Claims
- 1. A topical nail varnish formulation for the treatment of onychomycosis of the nails comprising 1) an active agent of formula I in free base form or in acid addition salt form; 2) a water-insoluble polymeric film former in an amount sufficient to release a fungicidally-effective amount of the active agent into the nail, said polymeric film former selected from the group consisting of polyvinyl acetate, acrylic- and methacrylic acid, alkyl ester copolymerisates with quatemary ammonium groups, and methylvinylether-maleic acid, monoalkyl ester copolymerisates; and 3) a solvent.
- 2. A formulation according to claim 1 in which said solvent is selected from the group consisting of ethanol, isopropanol, acetone, ethyl acetate and mixtures of water with ethanol, isopropanol, acetone, and ethyl acetate.
- 3. A formulation according to claim 2 in which the solvent is a mixture of water and ethanol.
- 4. A formulation according to claim 3 containing one or less parts by weight water for each three parts by weight ethanol.
- 5. A formulation according to claim 1 in which the compound of formula I is in the form of its hydrochloride salt.
- 6. A topical nail varnish formulation for the treatment of onychomycosis of the nails comprising 1) as the active agent the compound of formula I in free base form or in acid addition salt form;2) a water-insoluble polymeric film former selected from the group consisting of polyvinyl acetate and methylvinylether-maleic acid monoalkyl ester copolymerisates; and 3) a solvent.
- 7. A formulation according to claim 1 wherein the polymeric film former is polyvinyl acetate.
- 8. A formulation according to claim 7 wherein the polymeric film former is an acrylic- and methacrylic-acid alkyl ester copolymerisate with quaternary ammonium groups.
- 9. A formulation according to claim 1, wherein the polymeric film former is a methylvinylether-maleic acid monoalkyl ester copolymerisate.
- 10. A formulation according to claim 1 wherein the mixture ratio of the compound of formula I and the polymeric film former is from about 1:0.5 to about 1:25 on a w/w basis.
- 11. A formulation according to claim 10, wherein the mixture ratio of the compound of formula I and the polymeric film former is from about 1:1 to about 1:20.
- 12. A formulation according to claim 11, wherein the mixture ratio of the compound of formula I and the polymeric film former is from about 1:1 to about 1:10.
- 13. A formulation according to claim 1 wherein the compound of formula I is present from about 0.5% to about 30% of the total composition on a w/w basis.
- 14. A formulation according to claim 13 wherein the compound of formula I is present from about 1% to about 20% of the total composition.
Priority Claims (2)
Number |
Date |
Country |
Kind |
9111210 |
May 1991 |
GB |
|
9204472 |
Mar 1992 |
GB |
|
Parent Case Info
The present application is a divisional of U.S. application Ser. No. 08/466,490, now U.S. Pat. No. 5,866,105, which in turn is a continuation of U.S. application Ser. No. 08/272,711, Jul. 8, 1994, abandoned, which in turn is a continuation of U.S. application Ser. No. 08/048,153, Apr. 14, 1993, now abandoned, which in turn is a continuation of U.S. application Ser. No. 07/886,797, May 21, 1992, now abandoned.
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Country |
0298271 |
Jan 1989 |
EP |
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EP |
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Entry |
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Continuations (3)
|
Number |
Date |
Country |
Parent |
08/272711 |
Jul 1994 |
US |
Child |
08/466490 |
|
US |
Parent |
08/048153 |
Apr 1993 |
US |
Child |
08/272711 |
|
US |
Parent |
07/886797 |
May 1992 |
US |
Child |
08/048153 |
|
US |