Patent Application
20060279335
Phase interpolators are commonly used to generate desire clock phases off of input, reference clock signals. They may be used in various applications such as with phase locked loops (PLLs), delay locked loops (DLLs), and clock data recovery (CDR) circuits. With CDR circuits, for example, they may be used in data recovery by a receiver to locate data edges and find an appropriate sampling point. In such applications, a strobe may be swept through a data period using small steps until a suitable point is found. When the resolution of these steps is higher, the system is generally able to recover data for narrower valid windows. In order to achieve better resolutions, DLLs or PLLs with phase interpolators may be used.
With reference to
Typically, each driver 103, 105 has a number of discrete strength options to achieve the different, desired interpolation intervals between the input clock phases. The resolution of the phase interpolator is normally dependent on the number of strength settings. With phase interpolator 100, each driver 103, 105 has five (N=0, 1, 2, 3, or 4) different strength settings resulting in five different phase interpolation settings, as indicated at 106. The relative strength of driver A (103) is N, and the strength of driver B (105) is 4−N. Thus, as illustrated at 106, as N gets larger, the output phase moves toward CLK A. Likewise, as it gets smaller, it moves closer to CLK B.
The driver circuit has a differential clock signal input (CLK, CLK#) at the gates of M1 and M2, and a differential output (OUT#/OUT) at the junction nodes between the pull-up resistors R1, R2 and the pull-down transistors M1, M2, respectively. The different current source transistors MNREF are engaged or disengaged by way of a control signal (CTL). The higher the number of engaged current sources, the stronger the driving strength of the driver 100. For example, if driver circuit 200 is used as the drivers for driver A and driver B in
Linearity may be an important parameter in some phase interpolator applications. For example, it can affect accuracy, as well as resolution. As the linearity of a phase interpolator gets better, the worst case step in the phase interpolator can be made to be smaller. The smaller the worst case step, the higher the achievable resolution of the output clock interpolation. Unfortunately, in some applications, with conventional driver circuits, the interpolation transitions may not be suitably linear.
Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
Pull-down transistors M4 and MN6 are coupled to one another in a current-mirror configuration, thereby making the current in the second leg proportional to the current in the first leg. The actual value will correspond to the number of pull-up/pull-down pairs MN5/MN6 that are engaged. That is, the current (and thus the driving strength of the driver circuit 300) increases as the number of engaged pull-up/pull-down transistor pairs increases. In one embodiment, four selectably engageable pairs MN5/MN6, are utilized. One or more of them can be enabled using a control signal (CTL), which controls the opening/closing of switches 302, 304 to selectably engage (or disengage) a selected number of the pull-up/pull-down pairs. (Note that the CTL signal may actually comprise several different signals, e.g., one for each pull-up/pull-down pair.)
The selectably engageable pull-up/pull-down pairs may provide good, linear interpolation because, among other reasons, they can be configured to have substantially equivalent operating characteristics (e.g. equivalent conductance/current). Thus, by adding or removing them from the driver, one can vary the driving strength of the driver by equivalent (or reasonably equivalent) linear increments. to achieve this, the transistors (or at least suitable combinations of them) can be matched (e.g., sized) and biased to operate reasonably equivalently with one another. For example, in one embodiment, dual, parallel-connected transistors—each having a channel length of 1μ and a width of 0.1μ—may be used for each depicted transistor M3, M4, MN5, and MN6. (Dual, parallel-connected 1μ transistors are essentially equivalent to a 2μ transistor. Two parallel-connected devices, instead of a single, wider device, can be used for better matching, i.e., increased fabrication precision and consistency.) Even if all of the devices are not reasonably matched with one another, the pull-up transistors M3, MN5 may be matched to one another, and the pull-down transistors M4, MN6 may be matched to one another. In addition, the corresponding devices in each driver used to implement a phase interpolator, e.g., a phase interpolator such as that shown in
In the depicted embodiment, the pull-up and pull-down transistors are implemented with PMOS and NMOS transistors, respectively. However, any suitable transistor types or circuit components (e.g., resistors, rectifiers) or combinations thereof could otherwise be used. Similarly, the depicted embodiment employs a single-ended output (OUT). However, other output types such as differential outputs could also be implemented. For example, with the depicted circuit, an equivalent circuit but with the clock input polarities switched, could be used to generate a complementary output that when coupled with the depicted output could provide a differential output. Along these lines, while the depicted clock input signal is fed into the gates of the pull-up PFET transistors M3, MN5, this is not required. For example, they instead could be fed into the pull-down NFETs, with the pull-up PFETs, for example, possibly connected in the current-mirror configuration. (Note that the current mirror configuration is not necessary but may provide better results in some applications.)
With reference to
It should be noted that the depicted system could be implemented in different forms. That is, it could be implemented in a single chip module, a circuit board, or a chassis having multiple circuit boards. Similarly, it could constitute one or more complete computers or alternatively, it could constitute a component useful within a computing system.
The invention is not limited to the embodiments described, but can be practiced with modification and alteration within the spirit and scope of the appended claims. For example, it should be appreciated that the present invention is applicable for use with all types of semiconductor integrated circuit (“IC”) chips. Examples of these IC chips include but are not limited to processors, controllers, chip set components, programmable logic arrays (PLA), memory chips, network chips, and the like.
Moreover, it should be appreciated that example sizes/models/values/ranges may have been given, although the present invention is not limited to the same. As manufacturing techniques (e.g., photolithography) mature over time, it is expected that devices of smaller size could be manufactured. In addition, well known power/ground connections to IC chips and other components may or may not be shown within the FIGS. for simplicity of illustration and discussion, and so as not to obscure the invention. Further, arrangements may be shown in block diagram form in order to avoid obscuring the invention, and also in view of the fact that specifics with respect to implementation of such block diagram arrangements are highly dependent upon the platform within which the present invention is to be implemented, i.e., such specifics should be well within purview of one skilled in the art. Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that the invention can be practiced without, or with variation of, these specific details. The description is thus to be regarded as illustrative instead of limiting.
