The present invention generally relates to photocathodes.
Photocathodes have been used in opto-electronic devices, such as TV camera tubes, image tubes, motion detectors and counters, etc. High quantum efficiency (QE) and long-life characteristic have been desired for photocathodes. Currently available photocathodes may only last for a matter of hours in the vacuum environment of an electron gun. Their emission efficiency degrades over time in a practical vacuum environment because of trace amount of gases, which contaminates and degrades the sensitive photocathode film. One of the principle challenges for photo-injection is extending the lifetime of high efficiency photocathode operation.
Further, while graphene layers have been contemplated as a protective layer for photocathodes, a macroscopic substrate typically included in conventional photocathodes makes it difficult to exploit features that can only be realistically achieved in free space suspension.
According to an embodiment of the present disclosure, a photocathode may include: a mesh having a first surface and a second surface facing away from the first surface, and including metallic, semiconductor or ceramic mesh grid with micron-sized openings in the mesh; a photosensitive film on the first surface of the mesh and extending at least partially into the openings of the mesh; and a graphene layer including one or more graphene sheets on the second surface of the mesh.
The graphene layer may include 1 to 5 layers of graphene sheets.
The graphene layer may further include a dopant.
The graphene layer may include 1 to 5 layers of graphene sheets.
The graphene layer may further include a dopant.
The graphene layer may have a first surface in contact with the second surface of the mesh, and a second surface opposite to the first surface, the second surface being a free surface.
The mesh may include a material selected from Ni, Pt, Pd, Cu, Si, or Si3N4.
The photosensitive film may be selected from a metal; a bi-alkali compound; a multi-alkali compound; an alkali-semiconductor alloy; an alkali-halide; an alkali bi-metallic alloy; polycrystalline diamond; or combinations thereof.
The photosensitive film may be selected from Cu, Ni, Mg, Y, Sm, Ba, Nb, Ca, Au, Mg—Ba, a bi-alkali compound, a multi-alkali compound; K2CsSb, Cs3Sb, KCsSb mixed with CsBr, K3Sb, Na2KSb, Li2CsSb, Cs2Te, CsTe mixed with CsBr, CsKTe, K2Te, Rb2Te, r RbCsTe; CsI; CsI—Ge; GaAs; InGaAs; CsAu, RbAu; polycrystalline diamond; or combinations thereof.
The photocathode may further include a sealing layer on a side of the photosensitive film facing away from the graphene layer.
The sealing layer may include a material selected from the group consisting of NaI, CsBr, CsI, CsF, MgF2, NaF, LiF, SiOx, hexatricontane (HTC), and calcium stearate (CaSt).
The sealing layer may include a first surface in contact with the photosensitive film, and a second surface opposite to the first surface, the second surface being a free surface.
According to another embodiment of the present disclosure, a method for manufacturing a photocathode may include: depositing a graphene layer on a carrier substrate to form a graphene layer-carrier laminate; applying a polymer film on the graphene layer to form a polymer film-graphene layer-carrier laminate; removing the carrier substrate from the polymer film-graphene layer-carrier laminate to form a polymer film-graphene layer laminate; attaching a mesh to the polymer film-graphene layer laminate to form a polymer film-graphene layer-mesh laminate, the mesh comprising metallic, semiconductor or ceramic mesh grid with micron-sized openings in the mesh; removing the polymer film from the polymer film-graphene layer-mesh laminate to form a graphene layer-mesh laminate; and depositing a photosensitive film on the graphene layer-mesh laminate to form a graphene layer-mesh-photosensitive film laminate.
The graphene layer may have a first surface contacting the mesh and the photosensitive film, and a second surface opposite to the first surface, the second surface being a free surface.
The depositing of the graphene layer may be through chemical-vapor-deposition.
The removing of the carrier substrate from the polymer film-graphene layer-carrier laminate may include: etching of the carrier substrate or peeling off of the carrier substrate utilizing a mechanical force.
The applying of the polymer film on the graphene layer may be through spin coating.
The removing of the polymer film from the polymer film-graphene layer-mesh-photosensitive film laminate may include etching the polymer film utilizing acetone.
The attaching of the mesh to the polymer film-graphene layer laminate to form a polymer film-graphene layer-mesh laminate may be through directly contacting the mesh with a surface of the graphene layer opposite to a surface in contact with the polymer film.
The method may further include prior to the depositing of the photosensitive film on the graphene layer-mesh laminate: forming an other polymer film-graphene layer laminate by repeating acts from the depositing of a graphene layer on a carrier substrate to the removing of the carrier substrate from the polymer-graphene layer-carrier laminate; attaching the other polymer film-graphene layer laminate on the graphene layer-mesh laminate to form an other polymer film-graphene layer-mesh laminate; and removing the polymer film from the other polymer film-graphene layer-mesh laminate to form an other graphene layer-mesh laminate.
The method may further include depositing a sealing layer on the photosensitive film to form a graphene layer-mesh-photosensitive film-sealing layer laminate.
The sealing layer may have a first surface in contact with the photosensitive film, and a second surface opposite to the first surface, the second surface being a free surface.
Reference will now be made in more detail to embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the embodiments of the present disclosure are merely described below, by referring to the figures, to explain aspects of the present description.
As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in more detail in the written description. Effects, features, and a method of achieving the inventive concept will be obvious by referring to exemplary embodiments of the inventive concept with reference to the accompanying drawings. The inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein.
In the embodiments described in the present specification, an expression utilized in the singular encompasses the expression of the plural, unless it has a clearly different meaning in the context. Also, it is to be understood that the terms such as “including,” “having,” and/or “comprising” are intended to indicate the presence of the stated features or components, and are not intended to preclude the presence or addition of one or more other features or components.
It will be understood that when a layer, region, or component is referred to as being “on” or “onto” another layer, region, or component, it may be directly or indirectly formed on the other layer, region, or component. That is, for example, intervening layer(s), region(s), or component(s) may be present.
Sizes of components in the drawings may be exaggerated for convenience of explanation. In other words, since sizes and thicknesses of components in the drawings are arbitrarily illustrated for convenience of explanation, the following embodiments of the present disclosure are not limited thereto.
A photocathode is a cathode that emits electrons when exposed to radiant energy, especially light. Photocathodes include photosensitive films that, when struck by a quantum of light (photons), convert the absorbed energy to electron emission due to the photoelectric effect. Photocathodes may be characterized by the quantum efficiency (QE) (the ratio of the emitted electrons over the incident photons). U.S. Pat. No. 8,823,259 discloses other parameters typically used to characterize photocathodes, the disclosure of which is incorporated herein in its entirety by reference.
Graphene is generally described as a one-atom-thick planar sheet of sp2-bonded carbon atoms that are densely packed in a honeycomb shaped crystal lattice. Graphene is the basic structural element of some carbon allotropes including graphite, carbon nanotubes and fullerenes. It should be understood that the terms “graphene,” and “graphene sheet” as used herein refer only to a single layer or a single sheet of graphene, while the term “graphene layer” may refer to a single sheet of graphene or multiple graphene sheets stacked over one another.
Graphene has many desired (e.g., outstanding) properties which makes it suitable for a photocathode: ultra-high electrical and thermal conductivity, optical transparency, impermeability to molecular gases, high charge mobility, and ability to sustain extreme current densities.
A photosensitive film 102 is on the first surface 101a of the mesh 101 and in openings 120 surrounded by wires 110 (e.g., photosensitive film 102 extends at least partially into the openings) of the mesh 101. The photosensitive film may be formed of any suitable photosensitive materials. For example, suitable photosensitive materials may include a metal, such as Cu, Ni, Mg, Y, Sm, Ba, Nb, Ca, Au, or Mg—Ba; a bi-alkali compound, such as high-temperature bi-alkali compound or low noise bi-alkali compound; a multi-alkali compound; an alkali-semiconductor alloy, such as K2CsSb, Cs3Sb, KCsSb mixed with CsBr, K3Sb, Na2KSb, Li2CsSb, Cs2Te, CsTe mixed with CsBr, CsKTe, K2Te, Rb2Te, or RbCsTe; an alkali-halide, such as CsI; CsI—Ge; GaAs; InGaAs; an alkali bi-metallic alloy such as CsAu, RbAu; polycrystalline diamond; or combinations thereof.
A barrier layer 104 is on the second surface 101b of the mesh 101. The barrier layer 104 may be a graphene layer, a graphene oxide layer, and/or a salt layer (such as a LiF layer). In one embodiment, the barrier layer 104 is the graphene layer 103 including one or more graphene sheets.
The photosensitive film 102 is in direct contact with the mesh 101 and the portion of the graphene layer 103 exposed through the openings 120 of the mesh 101.
The graphene layer may include 1 to 20 layers of graphene sheets. For example, the graphene layer may include a single layer of graphene sheet. In another embodiment, the graphene layer may include 2-5 layers of graphene sheets. When the number of graphene sheets is within the ranges described above, the graphene layer provides suitable protection to the photosensitive film against contaminating gases, such as CO, CO2, water vapor, and other oxidizing gases, and also has high optical transparency.
In one embodiment, the graphene layer may further include a dopant. A dopant may be included to enhance the brightness of the electron beam emitted by the photocathode, or provide other desired properties, such as high quantum efficiency. For example, the dopant may be Cs, Ca, Na, and/or K. The dopant atom may be intercalated into the graphene crystalline structure, as illustrated in
The sealing layer 410 may include a material selected from a metal halide (such as NaI, CsBr, CsI, MgF2, NaF, LiF, and CsF), SiOx, hexatricontane (HTC), and calcium stearate (CaSt).
The thickness of the mesh, the thickness of the photosensitive material, the thickness of the graphene layer, and the thickness of the sealing layer may be any suitable value for each of these layers to perform their respective functions.
For example, the graphene layer may be about 0.3 nm to less than 40 nm, for example, about 0.3 nm to about 1.5 nm thick. When the thickness of the graphene layer is within the ranges described above, satisfactory barrier properties can be achieved without sacrificing light transmission. However, if the graphene layer has a thickness of 40 nm or thicker, it is not suitable for a transmission mode photocathode due to poor light transmission.
The sealing layer may be about 1 nm to about 100 nm thick, for example, about 2 nm to about 5 nm thick.
The photosensitive film may have a thickness suitable for the application of the photosensitive device in which it is employed, for example, the photosensitive film may have a thickness of 10 nm to 1000 nm, for example, 100 nm to 500 nm.
The photocathode according to one or more embodiments of the present disclosure may include, on the graphene side, only the graphene layer attached to the mesh. That is, there are no additional layers of other materials attached to the graphene layer that is in contact with the mesh and the photosensitive material. Here, one surface of the graphene layer is in contact with the mesh and the photosensitive material, and the opposite surface is a free surface. Further, the photocathode according to one or more embodiments of the present disclosure may include, on the sealing layer side, only the sealing layer attached to the photosensitive material. That is, there are no additional layers of other materials attached to the sealing layer that is in contact with the photosensitive material. For example, in one embodiment, the photocathode of the present disclosure is free of a cathode substrate included in a conventional photocathode. In one embodiment, a photocathode includes only the above described graphene layer, mesh, photosensitive material layer and sealing layer, and is free of any additional layer or substrate.
Referring to
The carrier substrate may be any suitable material that can stand the graphene layer deposition process and not chemically interfering with the graphene layer. For example, the carrier substrate may be Cu foil or Ni foil. The carrier substrate may be pre-treated by an annealing process prior to the deposition of the graphene layer. For example, the carrier substrate may be heated at 400° C. for at least two hours in at least 1E-8 Torr vacuum.
The depositing of the graphene layer may be through chemical-vapor-deposition (CVD). High temperatures are required for graphene growth and the temperature is typically at 900° C. or higher. The conditions for depositing the graphene layer may be any suitable condition. For example, the graphene layer may be formed in a CVD process conducted at 1000° C. utilizing CH4/H2. However, embodiments of the present disclosure are not limited thereto.
The polymer film may be applied on the graphene layer-carrier laminate through any suitable method, such as spin coating. The polymer film may be made of a suitable material, such as PMMA.
The removing of the carrier substrate from the polymer film-graphene layer-carrier laminate may include: etching away the carrier substrate, or peeling the carrier substrate away utilizing a mechanical force. The etching may be conducted utilizing a suitable etchant, for example, an acid including a blend of HNO3, H3PO4 and H2O, and the etching may be conducted for about 2 to 6 hours. In one embodiment, the polymer film-graphene layer laminate may be transferred to the target substrate, or an intermediate substrate, such as a Si/SiO2 substrate, to be followed by drying of the polymer film-graphene layer laminate.
In another embodiment, the carrier substrate may be removed through a mechanical force. For example, the carrier substrate may be peeled off from the polymer film-graphene layer-carrier laminate by a mechanical force.
The attaching of the mesh to the polymer film-graphene layer laminate to form a polymer film-graphene layer-mesh laminate may be simply realized by bringing the free surface of the graphene layer (i.e., the side opposite to the one in contact with the polymer film) to be in contact with a surface of the mesh. It is believed that the van der Waals force forms a strong bond between the graphene layer and the mesh, and between adjacent graphene sheets when a plurality of graphene sheets are individually formed and stacked together afterwards. However, embodiments of the present disclosure are not limited thereto.
The removing of the polymer film from the polymer film-graphene layer-mesh laminate may include etching the polymer film utilizing a suitable solvent, such as acetone. The surface of the graphene layer from which the polymer layer is removed may be treated using a thermal cleaning procedure comprised of sustained heating at 400° C. for at least two hours in at least 1E-8 Torr vaccum.
The depositing of the photosensitive film on the mesh may be conducted utilizing any suitable method, for example, by chemical vapor deposition. The photosensitive material is deposited to be in contact with a free surface of the mesh (i.e., the surface opposite to the one in contact with the graphene layer), and also is deposited in the openings in the mesh surrounded by the wires. The photosenstive material deposited in the openings is also in contact with the graphene layer exposed through the openings. A graphene layer-mesh-photosensitive film laminate is thereby manufactured. That is, a photocathode with a graphene layer is manufactured.
Additional graphene sheets may be deposited on the carrier substrate and transferred to the graphene side of the graphene layer-mesh-photosenstive film laminate to provide a graphene layer with multiple graphene sheets. Alternatively, multiple graphene sheets may be deposited on the carrier substrate first, and then laminated with the mesh prior to the deposition of the photosensitive film.
The sealing layer may be deposited utilizing a suitable method, such as chemical vapor deposition.
A single crystalline Cu foil (hereinafter referred to as a Cu substrate or an un-coated Cu substrate) was loaded into a commercially available diamond growth chamber (e.g., Kurt J. Lester or equivalent). The reactor chamber was then evacuated to a base pressure, backfilled with H2 at a constant rate of 10 sccm, heated to 1000° C., and maintained at 40 mTorr pressure. CH4 was then supplied at a rate of 20 sccm to yield a total chamber pressure of 500 mTorr. Afterwards, the chamber is cooled at a rate of 10-50° C./min to thereby complete the deposition of a graphene layer on the Cu substrate.
The normalized quantum efficiency is calculated according to the following equation 1:
normalized quantum efficiency=quantum efficiency at a given time/quantum efficiency at time zero
As shown in
In one embodiment, a graphene layer-carrier substrate is first prepared according to the condition shown in
PMMA was then spin coated on the graphene layer-carrier substrate laminate at an RPM of about 1500. The polymer was then allowed to interact with the substrate for about 3 minutes, after which, the sample was dried at 80° C. on a hot plate. The Ni foil was then removed from the thus formed polymer film-graphene layer-carrier substrate laminate through acid etching. The sample was soaked in an acid blend including HNO3, H3PO4 and H2O mixed at a volumetric ratio of 1:1:1 for about 4 hours. The polymer film-graphene layer laminate obtained after the acid etching was then transferred to a Si wafer and dried at 80° C. on a hot plate. PMMA was then etched off utilizing acetone. The sample was soaked in acetone for 15 minutes each and repeated three times. After the acetone etching, the sample was washed with deionized water (DI-H2O), and dried at 80° C. on a hot plate.
Five layers of graphene sheets were transferred to one side of a Ni mesh, and K2CsSb was deposited to the other side of the Ni mess, thereby manufacturing a photocathode with five layers of graphene sheets. The quantum efficiency of the photocathode is measured as a function of photon energy and the results are shown in
While transferring of the graphene sheets from a carrier substrate to a mesh has been described above, embodiments of the present disclosure are not limited thereto. For example, the graphene layer may be directly deposited on the target substrate. In one embodiment, a metal photocathode is first deposited on a suitable substrate, such as silicon wafer, and a graphene layer is directly deposited on the metal photocathode through chemical vapor deposition. The terms “deposited” and “transferred” are used herein interchangeably with respect to the graphene layer.
The method for manufacturing of a photocathode according to embodiments of the present disclosure allows the photosensitive films, critical in many detection and electron emission applications, to be deposited (or grown) on vanishingly small substrates (e.g., a graphene layer) that are suspended in free space (i.e., without the macroscopic substrate utilized in conventional photocathodes). The photosensitive film according to embodiments of the present disclosure is encapsulated in a manner that preserves photo-sensitivity but prevents chemical degradation. Traditional metallic and semiconductor films (common, for example, in semiconductor devices and state of the art in photocathodes) require a macroscopic substrate for both support and electrical interface. This practical requirement limits the functionality of such films because features and properties that manifest only in free space suspension may not be accessible to or manifested in devices manufactured relying on macroscopic substrates.
A highly desirable feature of the present disclosure is the ability to grow a traditional photocathode film on a transparent suspended substrate that is only a few monolayers (atomic layers) thick. The diminutive dimensions of the substrate allow for electron tunneling of excited electrons through the transparent layer. A layer on either side of the photosensitive film allows for a.) protective encapsulation of the photocathode film, preventing it from being damaged by ions and contaminating trace amount of gases in vacuum; b.) un-inhibited electron emission from the photocathode; and c.) direct charge injection into the cathode itself. Additionally, the transparent and thin (e.g., graphene monolayer) substrate can be controllably doped to optimize performance. The graphene is held suspended on a scaffold of metallic or semiconductor micron-sized mesh which provides micron-level support of the suspended transparent substrate as well as a method of electrically interfacing with the device.
The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the claimed invention to the precise form disclosed. Those of skill in the art will readily appreciate that many modifications and variations to the claimed invention are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application to thereby enable others skilled in the art to best utilize the invention in various photocathode embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined exclusively by the following claims, and equivalents thereof.
This application is a divisional of U.S. patent application Ser. No. 15/644,711, filed on Jul. 7, 2017, which claims priority to and the benefit of U.S. Provisional Patent Application No. 62/360,295, filed in the United States Patent and Trademark Office on Jul. 8, 2016, the entire content of each of which is incorporated herein by reference.
The United States government has rights in this invention pursuant to Contract No. 89233218CNA000001 between the United States Department of Energy/National Nuclear Security Administration and Triad National Security, LLC for the operation of Los Alamos National Laboratory.
Number | Name | Date | Kind |
---|---|---|---|
4528474 | Kim | Jul 1985 | A |
6791251 | Seo et al. | Sep 2004 | B2 |
6800990 | Choi et al. | Oct 2004 | B2 |
8823259 | Moody | Sep 2014 | B2 |
8957573 | Vancil | Feb 2015 | B2 |
8981338 | Fuke et al. | Mar 2015 | B2 |
9102524 | Papadakis | Aug 2015 | B2 |
9790620 | Katsap | Oct 2017 | B1 |
10354828 | Moody | Jul 2019 | B1 |
20040061429 | Sakai et al. | Apr 2004 | A1 |
20050067602 | Schutz | Mar 2005 | A1 |
20050174030 | Katsap | Aug 2005 | A1 |
20050212395 | Anazawa et al. | Sep 2005 | A1 |
20090291270 | Zettl et al. | Nov 2009 | A1 |
20110048625 | Caldwell et al. | Mar 2011 | A1 |
20120244281 | Fox et al. | Sep 2012 | A1 |
20120295096 | Liu et al. | Nov 2012 | A1 |
20140097736 | Katsap | Apr 2014 | A1 |
20140139100 | Kobayashi | May 2014 | A1 |
20150206694 | Liu et al. | Jul 2015 | A1 |
20150247178 | Mountcastle et al. | Sep 2015 | A1 |
20160074815 | Sinton et al. | Mar 2016 | A1 |
Number | Date | Country | |
---|---|---|---|
62360295 | Jul 2016 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 15644711 | Jul 2017 | US |
Child | 16440933 | US |