Claims
- 1. A percutaneous absorption preparation comprising a drug-impermeable backing and an adhesive layer provided thereon which comprises a pressure-sensitive polymer adhesive and a percutaneous absorption drug (solid at room temperature) present in the adhesive layer in an amount which is at least 1.2 times its saturated solubility in the adhesive, wherein the excess drug in the adhesive layer is in a continuous recrystallized and networked state formed by applying a physical simulation to the adhesive which induces and accelerates recrystallization of the drug such that the excess drug is recrystallized in a continuous and networked state.
- 2. The preparation as claimed in claim 1, wherein the pressure-sensitive adhesive prior to the incorporation of the percutaneous absorption drug (solid at room temperature) has an apparent viscosity at room temperature of 5.times.10.sup.6 poise or less.
- 3. The preparation as claimed in claim 2, wherein the pressure-sensitive adhesive prior to the incorporation of the percutaneous absorption drug (solid at room temperature) has an apparent viscosity at room temperature of from 5.times.10.sup.3 to 1.times.190.sup.6 poise.
- 4. The preparation as claimed in claim 1, wherein the amount of the drug present in the adhesive layer is 1.5 to 10 times its saturated solubility in the adhesive.
- 5. The preparation as claimed in claim 1, wherein the layer comprising the pressure-sensitive adhesive and the percutaneous absorption drug (solid at room temperature) has an apparent viscosity at room temperature of from 7.times.10.sup.4 to 6.times.10.sup.6 poise, which is at least two times the apparent viscosity at room temperature of the pressure-sensitive adhesive containing no drug.
- 6. The preparation as claimed in claim 1, wherein the apparent viscosity at room temperature of the pressure-sensitive adhesive containing the drug is 2.5 to 50 times the apparent viscosity of the pressure-sensitive adhesive containing no drug.
- 7. A process for producing a percutaneous absorption preparation which comprises:
- dissolving in a solvent a pressure-sensitive adhesive and a percutaneous absorption drug (solid at room temperature) in an amount which is at least 1.2 times its saturated solubility in the adhesive to prepare a coating solution;
- coating the coating solution on a surface of a backing which is impermeable to the drug;
- drying the coating solution to form an adhesive layer; and
- applying a physical stimulation to the adhesive which induces and accelerates recrystallization of the drug, whereby the excess drug is recrystallized in the adhesive layer in a continuous and networked state.
- 8. The process as claimed in claim 7, wherein a releasing film is temporarily adhered on the adhesive layer prior to application of the physical stimulation.
- 9. The process as claimed in claim 7, wherein the physical stimulation is applied by a cutting blade.
- 10. The process as claimed in claim 7, wherein the physical stimulation is applied by a perforation treatment.
Priority Claims (1)
Number |
Date |
Country |
Kind |
63-88551 |
Apr 1988 |
JPX |
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Parent Case Info
This is a continuation of application Ser. No. 07/336,149 filed Apr. 11, 1989 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4719226 |
Otsuka et al. |
Jan 1988 |
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4784856 |
Fukuda et al |
Nov 1988 |
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Foreign Referenced Citations (2)
Number |
Date |
Country |
0156080 |
Dec 1984 |
EPX |
2095108 |
Mar 1981 |
GBX |
Non-Patent Literature Citations (2)
Entry |
Patent Abstracts of Japan, vol. 12, No. 242 (C-510)[3089]. |
European Search Report EP 89 10 6337. |
Continuations (1)
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Number |
Date |
Country |
Parent |
336149 |
Apr 1989 |
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