Claims
- 1. The process of coating a substrate which comprises (1) applying to a substrate a curable composition comprising
- (A) an imide containing polyene of the formula: ##STR27## wherein .fwdarw. denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages;
- R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue;
- A is an alkylene group having from 1 to 10 carbon atoms;
- Y is a member of the group consisting of --CR"=CH.sub.2, --O--(CH.sub.2).sub.d --CR"=CH.sub.2, ##STR28## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10, and
- (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R.sub.8 --(SH).sub.n where n is at least 2 and R.sub.8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, and, thereafter, (2) exposing said curable composition under ambient conditions to a free radical generator to form a solidified, cured imide containing polythioether coating on said substrate.
- 2. The process according to claim 1 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable composition of a photocuring rate accelerator and the free radical generator is U.V. radiation.
- 3. The process according to claim 1 wherein the free radical generator is high energy ionizing radiation.
- 4. A process for forming a continuous flexible adherent cured coating on the surface of an electrical conductor selected from the group consisting of wire and cable which comprises (1) immersing said electrical conductor in a bath of a liquid radiation curable composition comprising
- (A) an imide containing polyene of the formula: ##STR29## wherein .fwdarw. denotes isomerism, R is a divalent organic moiety remaining after a secondary diamide has reacted with adjacent carboxylic acid groups to form imide linkages;
- R' is an aromatic residue attached to at least 3 carbonyl groups at least two of which groups are attached to adjacent carbon atoms on the aromatic residue;
- A is an alkylene group having from 1 to 10 carbon atoms;
- Y is a member of the group consisting of -CR"=CH.sub.2, --O--(CH.sub.2).sub.d --CR"=CH.sub.2, ##STR30## R" is hydrogen or methyl; k and h are 0 or 1; m and d are 1 to 10 and p is 0 to 10
- (B) a polythiol having a molecular weight in the range from about 94 to 20,000 of the general formula: R.sub.8 --(SH).sub.n where n is at least 2 and R.sub.8 is a polyvalent organic moiety, the sum of m and n being greater than 3, the polyene/polythiol mole ratio being in the range 0.2 to 8.0:1, respectively, thus coating said electrical conductor with said composition, (2) passing said coated electrical conductor through a die, and thereafter (3) exposing said coated electrical conductor to radiation having an energy greater than 3 electron volts for a time sufficient to cure said coating on said electrical conductor.
- 5. The process according to claim 4 wherein the curable composition contains 0.005 to 50% by weight of the polyene and polythiol of said curable-composition of a photoinitiator and the radiation is U.V. radiation.
- 6. The process according to claim 4 wherein the radiation is high energy ionizing radiation.
Parent Case Info
This application is a continuation-in-part of copending application having Ser. No. 830,225, filed Sept. 2, 1977 which in turn is a continuation-in-part of copending application having Ser. No. 753,750, filed Dec. 23, 1976, now U.S. Pat. No. 4,080,484.
US Referenced Citations (6)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
830225 |
Sep 1977 |
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Parent |
753750 |
Dec 1976 |
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