
    • H01L21/31111
    • H01L33/16
    • H01L29/02
    • H01L29/04
    • H01L29/045
    • H01L29/06
    • H01L29/0603
    • H01L29/66765
    • H01L29/66757
    • H01L27/1203
    • H01L27/1218
    • H01L27/1222
    • H01S5/3202
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front elevational view of a pattern wafer, showing our new design;



FIG. 2 is a rear elevational view thereof;



FIG. 3 is a left side elevational view thereof;



FIG. 4 is a right side elevational view thereof;



FIG. 5 is a top plan view thereof;



FIG. 6 is a bottom plan view thereof;



FIG. 7 is an enlarged front portion view taken along line 7-7 in FIG. 1;



FIG. 8 is an enlarged bottom portion view taken along line 8-8 in FIG. 6; and,



FIG. 9 is a top perspective view of FIG. 7.


Claims
  • The ornamental design for a pattern wafer, as shown and described.
Priority Claims (1)
Number Date Country Kind
2015-029186 Dec 2015 JP national
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