Claims
- 1. A sputtering device comprising: a vacuum vessel; at least one pair of rectangular targets arranged in the vacuum vessel so that their long sides are opposed; at least one means for generating a magnetic field along the perimeter of each of said rectangular targets in a direction perpendicular to the targets, each of said magnetic-field generating means having an end portion thereof positioned close to one of said targets, each end portion constituted by a tip made of high permeability soft magnetic materials, said tip having an outside front and being shaped into a point at the outside front end thereof; and a base-conveying means for conveying a nonmagnetic base arranged adjacent to the long sides of said at least one pair of said rectangular targets so that the nonmagnetic base faces a space between said at least one pair of the targets in a direction perpendicular to the long side of said targets, and so that layers having the same composition of said targets are deposited on said nonmagnetic base by sputtering.
- 2. A sputtering device comprising: a vacuum vessel; at least one pair of rectangular targets arranged in the vacuum vessel so that their long sides are opposed; at least one means for generating a magnetic field outside and along the perimeter of each of said at least one pair of rectangular targets in a direction perpendicular to the targets, each of said magnetic-field generating means comprising first means for guiding a magnetic flux around each of said targets with a configuration such that each of said targets is surrounded thereby, and second means for producing a magnetic field and connected to said first means via a magnetic path formed therebetween; and base-conveying means for conveying a nonmagnetic base arranged adjacent to the long sides of said at least one pair of said rectangular targets so that the nonmagnetic base faces a space between said at least one pair of the targets in a direction perpendicular to the long sides of said targets, and so that layers having the same composition of said targets are deposited on said nonmagnetic base by sputtering.
- 3. A sputtering device according to claim 2, wherein said second means is a magnetizing coil.
- 4. A sputtering device according to claim 2, wherein said second means is a permanent magnet.
Priority Claims (2)
Number |
Date |
Country |
Kind |
57-22080 |
Feb 1982 |
JPX |
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57-20975 |
Mar 1982 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 819,229, filed Jan. 15, 1986, now U.S. Pat. No. 4,666,788, issued May 19, 1987 which is a divisional of U.S. Ser. No. b 466,683 filed Feb. 16, 1983, now U.S. Pat. No. 4,576,700, issued Mar. 18, 1986.
US Referenced Citations (9)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0053680 |
Mar 1984 |
JPX |
0116376 |
Jul 1984 |
JPX |
0046370 |
Mar 1985 |
JPX |
0106966 |
Jun 1985 |
JPX |
1034175 |
Feb 1986 |
JPX |
1034176 |
Feb 1986 |
JPX |
Non-Patent Literature Citations (3)
Entry |
Kadokura et al., "Deposition of Co-Cr Films for Perpendicular Magnetic Recording by Improved Opposing Targets Sputtering" IEEE Transactions on Magnetics, vol. Mag 17, No. 6 (Nov. 1981) pp. 3175-3177. |
Norstrom, "The Electrical Characteristics of RF Magnetron and non-Magnetron Planar Systems" Pergamon Press, Jun. 1980, p. 225. |
Naoe et al., "High Rate Deposition of Magnetic Films by Sputtering from Two Facing Targets" J. Crystal Growth 45, No. 1, Dec. 1978, p. 361. |
Divisions (2)
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Number |
Date |
Country |
Parent |
819229 |
Jan 1986 |
|
Parent |
466863 |
Feb 1983 |
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