This a Divisional of Ser. No. 08/823,971 filed Mar. 25, 1997 now U.S. Pat. No. 5,828,724.
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4686631 | Ruud | Aug 1987 | |
5125016 | Korhonen et al. | Jun 1992 | |
5148458 | Ruud | Sep 1992 | |
5414747 | Ruud et al. | May 1995 | |
5629524 | Stettner et al. | May 1997 | |
5724401 | Kurtz et al. | Mar 1998 | |
5848122 | Kurtz | Dec 1998 |
Entry |
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Noyan, I.C. and Cohen, J.B., "Residual Stress," Springer-Verlag, ISBN 0-387-96378-2, (1987), pp. 4-7, 74-110, and 116-125. |
Noyan, I.C. and Goldsmith, C.c., "Thermal Stress Relaxation in Vapor Deposited Thin Films," Advances in X-ray Analysis, 34, 587, (1991). |
Crowder, C.E. et al., "The Measurement of Triaxial Residual Stress in Polymer-Coated Aluminum Circuitry in Microchip Modules," Advances in X-ray Analysis, 36, 231, (1993). |
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Number | Date | Country | |
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Parent | 823971 | Mar 1997 |