Patent Application
20250025772
This invention relates generally to a peripheral input device module that is connectable to a main control device to form a coherent modular control device and provide one or more electrical signals to the main control device in response to a user interaction with the input device module.
A peripheral input device is an auxiliary device used to provide signals or to transfer data or command functions to a computing device, usually for controlling the computing device. Well known examples include computer peripherals such as a keyboard and mouse, consumer products such as handheld television controllers, and gaming controllers. These peripheral input devices are most commonly in wired or wireless communication with the computing device and provide user functionality to the computing device.
More recently, there is increasing interest in modular control devices that are capable of changing its input configuration to provide a user customisable control interface. Modular control devices comprise a main control device and one or more physically separate control components or peripherals that attach to the main device to form a coherent single physical object or modular control device. Each control component can provide a different user input functionality to the main device to change how the user interacts with the resulting control device.
For example, U.S. Pat. No. 8,241,126B2 discloses a video game controller with swappable modular control input components such as joysticks, trackballs and directional pads. Each input component is connectable to a main controller and provides input data to the main controller based on a user interaction with the input component. In this case, the input components are peripheral devices for the main controller, which is itself a peripheral device to a remote computing device (the game console). Each input component comprises specific control input hardware such as capacitive and/or electromechanical sensors, a microprocessor and sensor circuitry for converting user actions into data that is read by the main controller hardware, and an electrical interface or connector for connecting to an input port of the main controller. As the type of data depends on the type of input component (e.g. joystick, directional pad etc.) control input hardware is also configured to store and provide information indicating which type of input component it is.
Other applications of modular control devices include, but are not limited to, automotive interiors (e.g. steering wheel, centre console, dashboard, and/or door handle control inputs), where it is desirable to provide customisable control interfaces that can be replaced based on the specific needs of the user e.g. accounting for user preferences, use cases and/or physical impairments.
Although known modular control devices provide generally for swappable peripheral input devices, these peripheral input devices generally require integration of a number of various electronic components in both the main and peripheral devices for measuring and processing data as well as means for storing data on the peripheral for identifying the peripheral device. U.S. Pat. No. 10,188,939B2 is another example of a modular control device with a main and peripheral elements, where each peripheral module comprises electronic components including a storage element which stores a module identifier that is collected by the main device.
These peripheral input devices are also limited in their form and function by conventional design restrictions associated with accommodating traditional capacitive sensors, buttons and joysticks. These standard input components generally require electronic circuitry and rely on the presence of a printed circuit board, and a large number of metal wires, traces and electrodes in the peripheral device to provide even relatively simple user input functionality, whereby the number and size of such components typically scales with the device size.
As such, the design freedom of known peripherals is limited and their electronic circuitry often complex. In addition, their manufacture and assembly is both costly and difficult. It is therefore desirable to develop peripheral devices that are simpler and less costly to manufacture and assemble without sacrificing user functionality, and offer greater design freedom in form and function.
Aspects and embodiments of the present invention have been devised with the foregoing in mind.
Described herein are peripheral devices that do not require any conventional metal-based electronic components and circuitry to provide the user with input functionalities and can be completely fabricated from conductive and non-conductive thermo-formable materials using traditional moulding processes. This allows sensor structures such as buttons, joysticks and other interactive functionalities to be produced in any desired shape, form, size, appearance and feel, providing almost infinite customisation opportunities that also allow to fundamentally change the aspect of the coherent modular control device and the mode of interaction with it. The peripheral devices described herein, although completely electrically passive, can also be identified by the main device through the use of specific electrical signal patterns obtained from the sensing electrodes once connected to the main device.
According to a first aspect of the invention, there is provided a peripheral input device module that is connectable to a main control device to provide one or more electrical signals to the main control device in response to a user interaction with the peripheral input device module. The peripheral input device module may be a capacitive sensing device configured to provide touch and/or pressure/force-based sensing functions. When connected, the peripheral input device module and main control device may form a coherent modular control device. In the context, a coherent modular control device means a single physical object. The peripheral input device module may be releasably attachable to the main control device to form the coherent modular control device. The peripheral input device module may comprise one or more, or a plurality of sensing electrodes formed of or comprising a thermo-formable non-metallic conductive material. The or each sensing electrode may be configured to provide one or more electrical signals in response to a change in capacitance between (i) a sensing portion of the respective sensing electrode and a conductive object being near to or in contact with the respective sensing portion, and/or (ii) a sensing portion of the respective sensing electrode and a sensing portion of another of the sensing electrodes or another sensing portion of the respective (same) sensing electrode. At least one of the sensing electrodes may comprise one or more connector portions that form an electrical connector for connection to an electrical connector of the main control device. The connector portions may be arranged in an array. Each connector portion may be configured to electrically connect to a respective electrical contact of a capacitive sensing circuit of the main control device for measuring the electrical signals.
In this context non-metallic material means not a metal, or alloy such as a gold or nickel gold, and a thermo-formable material means a material that can be heated to a pliable forming temperature, formed to a specific shape in a mould, and optionally trimmed to create a usable product.
Unlike known peripheral input devices, the capacitive sensing electrodes are formed of a non-metallic conductive thermo-formable material and fulfil both capacitive sensing and electrical connector roles. The conductive sensing portions capacitively interact with other conductive objects, such as a user's finger or another sensing portion (of the same or different sensing electrode), to provide the user input functionality, and the connector portions form an electrical connector for releasably electrically connecting the peripheral device to electrical contacts of a capacitive sensing circuit of the main control device. As such, the signal paths and electrical connection from the capacitive sensing portions to the electrical contacts of the sensing circuit of the main control device are provided entirely by the non-metallic conductive sensing electrodes. This eliminates the need for producing and integrating PCBs, metal tracks and/or wires in the peripheral device. Further, no signal measurement or processing is performed by the peripheral input device. As such, the peripheral input device module can be fully electrically passive and does not require any conventional metal-based electronic circuit components or hardware to provide the user input functionality, such as metal electrodes, connectors, wires or traces, resistors, transistors, capacitors, inductors, diodes, integrated circuits, processors, storage devices, or batteries.
Advantageously, the peripheral input device module can be formed or comprised substantially entirely of non-metallic conductive and non-conductive thermo-formable materials that can be formed by one or more moulding processes into almost any 3D shape and size, and which can be substantially rigid, flexible, and/or pliable/deformable. This allows a wide range of capacitive sensing functionalities to be achieved through suitable design of the conductive sensing electrodes and non-conductive elements of the peripheral device. This also allows the peripheral device to provide a range of “feel” or tactile interface options based on the materials used. As such, the peripheral input device module of the present invention is not limited in form or function by conventional design restrictions imposed on known peripheral input devices that must accommodate various metal-based circuit components and capacitive sensor electrodes. In addition, due its construction of mouldable conductive and non-conductive materials, the peripheral input device module is relatively inexpensive to manufacture and simple to assemble compared to conventional metal-electronic based peripheral input devices.
The sensing electrodes and/or the non-conductive elements may have, at least in part, a three-dimensional form. In this context, a three-dimensional form means a shape with one or more substantially non-planar surfaces and/or a varying (non-uniform) thickness cross-section. The sensing electrodes may have a substantially uniform or non-uniform thickness. For example, the sensing may have a thickness greater than that of a film or coating (such as a printed ink or metal trace/tack on a typical printed circuit board), e.g. greater than 0.5 mm or 1 mm.
The sensing electrodes may be substantially rigid, pliable and/or deformable, and need not all have the same material properties (i.e. mechanical and electrical properties). Suitable materials for the sensing electrodes include but are not limited to conductive plastics, such as conductive thermoplastic polyurethane (TPU), conductive thermoplastic elastomer (TPE), conductive acrylonitrile butadiene styrene (ABS), conductive silicones, conductive polyurethane (PU), and conductive ethylene vinyl acetate (EVA).
The peripheral input device module may comprise various non-conductive elements formed of or comprising a non-conductive thermo-formable material. Non-conductive material may be used to support and retain the sensing electrodes, be formed or provided on/over the sensing portions as a cover or interface layer, and/or be formed or provided between sensing portions. The non-conductive material may be substantially rigid, or flexible, pliable and/or deformable. Suitable materials for the non-conductive elements include, but are not limited to: non-conductive TPU, non-conductive TPE, non-conductive ABS, non-conductive silicones, and fabrics.
The peripheral input device module may comprise a housing. The housing may be formed of or comprise, at least in part, a substantially rigid thermo-formable material. The housing may be non-conductive. The housing may be configured to support and retain the sensing electrodes. The housing may form or comprise an integral connector body portion configured to hold the connector portions in place. The connector body portion may be configured to engage the connector portions to support and hold them in place. The connector body portion may be located on a (connection) side of the housing. The connector body portion may comprise one or more openings, e.g. in the connection side, through which the connector portions extend.
The connector portions may be arranged in an array at the connector body portion. The connector body portion may comprise one or more integral spacer elements that extend between adjacent connector portions to maintain a separation between them. The or each opening may be at least partially defined between adjacent spacer elements. As such, the connector body portion may provide structural/mechanical support for the connector portions and the resulting electrical connector.
The connector body portion may be configured to frictionally or mechanically engage the connector portions. In this case, the or each opening may be further defined between a pair of opposing engagement surfaces configured to frictionally engage the connector portions. The connector body portion may be defined by two separate parts integrally formed with respective separate parts of the housing. Each part of the connector body portion may comprise one of the engagement surfaces such that the one or more openings are formed, and/or the connector portions are gripped or clamped between opposing engagement surfaces, when assembled.
Alternatively, the connector portions may be integral with the connector body portion, e.g. the connector portions may be co-moulded with the connector body portion.
Each connector portion may comprise an exposed contact portion configured to mechanically contact a corresponding electrical contact of the sensing circuit of the main control device to form an electrical connection between them. The exposed contact portions may be configured to electrically contact metallic or non-metallic electrical contacts of the sensing circuit of the main control device. The connector portions may be configured to form an overlapping contact or an end-on contact with the respective electrical contacts of the main control device. The connector portions may be substantially elongated. The exposed contact portion of a connector portion may be provided on a distal end or a side of the connector portion. The exposed contact portion may be configured to mechanically inter-engage with and/or bias against a corresponding electrical contact of the sensing circuit of the main control device. Optionally or preferably, each contact portion may comprise one or more of: a projection, a recess, and a resiliently deformable biasing element such as a spring finger.
The peripheral input device may comprise a non-conductive cover provided on or over at least a portion of the housing. The cover may be formed or comprises a substantially soft, flexible, deformable and/or pliable non-conductive thermo-formable material. The cover may be provided on or over a sensing portion of at least one of the one or more sensing electrodes.
The sensing circuit of the main control device may have a plurality of electrical contacts including at least one ground contact and at least one sense contact for measuring capacitance.
Where there are a plurality of sensing electrodes, at least one of them may be configured as a ground electrode having a connector portion configured to connect to a ground contact of the sensing circuit of the main control device. The ground electrode may be configured to provide a ground plane. The ground plane may have one or more sensing portions configured to capacitively interact with another sensing electrode of another sensing electrode.
At least one sensing electrode without a connector portion may be configured to electrically or mechanically contact a sensing electrode with a connector portion, optionally the ground electrode, to connect to the sensing circuit of the main control device.
The ground electrode may have two or more connector portions wherein at least one of the two or more connector portions is configured to connect to a ground contact of the sensing circuit of the main control device and at least one other of the two or more connector portions is configured to connect to a respective sense contact of the sensing circuit of the main control device. When connected to the main control device, the ground electrode may be configured to electrically short the respective sense contact(s) of the main control device to ground. In doing so, this may provide a predefined electrical signal pattern or sequence at the electrical contacts of the sensing circuit of the main control device for identifying the peripheral input device module from other peripheral input device modules. The connector portions may be arranged in an array and the at least one other of the two or more connector portions of the ground electrode may be arranged in a predefined position in the array to provide the predefined electrical signal pattern or sequence.
Using electrical signal patterns to identify the peripheral device eliminates the need for conventional on-board storage elements that are used to store device IDs in conventional peripheral input devices.
The peripheral input device module may comprise a locking mechanism configured to engage a locking mechanism of the main control device to releasably attach the peripheral input device module to the main control device, optionally or preferably, by mechanical engagement and/or magnetic attraction. The connector body portion of the housing may form or comprise the locking mechanism. The connector body portion may comprise one or more locking elements configured to inter-engage with complementary locking elements of the main control device. Additionally or alternatively, the connector body portion may comprise one or more magnets configured to engage one or more magnets of opposite polarity on the main control device.
The locking mechanism may be or comprises a slide rail mechanism. The array of connection portions, electrical connector and/or the connector body portion may extend for a length along a side of the peripheral input device module in a connection or slide direction. The one or more locking elements may comprise one or more male or female rail members that extend at least part of the length of the connector body portion in the slide or connection direction. The rail members may be configured to slidingly engage one or more complementary rail members of the main control device.
A first sensing portion of a first sensing electrode may be configured to move relative to a second sensing portion of a second sensing electrode or second sensing portion of the first sensing electrode, in response to an applied force or pressure. Relative movement between said first and second sensing portions may cause the change in capacitance between them. The first and second sensing portions may be separated by a distance and relative movement between them may change the distance. The first and second sensing portions may be separated by a gap, or a substantially deformable, flexible, and/or pliable thermo-formable non-conductive material may be provided between them.
One of the first or second sensing portions may comprise a collapsible element. The collapsible element may be configured to collapse and resiliently deform in response to an applied force or pressure at or above a threshold. A first applied force or pressure below the threshold may change a distance or separation between the first and second sensing portions and provide a first change in the capacitance. A second applied force or pressure (greater than the first force/pressure) at or above the threshold may collapse the collapsible element and provide a second change in the capacitance (greater than the first change) and/or tactile feedback to the user. Optionally or preferably, proximity of a conductive object to at least one of the first and second sensing electrodes may cause a third change in capacitance (less that the first and second change). A layer of substantially deformable, flexible, and/or pliable thermo-formable non-conductive material may be provided on or over the collapsible element. The collapsible element may be substantially dome-shaped. Optionally or preferably, the first or second sensing electrode with the collapsible element may be configured to provide a ground plane when connected to the main control device.
The housing may comprise one or more openings. A sensing portion of at least one of the sensing electrodes may extends at least partially into or through at least one of the one or more openings for receiving a user interaction.
Alternatively or additionally, the peripheral input device module comprises a movable actuator. The movable actuator may extend through one of the one or more openings to a sensing portion of at least one of the sensing electrodes. The actuator may be configured to receive a user interaction and to transmit the user interaction to a sensing portion within the housing. The actuator may be formed of or comprise one or more thermo-formable materials. The actuator may be formed of or comprise multiple sub-parts that are assembled together.
The movable actuator may be or comprise a joystick. The joystick may comprise a handle portion that extends through the one of the one or more openings and a base portion located within the housing. The base portion may comprise a first sensing electrode. The base portion or joystick may be configured to pivot about a fulcrum to move a sensing portion of the first sensing electrode relative to a set of second sensing portions distributed about the fulcrum. Each second sensing portion may be associated with a (different) respective second sensing electrode, where each second electrode may include a connector portion. Pivoting of the base portion or joystick may cause a change in capacitance between the first sensing portion and (one or more of) the second sensing portions and thereby provide one or more electrical signals for detecting a tilt direction and angle of the joystick with respect to the housing.
The first sensing electrode of the base portion may not include a connector portion and may be configured to connect to an electrical contact of the sensing circuit of the main control device through electrical contact with a fourth sensing electrode which does include a connector portion. The connector portion of the fourth sensing electrode may be configured to connect to a ground contact of the sensing circuit of the main control device. The fourth sensing electrode may be configured as a ground electrode or a ground plane.
The fulcrum may be formed of a non-metallic conductive or non-conductive thermo-formable material. The fulcrum may be integral with the housing or the fourth sensing electrode. Where the fulcrum is integral with the fourth sensing electrode, the first sensing electrode of the base portion may be configured to connect to an electrical contact of the sensing circuit of the main control device through electrical or mechanical or physical contact with the fulcrum. Where the fulcrum is integral with the housing, the first sensing electrode of the base portion may be configured to electrically contact the fourth sensing electrode through a connector element.
The joystick may be moveable between a lower (or inner) position (with respect to the housing) in which the first sensing portion capacitively interacts with the set of first sensing portions disposed below the first sensing portion for detecting a tilt angle and direction, and an upper (or outer) position (with respect to the housing) in which the first sensing portion capacitively interacts with the set of third sensing portions disposed above the first sensing portion for detecting a translation of the joystick in one or more lateral directions. The joystick may be moveable between a lower position in which the base portion or joystick is pivotable about the fulcrum for detecting a tilt direction and angle of the joystick, and an upper position in which the base portion or joystick is translatable in one or more lateral directions with respect to the fulcrum to move the sensing portion of the first sensing electrode relative to a set of third sensing portions distributed about the fulcrum or handle portion. The set of third sensing portions may be disposed above the first sensing portion/electrode or base portion. Each third sensing portion may be associated with a (different) respective third sensing electrode, where each third electrode may include a connector portion. Translation of the base portion or joystick may cause a change in capacitance between the first sensing portion and (one or more of) the third sensing portions and thereby provide one or more electrical signals for detecting a translation of the joystick in one or more lateral directions with respect to the housing.
The joystick may further comprise a resiliently deformable biasing element configured to bias the joystick to a rest position and deform to permit movement of the joystick away from the rest position. The rest position may include an angular position and optionally a rest lateral position. The joystick may be aligned with a rest axis that insects the fulcrum when in the rest position. The rest position may include the lower (or inner) position. The resiliently deformable element may be formed of or comprise a non-metallic conductive thermo-formable material or a non-conductive thermo-formable material. Where it is formed of a metallic conductive thermo-formable material it may be integral with, or in electrical contact with, the first sensing electrode. The resiliently deformable element may be or comprise a spiral spring, or a disk-like member. Alternatively, there may be a plurality of resiliently deformable biasing elements distributed about the joystick.
A non-conductive material may be provided on or over a sensing portion of at least one of the one or more sensing electrodes. The non-conductive material may be formed of or comprise a thermo-formable non-conductive material. The thermo-formable non-conductive material may be substantially rigid or substantially flexible, deformable or pliable.
According to a second aspect of the invention there is provided a modular control system. The modular control system may comprise a main control device and one or more peripheral input device modules of the first aspect. The one or more peripheral input device modules may be configured to interchangeably connect and/or attach to the main control device to provide one or more electrical signals to the main control device in response to a user interaction with a connected peripheral input device module. When connected, a peripheral input device module and main control device may form a coherent modular control device. The main control device module may comprise a capacitive sensing circuit configured to measure the one or more electrical signals provided by a connected peripheral input device module. The capacitive sensing circuit may comprise a plurality of electrical contacts for connecting to the connector portions of the one or more peripheral input device modules. The plurality of electrical contacts may form at least part of an electrical connector of the main control device for connecting to the electrical connector of the one or more peripheral input device modules. The main control device may comprise an electrical connector comprising a plurality of electrical contacts of the capacitive sensing circuit. Each electrical contact may be configured to electrically contact a respective connector portion of the connected peripheral input device module.
The electrical contacts of the capacitive sensing circuit may be configured to mechanically contact an exposed contact portion of a respective connector portion to establish an electrical connection therebetween. Each electrical contact of the capacitive sensing circuit may be configured to abut, inter-engage with and/or bias against the exposed contact portion of a respective connector portion. Optionally or preferably, each electrical contact of the capacitive sensing circuit and/or the contact portion of the respective connector portion may comprise one or more of: a projection, a recess, and a biasing element.
The electrical contacts of the capacitive sensing circuit may be formed of or comprise a metal or metallic material. The electrical contacts may comprise a metal or metallic contact pad and/or a metal or metallic mechanical biasing element such as a spring finger or pogo pin. The electrical contacts of the capacitive sensing circuit may further comprise non-metallic conductive thermo-formable material. The non-metallic conductive thermo-formable material may be provided over and/or extend from the metal electrical contact. The electrical contacts may further comprise a connection element formed of or comprising a non-metallic conductive thermo-formable material for contacting the connector portions of the peripheral device. The connection element may be provided over and/or extend from a metal or metallic contact pad. The connection element may be or comprise a contact pad and/or a mechanical biasing element such as a spring finger.
The main control device may comprise a locking mechanism configured to engage a locking mechanism of the one or more peripheral input modules to releasably attach a peripheral input device module to the main control device. Optionally or preferably, the locking mechanisms of the main control device and the one or more peripheral input device modules are or comprise a sliding rail mechanism.
The main control device may further comprise a microcontroller in communication with the capacitive sensing circuit. The microcontroller may be configured to receive and process measurement data from the capacitive sensing circuit. The microcontroller may further be configured to determine one or more user interactions with the connected peripheral input device module based on the measurement data.
The main control device may be configured to communicate with an external or remote computing device (via a wired or wireless network) for controlling one or more operations of the external computing device based on the measured one or more electrical signals. The main control device may comprise a wireless communication module in communication with the microcontroller for communicating with the external computing device. The modular control system may comprise the external computing device. The external computing device may be configured to execute one or more operations based on the one or more user interactions with the connected peripheral input device module determined by the main control device. The external computing device may be configured to receive and process measurement data transmitted from the main control device. The external computing device may be configured to determine one or more user interactions with the connected peripheral input device module based on the measurement data.
The microcontroller or external computing device may further be configured to process the measurement data and determine a unique identifier of the connected peripheral input device module based on detection of a predefined electrical signal pattern or sequence at the electrical contacts of the capacitive sensing circuit, e.g. upon connection of the peripheral input device module to the main controller device.
The main control device may be or form at least part of: a game console, a control system for a vehicle interior, or a computer peripheral.
According to a third aspect of the invention, there is provided a method of manufacturing the peripheral input device module of the first aspect. The method may comprise forming the one or more sensing electrodes from a non-metallic conductive thermo-formable material. The method may further comprise forming a housing with an integral connector body from a thermo-formable material. The housing may be non-conductive. The method may further comprise forming a non-conductive cover from a substantially soft, flexible, deformable and/or pliable non-conductive thermo-formable material. The method may further comprise assembling the one or more sensing electrodes, the housing, and/or the cover to provide, form or produce the peripheral input device module.
The one or more sensing electrodes, the housing, and/or the cover may be formed by a moulding process. The moulding process may include one or more of injection moulding, compression moulding and over-moulding. The sensing electrodes, housing and cover can be moulded as separate elements which are then assembled together, or at least some of those elements can be moulded together. For example, at least one of the sensing electrodes (e.g. a ground plane sensing electrode) can be moulded, and the housing moulded onto it/them in an over-moulding process. Additionally or alternatively, the cover can be over-moulded onto the housing. Additionally or alternatively, non-conductive spacers layers can be over-moulded onto one or more sensing electrodes (or sensing portions of a sensing electrode).
According to a fourth aspect of the invention, there is provided a method of sensing an electrical signal using the peripheral input device module of the first aspect. The method may comprise selectively bringing a conductive object near to, in contact with and/or across a sensing portion of a sensing electrode, and/or selectively applying a force or pressure to the peripheral input device module to cause relative movement between a sensing portion of a sensing electrode and a sensing portion of another sensing electrode or another sensing portion of the same sensing electrode.
According to a fifth aspect of the invention, there is a provided a sensor device for providing one or more electrical signals in response to a (touch and/or force pressure) user interaction with the sensor device. The sensor device may comprise one or more, or a plurality of sensing electrodes formed of or comprising a thermo-formable non-metallic conductive material. The or each sensing electrode may be configured to provide (e.g. at one or more measurement points on the respective sensing electrode) one or more electrical signals in response to a change in capacitance between: (i) a sensing portion of the respective sensing electrode and a conductive object being near to or in contact with the respective sensing portion, and/or (ii) a sensing portion of the respective sensing electrode and a sensing portion of another one of the sensing electrodes or another sensing portion of the respective (same) sensing electrode. The device may comprise a first sensing electrode and a second sensing electrode.
A first sensing portion of the first sensing electrode may be configured to move relative to a second sensing portion of the second sensing electrode in response to an applied force or pressure. Relative movement between said first and second sensing portions may cause the change in capacitance between them. The first and second sensing portions may be separated by a distance and relative movement between them may change the distance between them. The first and second sensing portions may be separated by a gap, or a layer of substantially deformable, flexible, and/or pliable non-conductive thermo-formable material may be provided between them. The first and second sensing portions may be associated with respective first and second sensing electrodes, which may have respective connector portions. One of the first and second sensing portions may comprise a collapsible element. The collapsible element may be configured to collapse and resiliently deform in response to an applied force or pressure at or above a threshold. The layer of substantially deformable, flexible, and/or pliable non-conductive thermo-formable material may be provided on or over the collapsible element, or between the collapsible element of the first or second sensing portion and the other of the first or second sensing portion. A first applied force or pressure below the threshold may change a distance or separation between the first and second sensing portions and provide a first change or first range of change in the capacitance and/or a first range of signal level change. A second applied force or pressure (greater than the first force/pressure) at or above the threshold may collapse the collapsible element and provide a second change in the capacitance and/or a second signal level change (greater than the first change) and/or tactile feedback to the user. Optionally or preferably, proximity of a conductive object to at least one of the first and second sensing electrodes may cause a third change in capacitance (less that the first and second change). The collapsible element may be substantially dome-shaped. Optionally or preferably, the first or second sensing electrode with the collapsible element may be formed of or comprise a substantially deformable, flexible, and/or pliable non-metallic conductive thermo-formable material. The other of the first or second sensing electrodes may be formed of a substantial rigid non-metallic conductive thermo-formable material.
The sensing electrodes may be connectable or configured to connect to a capacitive sensing circuit for measuring the electrical signals. At least some of the sensing electrodes may comprise a connector portion for electrically connecting to a respective electrical contact of a capacitive sensing circuit for measuring the electrical signals. Establishing an electrical connection to the electrical contacts of a capacitive sensing circuit may be achieved as described in the first or second aspect. The sensor device may or may not include the capacitive sensing circuit. Where it includes the capacitive sensing circuit, the sensor device may further comprise a microcontroller for receiving measurement data from the capacitive sensing circuit, and optionally processing the measurement data to determine one or more touch or pressure/force-based user interactions with the sensor device.
According to a sixth aspect of the invention, there is provided a sensing device for providing one or more electrical signals in response to a user interaction with the sensor device. The sensor device may comprise a plurality of sensing electrodes formed of or comprising a non-metallic conductive thermo-formable material. The sensing electrodes may be configured to provide (e.g. at one or more measurement points on the respective sensing electrode) one or more electrical signals in response to a change in capacitance between a sensing portion of the respective sensing electrode and a sensing portion of another one of the sensing electrodes. The sensor device may be or comprise a joystick device configured to provide one or more electrical signals for detection of tilt angle and tilt direction, and/or lateral translation of the joystick.
The sensor device may comprise a joystick. The joystick may be formed of or comprise one or more thermo-formable materials. The joystick may comprise a handle portion and a base portion. The sensor device may comprise a housing with an opening. The base portion may be located within the housing and the handle portion may extend from the base portion through the opening in the housing for receiving a user interaction or force from a user. The base portion may comprise a first sensing electrode. The base portion and/or joystick may be configured to pivot about a fulcrum to move a sensing portion of the first sensing electrode relative to a set of second sensing portions distributed about the fulcrum. The set of second sensing portions may be distributed equally, evenly and/or symmetrically about the fulcrum. Each second sensing portion may be associated with a (different) respective second sensing electrode, where each second electrode may include a connector portion. The set of second sensing portions may be located below the base portion and first sensing portion. Pivoting of the base portion or joystick may cause a change in capacitance between the first sensing portion and (one or more of) the second sensing portions and thereby provide one or more electrical signals for detecting a tilt direction and angle of the joystick, e.g. with respect to the housing.
The joystick may be moveable between a lower position in which the base portion or joystick is pivotable about the fulcrum for detecting a tilt direction and angle of the joystick, and an upper position in which the base portion or joystick is translatable in one or more lateral directions with respect to the fulcrum to move the sensing portion of the first sensing electrode relative to a set of third sensing portions distributed about the fulcrum or handle portion. The set of third sensing portions may be disposed above the first sensing portion/electrode and/or base portion and/or set of second sensing electrodes. The set of third sensing portions may be distributed equally, evenly and/or symmetrically about the fulcrum or handle portion (when in a rest position). Each third sensing portion may be associated with a (different) respective third sensing electrode, where each third electrode may include a connector portion. Translation of the base portion or joystick when in the upper position may cause a change in capacitance between the first sensing portion and (one or more of) the third sensing portions and thereby provide one or more electrical signals for detecting a translation of the joystick in one or more lateral directions with respect to the housing.
The joystick may further comprise a resiliently deformable biasing element configured to bias the joystick to a rest position in the absence of force applied to the handle portion and deform to permit movement of the joystick away from the rest position in response to a force applied to the handle portion. The rest position may include a rest angular position and optionally a rest lateral position. The joystick may be aligned with a rest axis that insects the fulcrum when in the rest position. The set of second and/or third sensing electrodes may be distributed about the rest axis. The resiliently deformable biasing element may be configured to bias the joystick against the fulcrum in the rest position. The rest position may include the lower position. The resiliently deformable element may be formed of or comprise a non-metallic conductive thermo-formable material or a non-conductive thermo-formable material. Where it is formed of a non-metallic conductive thermo-formable material it may be integral with, or electrically contact, the first sensing electrode. The resiliently deformable element may be or comprise a spiral spring, or a disk-like member. Alternatively, there may be a plurality of resiliently deformable biasing elements distributed about the joystick.
At least some of the sensing electrodes may comprise a connector portion for electrically connecting to a respective electrical contact of a capacitive sensing circuit for measuring the electrical signals. Establishing an electrical connection to the electrical contacts of a capacitive sensing circuit may be achieved as described in the first or second aspect. The sensor device may or may not include the capacitive sensing circuit. Where it includes the capacitive sensing circuit, the sensor device may further comprise a microcontroller for receiving measurement data from the capacitive sensing circuit, and optionally processing the measurement data to determine one or more user interactions with the sensor device, e.g. including one or more of tilt angle, tile direction, lateral translation direction and lateral translation amount.
The set of second and/or third sensing electrodes may comprise respective connector portions. The first sensing electrode of the base portion may not include a connector portion and may be configured to connect to an electrical contact of the capacitive sensing circuit through electrical, mechanical and/or physical contact with a fourth sensing electrode which does include a connector portion. The connector portion of the fourth sensing electrode may be configured to connect to a ground contact of the sensing circuit of the main control device. The fourth sensing electrode may be configured as a ground electrode or a ground plane.
The fulcrum may be formed of a non-metallic conductive thermo-formable material or a non-conductive thermo-formable material. Wherein the fulcrum is non-conductive, it may be integral with the housing. Where the fulcrum is conductive, it may be integral with a fourth sensing electrode. Where the fulcrum is integral with the fourth sensing electrode, the first sensing electrode of the base portion may be configured to electrically connect to an electrical contact of the capacitive sensing circuit through mechanical or physical contact with the fulcrum. Where the fulcrum is integral with the housing, the first sensing electrode of the base portion may be configured to electrically contact the fourth sensing electrode through a connector element.
Features which are described in the context of separate aspects and embodiments of the invention may be used together and/or be interchangeable. Similarly, where features are, for brevity, described in the context of a single specific embodiment, these may also be provided separately or in any suitable sub-combination. Features described in connection with the peripheral input device module may have corresponding features definable with respect to the method(s) and sensor devices, and vice versa, and these embodiments are specifically envisaged.
In order that the invention can be well understood, embodiments will now be discussed by way of example only with reference to the accompanying drawings, in which:
It should be noted that the figures are diagrammatic and may not be drawn to scale. Relative dimensions and proportions of parts of these figures may have been shown exaggerated or reduced in size, for the sake of clarity and convenience in the drawings. The same reference signs are generally used to refer to corresponding or similar features in modified and/or different embodiments.
In general, the main device 200 may take different shapes/forms, serve different functions and comprise conventional electronic components. For example, the main device 200 may be a standalone computing device with or without its own user input functionalities, or it may itself be a peripheral input device with its own user input functionalities for controlling the remote computing device 300. The main device 200 may be a substantially portable and/or hand held device, e.g. the main device 200 may be a portable or mobile computing device (e.g. a laptop, tablet, or smart phone), a wired or wireless controller (e.g. a gaming and/or virtual reality controller), or a computer peripheral. Alternatively, the main device 200 may be substantially non-portable, such as a control console (e.g. part of an automotive interior control console, such as a customisable control interface for a steering wheel).
The peripheral device 100 extends the functionality of the main device 200 to include a set of specific functions provided by the peripheral device 100. In practice, the system 1000 may comprise one or more peripheral devices 100 that are interchangeably connectable to the main device 200. Each peripheral device 100 can be configured with a different three-dimensional (3D) shape/form and function based on the application to allow the size, shape, appearance, and functionality of modular control device to change.
The peripheral device 100 is a capacitive sensing device configured to provide various touch and/or pressure/force-based sensing functions. Touch and/or pressure-based user interactions with the peripheral device 100 cause a change in the one or more electrical signals that is measurable by the main device 200.
Unlike known peripheral input devices, the peripheral device 100 is electrically passive (i.e. requires no on-board power source to operate) and does not contain any conventional metal-based electronic circuit components, such as metal electrodes, wires or traces, resistors, transistors, capacitors, inductors, diodes, integrated circuits, processors, storage devices, or batteries. Instead, the peripheral device 100 can be made exclusively from thermo-formable conductive and non-conductive materials, such as plastic and rubber materials that can be formed by one or more moulding processes into almost any 3D shape and size and can be substantially rigid, flexible, and/or pliable/deformable. This allows a wide range of capacitive sensing functionalities to be achieved through suitable design of the thermo-formable conductive sensing electrodes and non-conductive elements of the peripheral device 100, as described in more detail below.
The peripheral device 100 comprises a plurality of sensing electrodes 110 configured to provide electrical signals to the main device 200 in response to a touch and/or pressure-based user interactions with the peripheral device 100. The sensing electrodes 210 are formed of or comprise a thermo-formable non-metallic conductive material that can be formed by one or more moulding processes such as injection moulding or compression moulding. The sensing electrodes 110 may be substantially rigid, pliable and/or deformable, and need not all have the same material properties (i.e. mechanical and electrical properties). Suitable materials for the sensing electrodes include but are not limited to conductive plastics, such as conductive thermoplastic polyurethane (TPU), conductive thermoplastic elastomer (TPE), conductive acrylonitrile butadiene styrene (ABS), conductive silicones, conductive polyurethane (PU), and conductive ethylene vinyl acetate (EVA). Throughout the accompanying figures, the sensing electrodes 110 appear as shaded elements for clarity.
Each sensing electrode 110 comprises at least one sensing portion 110s configured to capacitively interact with a conductive object 400 such as a user's finger and/or another sensing portion 110s on the same or a different sensing electrode 110. As such, the one or more electrical signals are provided in response to (i) a change in capacitance between a sensing portion 110s of the respective sensing electrode 110 and a conductive object 400 being near to or in contact with the respective sensing portion 110s, and/or (ii) a change in capacitance between a sensing portion 110s of the respective sensing electrode 110 and a sensing portion 110s of another sensing electrode 110 or another sensing portion 110s of the (same) respective sensing electrode 110.
At least some of the sensing electrodes 110 comprise one or more at least partially exposed connector portions 110c that form an electrical connector 120 for electrically connecting the peripheral device 100 to the main device 200. Each connector portion 110c is configured to electrically connect directly to respective electrical contact 210 of the capacitive sensing circuit 230 of the main device 200 (as described in more detail below).
Sensing electrodes 110 that do not comprise a connector portion 110c, e.g. sensing electrode 110F in
At least one sensing electrode 110 with a connector portion 110c is configured to connect to a ground electrode 210g of the main device 200 to be a ground electrode 110g. Preferably, at least one ground electrode 110g is configured as a ground plane 110gp for the peripheral device 100, with an extended area that overlaps other sensing electrodes 110 (e.g. see
Optionally, a sensing electrode 110F that does not comprise a connector portion 110c can conveniently be configured as a ground electrode through contact with the ground electrode 210g, as shown.
The peripheral device 100 also comprises various non-conductive elements that are used to support and retain the sensing electrodes 110, be provided on/over the sensing portions 110s as a cover or interface layer, and/or be provided between sensing portions 110s, as will be described in more detail below. The non-conductive elements of the peripheral device 100 are formed of or comprise one or more thermo-formable non-conductive materials that can similarly be formed by one or more moulding processes such as injection moulding, compression moulding, over-moulding and/or heat press. For example, non-conductive material may be over-moulded onto one or more of the sensing electrodes 110 or vice versa. The non-conductive material may be substantially rigid, or flexible, pliable and/or deformable. Suitable materials for the non-conductive elements include but are not limited to non-conductive TPU, non-conductive TPE, non-conductive ABS, non-conductive silicones, and fabrics.
With reference to
The array of electrical contacts 210 comprise a plurality of sense contacts 210s connected to sensing channels of the capacitive sensing chip and at least one ground contact 210g connected to a ground pin of the capacitive sense chip. The capacitive sensing chip can measure changes in self-capacitance at a sensing contact 210s for the touch sensing functions, and/or changes in capacitance between a pair of sense contacts 210s or between a sense contact 210s and a ground contact 210g for the mechanical pressure sensing functions. The capacitance measurement may be a time or frequency-based measurement, as is known in the art.
The main device 200 also comprises a control unit or microcontroller 240 in data communication with the capacitive sensing chip, and a power management unit 260 for powering the main device 200. The control unit 240 is configured to receive measurement data from the capacitive sensing circuit 230. The power management unit 260 may be connectable to a battery, or the power management unit may comprise a re-chargeable battery.
The measurement data gathered from the capacitive sensing chip is processed or analysed to determine one or more user interactions with the connected peripheral device 100. Processing of the measurement data can be performed on-board the main device 200 by the control unit 240 or at the remote computing device 300, where present. Where processing is performed on the main device 200, the control unit 240 comprises a processor and a memory (not shown) for storing one or more software programs or program instructions, that when executed or run on the processor causes the control unit 240 to process and/or analyse the measurement data to determine a user interaction with the peripheral device 100 based on the measurement data. For example, the control unit 240 may be configured to determine or detect one or more of: a contact or touch from a user/operator, a contact/touch position, a speed, direction and/or amount of movement of said touch for a touch sensing functions; and/or a movement/deformation, direction of movement/deformation, and/or amount of movement/deformation of a sensing portion 110s relative to another sensing portion 210s of the same or different sensing electrode 210 for a mechanical pressure sensing functions. The control unit 240 is also configured to detect when a peripheral device 100 is attached and identify the specific connected peripheral device 100 based on the measured electrical signals (described in more detail below with reference to
The main device 200 may also include a wireless communication unit 250 in data communication with the control unit 240 for communicating with a remote computing device 300 over a wireless network (e.g. Bluetooth, Bluetooth low energy, or WiFi). For example, the wireless communication unit 250 can be used to send any control signals or other data generated/determined by the control unit 240 to the remote computing device 300, and/or to send measurement data collected from the capacitive sensing chip to the remote computing device 300 for processing as described above.
It will be appreciated that the main device 200 may also comprise various other hardware components not shown, depending on the purpose and function of the main device 200. For example, the main device 200 may further comprise a vibration motor for providing tactile or haptic feed to the user, a haptic driver for the vibration motor, and an inertial measurement unit (IMU) for detecting motion or movement of the main device 200. The IMU may comprise an accelerometer, gyroscope and/or a magnetometer (e.g. the IMU may have 3, 6 or 9 degrees of freedom), as is known in the art.
In general the material properties (mechanical and/or electrical properties) of the connector portion(s) 110c may be the same or different to the sensing portion 110s of the respective sensing electrode 110. For example, different material properties can be achieved by forming the sensing electrodes 110 using an over-moulding or co-moulding process. The connector portion 110c should be highly conductive to minimise signal attenuation (e.g. an electrical resistivity of less than 1 k Ohm/cm). Preferably the sensing portion 110s is also highly conductive. In this case it behaves like an equipotential such that the signal produced by a touch interaction is substantially independent of the touch location on the sensing portion 110a (as is the case for conventional metal capacitive sensing electrodes). This is suitable for simple touch detection. Alternatively, in certain applications the conductivity of the sensing portion 110s can be substantially lower (i.e. more resistive) than the connector portion 110s (e.g. an electrical resistivity of greater than 1 k Ohm/cm). In this case the signal produced by a touch interaction exhibits a dependence on the touch location relative to the sensing point 110p where the connector portion 110c meets the sensing portion 110s. This effect is illustrated in
More complex/advanced touch sensing functions can be achieved, such as detection of touch position, speed, direction and/or amount of movement of said touch position, by using a plurality of highly conductive sensing electrodes 110, or a sensing electrode 110 with a substantially resistive sensing portion 110s.
In both sensing touch and force sensing configurations, the non-conductive material 130 provided over the first sensing portion 110s-1 can be substantially rigid or resiliently deformable/compressible.
The first and second sensing portions 110s-1, 110s-2 are preferably associated with separate respective first and second sensing electrodes 110-1, 110-2 and the second sensing electrode 110-2 with the collapsible element 132 is optionally or preferably a ground electrode 110g or a ground plane 110gp.
The peripheral device 100A comprises a plurality of sensing electrodes 110, a housing 140, a cover 130, and a movable actuator 160 in the form of a joystick. The housing 140 is formed of a substantially rigid non-conductive thermo-formable material (e.g. non-conductive ABS) and is configured to support and retain the sensing electrodes 110. The cover 130 is formed of a substantially soft and resiliently deformable/pliable non-conductive thermo-formable material, such as non-conductive silicone, and is provided over at least a portion of the housing 140 to provide a tactile “soft touch” interface layer.
The housing 140 comprises a plurality of openings 140o-1 through which one or more sensing portions 110s at least partially extend for receiving a user interaction such as a touch or applied pressure/force. The housing 140 further comprises an opening 140o-2 through which the movable actuator 160 extends for receiving a user interaction (i.e. a force that moves the actuator 160) and transmitting the user interaction to one or more respective sensing portion 110s located within the housing 140 for detection, as will be described in more detail below.
In the illustrated embodiment, the touch and pressure sensitivity input buttons 101-A, 101-B operate as described above with reference to
The soft cover 130 is provided over the openings 140o-1 to inhibit ingress of dust and water/moisture while allowing a force to be applied to the underlying sensing portion 110s-1. In the illustrated embodiment, the actuator 160 also extends through an opening in the cover 130, however, the soft cover 130 may instead also be provided over the actuator 160 (not shown).
The housing 140 comprises an integral connector body portion 142 configured to engage the connector portions 110c of the sensing electrodes 110 to support and hold them in place.
The connector portions 110c can be held in place by frictional engagement, or they can be integrally formed with the connector body portion 142 through a co-moulding process. In the embodiment of
With reference to again to
The connector body portion 142 of the housing 140 also forms/provides an attachment or locking mechanism configured to engage a corresponding locking mechanism of the main device 200 to releasably attach the peripheral device 100A to the main device 200. In the embodiment of
The locking members 1421 form rail members that extend at least part of the length of the connector body portion 142 in the connection direction CD and are configured to slidingly inter-engage the complementary rail members 2421 of the main device 200. The rail members 1421 comprise a longitudinally extending projection configured to be received by and engage with a longitudinally extending recess or channel of the respective rail members 2421 of the main device 200, or vice versa.
Sliding engagement of the rail members 1421, 2421 brings the connector portions 110c into physical electrical contact with the respective electrical contacts 210 of the main device 200 establishing an electrical connection therebetween, as described in more details below. An end (frictional) stop or other means can be provided at an end of the rail members 142, 2421 of the peripheral device and/or main device 200 to prevent sliding past the connected position in which the connector portions 110c and electrical contacts 210 are aligned (not shown). Frictional engagement of the rail members 1421, 2421 inhibits unintentional movement away from the connected position. Disconnection or disengagement of the peripheral device 100A from the main device 200 requires applying a force in the opposite direction.
In the embodiment of
A number of different peripheral devices 100 may be interchangeably connectable to the main device 200, with each peripheral device 100 having a different sensing electrode 110 configuration for providing different modular control devices with different user interaction functionalities (see
When connected, a number of connector portions 110c will be in contact with an equal number of electrical contacts 210 including at least one ground contact 210g as described above. The peripheral devices 100 are configured so that at least one sensing electrode 110 is physically connected to both the ground contact 210g and one of more sense contacts 210s of the sensing circuit to provide a specific signal pattern or sequence detectable by the control unit 240 of the main device 200 (or by the remote computing device 300) for identifying the particular connected peripheral device 100.
The different signal patterns at the sense contacts 210s of the main device 200 can also be used to identify when a peripheral device 100 is connected to the main device 200 or not. This is illustrated in
In the embodiment of
In the embodiment of
In the embodiment of
Each second sensing portion 110s-2 is associated with separate second sensing electrode 110-2. The fulcrum F-110 is integrally formed with the ground plane 110gp. The first sensing electrode 110-1 does not include a connector portion 110c and is configured to connect to the sensing circuit of the main device 200 through electrical contact with the fulcrum F-110. In this example, the first sensing electrode 110-1 rests and pivots directly on the fulcrum F-110. The joystick 101-J1 also comprises a resiliently deformable biasing element 166 coupled to the actuator 160 and configured to bias the actuator 160 towards the fulcrum F-110 and to a rest angular position (e.g. a central position) aligned with a rest axis RA when no force is applied to the actuator 160 and deform to permit movement (e.g. tilting) of the actuator 160 away from the rest position when a force is applied. The biasing element 166 is coupled to the movable actuator 160 at a radially inner end and is coupled to and/or engaged with the housing 140 or another stationary element of the device 100 at a radially outer end. As such, the radially outer end is fixed or stationary relative to the actuator 160. With reference to
As described above, the biasing element 166 is configured to bias the actuator 160 towards the fulcrum F-140 and a rest angular position, and thus also towards the lower position. In the lower position, the joystick 101-J2 operates as described above for the joystick 101-J1. Tilt angle and direction relative to the rest axis RA are determined from capacitance signals measured between the first sensing portion 110s-1 and the set of second sensing portions 110s-2. In the upper position, the actuator 160 is lifted away from the fulcrum F-140 and is free to move laterally. In the upper position UP, lateral movement of actuator 160 moves the first sensing portion 110s-1 relative to the set of third sensing portions 110s-3 and changes the capacitance between them. This enables lateral translation of the actuator 160 relative to the rest axis RA to be determined from capacitance signals measured between the first sensing portion 110s-1 and the set of third sensing portions 110s-3, as described below.
Although the specific embodiments of a peripheral device 100A, 100B, 100C, 100D shown in
Alternatively, the locking mechanism can be based on magnetic engagement. In this case, the connector body portion 142 does not comprise locking members, but instead comprises magnets that interact with magnets of the opposite polarity on the main device 200 to releasably hold the two devices 100, 200 together in the connection position (not shown).
There are also a number of different ways to establish electrical connection between the non-metallic connector portions 110c of the peripheral device 100 and the electrical contacts 210 of the main device 200 suitable for mechanical and/or magnetic locking mechanisms. In the embodiment of
The conductive and non-conductive elements of the peripheral device 100 are formed from thermo-formable materials by one or more moulding processes such as injection moulding, compression moulding and, in some cases, over-moulding.
Assembling the peripheral device 100 may comprise positioning one or more sensing electrodes 110 and ground planes 110gp at least partially within a first part 140-1 of the housing 140, and securing a second part 140-2 of the housing 140 to the first part 140-1 to retain the one or more sensing electrodes 110 in position. As a final step, a cover 130 may be applied on or over at least part of the rigid housing 140. Assembling the peripheral device 100 may comprise securing one or more sensing electrodes 110 to a part 140-1, 140-2 of the housing 140. The different part of the housing 140-1, 140-2 may be secured together by one or more fasteners such as screws or an adhesive. Assembling the peripheral device 100 may comprise assembling sub-parts of the various sensing elements 101, such as the trigger 101-F and/or joystick 101-J1, 101-J2 (e.g. handle portion 162, base portion 164, biasing element 166 of the actuator 160) before assembling with the housing 140.
The sensing electrodes 110, housing 140 and cover 130 can be moulded as separate elements which are then assembled together, or at least some of the elements can be moulded together. For example, the ground plane sensing electrode(s) 110gp and optionally one or more other sensing electrodes 110 can be moulded over or onto the interior of the rigid housing 140 in an over-moulding process, or vice versa. In addition, the soft cover 130 can be over-moulded onto the rigid housing 140. Further, non-conductive spacers layers 132 can be over-moulded onto a sensing electrode 110 or the ground plane 110gp. In embodiments where the cover 130 is a fabric and provided over a soft deformable sensing electrode 110, such as in devices 100B and 100C, the fabric cover 130 may be heat-pressed onto the sensing electrodes 110.
From reading the present disclosure, other variations and modifications will be apparent to the skilled person. Such variations and modifications may involve equivalent and other features which are already known in the art, and which may be used instead of, or in addition to, features already described herein.
Although the appended claims are directed to particular combinations of features, it should be understood that the scope of the disclosure of the present invention also includes any novel feature or any novel combination of features disclosed herein either explicitly or implicitly or any generalisation thereof, whether or not it relates to the same invention as presently claimed in any claim and whether or not it mitigates any or all of the same technical problems as does the present invention.
Features which are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable sub-combination.
For the sake of completeness it is also stated that the term “comprising” does not exclude other elements or steps, the term “a” or “an” does not exclude a plurality, and any reference signs in the claims shall not be construed as limiting the scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2101000.4 | Jan 2021 | GB | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/GB2022/050190 | 1/25/2022 | WO |
