Patent Application
20080217651
The present invention relates to a structure and the manufacturing method of a semiconductor photodetector, and more particularly to a structure and the manufacturing method of a semiconductor photodetector where a metal-insulation layer-semiconductor is formed on the base piece having a germanium layer formed thereon.
In the semiconductor photodetector, the photo energy is received by the sensor and transferred to an electric signal for the photo-communication and photo detecting.
In the Taiwan Patent No. 125431, the metal-oxide semiconductor tunneling diode (MOS tunneling diode) is used as the photo detector. However, the detectable wavelength thereof is limited by the energy gap of the semiconductor material, because the photon energy needs to be larger than the energy gap of the material in order to generate the extra electron-hole pairs. If the silicon (Si) is used as the substrate, the cut-off wavelength is about 1.1 μm, and if the germanium (Ge) is used as the substrate, the cut-off wavelength is about 1.85 μm. Therefore, if the photo detection is required to be applied to the wavelengths of 1.3 μm and 1.55 μm, the germanium has to be used as the substrate. However, the substrate completely made of germanium is very expensive, so the cost down thereof is the major problem to be solved.
Moreover, in the U.S. Pat. No. 5,374,564, the Smart-cut process is provided, which implants the hydrogen ion into the inner layer of the wafer by using the ion implantation technique, and controls the implantation depth through the implantation energy. The wafer can be cut through the property of the implanted hydrogen ion which will enable the wafer separation in high temperature. Using such technique can slice the expensive germanium substrate into pieces of thin germanium chips.
Furthermore, in the U.S. Pat. No. 6,833,195B1, the Intel Corporation implants the ion into the germanium substrate at first. Then the germanium substrate and the silicon substrate are ostensibly activated and bonded together. Finally, the germanium substrate and the silicon substrate are heated, as mentioned in the method of the Smart-cut process, for cutting the germanium substrate, so as to obtain a silicon substrate with a thin germanium layer.
In order to overcome the problem of the expensive germanium material, a photodetector and the manufacturing method thereof are provided. The particular design in the present invention not only solves the problems described above, but also is easy to be implemented. Thus, the invention has the utility for the industry.
In accordance with the present invention, a photodetector and the manufacturing method thereof for forming the metal-insulation-semiconductor on the base piece with a germanium layer are provided, so as to solve the present problem of the expensive germanium material.
According to one aspect of the present invention, a photodetector is provided. The photodetector includes a base piece; a germanium layer mounted on the base piece and including a first area and a second area; a first metal electrode mounted on the first area; an insulation layer mounted on the second area; and a second metal electrode mounted on the insulation layer.
Preferably, the photodetector further comprises a voltage source comprising a first electrode terminal connected to the first metal electrode; and a second electrode terminal connected to the second metal electrode, wherein, the voltage source provides a bias voltage for generating a tunneling current, so that the photodetector produces a photocurrent while it receives a light.
Preferably, the base piece comprises a silicon substrate; and an insulation film mounted on the silicon substrate, wherein the germanium layer is bonded on the insulation film.
Preferably, the insulation film is a silica film.
Preferably, the base piece is a plastic board.
Preferably, the base piece is a glass board.
Preferably, the germanium film is a doped germanium film.
Preferably, the first metal electrode is an aluminum electrode.
Preferably, the insulation layer is made of a silicon dioxide.
Preferably, the second metal electrode is a platinum electrode.
According to another aspect of the present invention, a method for manufacturing a photodetector is provided. The method includes the steps of a) providing a supporting substrate with a germanium layer mounted thereon, wherein the germanium layer has a first area and a second area; b) forming an insulation layer on the first and the second areas; c) forming a second metal electrode on the insulation layer; d) removing apportion of the insulation layer on the first area; and e) forming a first metal electrode on the first area.
Preferably, the step b) is performed by a low temperature liquid depositing technique.
The present invention has the advantage of avoiding using the seldom and expensive germanium material, which are replaced by the cheaper silicon dioxide-silicon substrate, the glass substrate or other substrates with the function of carrying and transferring the germanium film.
Moreover, the conventional metal-insulator-semiconductor photodetector uses the silicon as the semiconductor, so the method for manufacturing the insulation layer on the semiconductor uses the high temperature heat growing process to generate a thermal oxide as the insulation layer. However, when the germanium is used as the semiconductor, the high temperature heat growing process cannot be used because of the low melting point of the germanium. Even if the high temperature heat growing process is used, the germanium dioxide insulation layer formed is unstable. The present invention preferably provides a silicon dioxide insulation layer by using the low temperature liquid depositing technique.
Furthermore, the platinum is used in the present invention instead of the aluminum gate of the conventional metal-insulator-semiconductor photodetector. Therefore, the present invention can stop the electron tunneling from the metal to the semiconductor under the reverse bias, thereby greatly decreasing the dark current.
a)-1(f) are schematic diagrams showing the sectional view of the photodetector according to a preferred embodiment of the present invention;
Please refer to
Please refer to FIG. (1a), the first step of the present invention uses the Smart-cut process provided by the U.S. Pat. No. 5,374,564, which implants the hydrogen ion 113 into the position of the interface 112 of the N-type germanium substrate 111 by using the ion implantation technique under the following process conditions: the energy 200 KeV, the implantation quantity=1E17 (cm−2), wherein the implantation depth is associated with the implantation energy, and the implantation concentration is associated with the temperature and the time for the wafer separating process.
Please refer to FIG. (1b), which shows the step of growing a silicon dioxide of 80 nm 122 on a P-type silicon wafer 121, wherein the base piece 123 is composed of the silicon wafer 121 and the silicon dioxide 122.
Next, please refer to the technique mentioned in the U.S. Pat. No. 6,833,195B1, wherein the Intel Corporation implants the ion into the geranium substrate at first. Then the germanium substrate and the silicon substrate are ostensibly activated and bonded together. Finally, the germanium substrate and the silicon substrate are heated, as mentioned in the method of the Smart-cut process, for cutting the germanium substrate, so as to obtain a silicon substrate with a thin germanium layer. The technique of the U.S. Pat. No. 6,833,195B1 will be applied to the later steps of this preferred embodiment.
Next, the germanium substrate 111 and the silicon wafer 121 are washed by the supersonic with the deionized water for eliminating the dust particle on the silicon wafer surface. The silicon wafer 121 is immersed in the SC-1 solution (NH4OH:H2O2:H2O˜0.5:1:5) at 80° C. for 15 minutes, and the germanium substrate 111 is immersed in the potassium hydroxide-deionized water solution (KOH:H2O˜1:5) at 80° C. for 15 minutes. Afterward, the germanium substrate 111 and the silicon wafer 121 are respectively washed with the deionized water for 5 minutes, and dried by the high pressure pure Nitrogen. At this time, the surfaces of the germanium substrate 111 and the silicon wafer 121 are fully spread with the hydrophilic OH− bonds.
Please refer to FIG. (1c), after the bonding surface of the germanium substrate 111 and the silicon wafer 121 is aligned, the germanium substrate 111 and the silicon wafer 121 are bound directly at the room temperature in the vacuum chamber.
Please refer to FIG. (1d), the bound germanium substrate 111 and silicon wafer 121 is heated to 150° C. at 1 atmospheric pressure in the Nitrogen purge environment and maintained for 12 hours for enhancing the bonding strength and separating the wafer by the hydrogen ion implanted into the interface 112 thereof. After separating, the base piece 123 has a successfully transferred thin germanium layer 131 thereon, which is divided into a first area 132 and a second area 133.
After separating, the surface of the successfully transferred thin germanium layer 131 is evened by the evening techniques, such as the chemical mechanical polishing, for decreasing the influence of the rough surface on the element properties.
Please refer to FIG. (1e). The silicon dioxide insulation layer 141 is formed by the low temperature liquid depositing technique as a tunneling gate insulation layer Finally, a Platinum (Pt) layer is sputtered on the insulation layer 141. The second metal electrode 142 is formed on the second area 133 by using the lithography and the etching techniques to remove the extra Platinum. The insulation layer 141 on the first area 132 is removed by using the lithography and the etching techniques, and the etched space is plated with Aluminum to form the first metal electrode 143 for ohmic contact, thereby completing the photodetector of this preferred embodiment.
Please refer to
Please refer to FIG. (1f), which shows the last step of providing a voltage source 210. The voltage source 210 includes a first electrode 211 and a second electrode 212. The first electrode 211 is connected to the first metal electrode 143 and the second electrode 212 is connected to the second metal electrode 142. The voltage source 210 provides a bias to generate a tunneling current, which enables the photodetector 140 to generate a light current when lighted.
Please refer to
In the preferred embodiment of the present invention, the base piece 123 only includes the silicon wafer 121 and the silicon dioxide 122. However, in other embodiments, the base piece 123 can be a plastic substrate, a glass substrate or other substrates with the function of carrying and transferring the germanium film.
Please refer to
Please refer to
The insulation layer 141 is the silicon dioxide formed by the low temperature liquid depositing technique in the preferred embodiment. However, in other embodiments, the insulation layer 141 can be the silicon dioxide formed by other techniques or other insulation substances.
The germanium layer 131 is separated from the N-type germanium substrate 111 in the preferred embodiment. However, in other embodiments, the germanium layer 131 can also be separated from a P-type or a non-doping germanium substrate 111, in which the doping concentration thereof can be adjusted arbitrarily according to actual needs. Moreover, the germanium substrate 111 can be a single-crystal, a poly-crystal or an amorphous substrate, and can also be a {100}, a {110} or a {111} substrate.
The first metal electrode 143 is made of aluminum in the preferred embodiment. However, in other embodiments, the first metal electrode 143 can also be made of other metals.
The second metal electrode 142 is made of platinum in the preferred embodiment. However, in other embodiments, the second metal electrode 142 can also be made of other metals.
The bonded germanium substrate 111 and silicon wafer 121 are heated to 150° C. at 1 atmospheric pressure in the Nitrogen purge environment and maintained for 12 hours for enhancing the bonding strength and separating the wafer by the hydrogen ion implanted into the interface 112 thereof in the preferred embodiment. However, in other embodiments, the temperature can be between 150° C. and 600° C., and the heating time can be minutes to hours for achieving the purpose of separating.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
| Number | Date | Country | Kind |
|---|---|---|---|
| 96107588 | Mar 2007 | TW | national |
