Patent Application
20070012335
The present invention relates, most generally, to semiconductor device manufacturing, and more specifically to cleaning methods for the photomasks used in semiconductor device manufacturing.
In the semiconductor manufacturing industry, cleaning is one of the most important aspects of photomask manufacturing and maintenance because even the smallest contaminating particles may be printable on wafers and such particles can destroy devices. Photomask cleaning requirements are stricter than those for the wafers upon which the devices are formed because the photomasks provide the master image from which all wafer patterning occurs. More difficult challenges are now faced as we enter the 90 nm era with 193 nm DUV lithography and more prominent use of phase shifting mask (PSM) applications. A phase-shifting, or phase-shift mask differs from a conventional photomask as it includes a layer of semi-transparent material featuring a desired refractive index and thickness which is locally added to the mask in order to shift phase of the light passing through the transparent portion of the mask. Phase-shifting increases the resolution of pattern transfer by using destructive interference that prevents photoresist exposure in regions in which it should not be exposed. MoSi or variations of MoSi such as MoSiON are advantageously used as this phase-shifting material. It is therefore critical that the cleaning procedures used to clean phase-shift masks can effectively clean MoSi-based and other phase shift materials.
The cleaning operations used to clean photomasks are needed during the manufacturing process used to produce the photomasks and also to clean finished photomasks that are being used in the production environment. The manufacturing process used to form photomasks includes patterning operations that utilize photoresist materials which must be completely removed before the photomask can be used in the production environment.
As the defect sizes that must be controlled in the manufacturing environment decrease, conventional cleaning methods such as SC1 (NH4OH/H2O2/H2O) and megasonic hardware cleaning techniques fall short. A shortcoming of such conventional cleaning processes is that they leave particles and other contaminants on the photomask which are printable onto wafers, i.e. semiconductor substrates. It would therefore be desirable to provide a photomask cleaning operation advantageously suited to cleaning phase-shift and other photomasks and which renders the photomask virtually free of printable contaminants. The present invention addresses such needs.
To address these and other needs and in view of its purposes, the present invention provides a method for cleaning a photomask. In one aspect, the method includes providing a photomask, performing a wet chemical clean on the photomask, and performing a physical or dry chemical treatment to further clean the photomask. The method may include initially cleaning with ozone generated by vacuum ultraviolet (VUV) light and secondly cleaning with a liquid NH4OH/H2O2/H2O mixture. Alternatively, the physical or dry chemical treatment may follow the wet chemical clean.
Another aspect of the present invention is a method for cleaning a Mo-containing surface. The method includes providing a Mo-containing surface, generating MoO3 on the Mo-containing surface and then cleaning with a liquid NH4OH/H2O2/H2O mixture.
Another aspect of the present invention is a method for cleaning a photomask comprising providing a photomask, performing a wet chemical clean, the wet chemical clean including at least one of a liquid NH4OH/H2O2/H2O mixture and a liquid H2SO4:H2O2 mixture in about a 1:4 ratio, then cleaning the photomask using electrically ionized water.
The present invention is best understood from the following detailed description when read in conjunction with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not necessarily to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Like numerals denote like features throughout the specification and drawing.
Phase-shift and other photomasks require cleaning during the manufacturing processes used to form the masks and also after their manufacture is complete and they are being used in the production environment. The manufacturing process used to form phase-shift and other photomasks includes coating the surface of the photomask with a photoresist material then using a photolithographic process to pattern the photomask. The pattern may be a chrome pattern that is opaque or a pattern in the phase-shift material such as MoSi which is partially transmissive. The present invention provides a multi-step cleaning procedure that effectively cleans MoSi-based or other phase-shift or other photomask surfaces. In one embodiment, the multi-step cleaning procedure involves two steps including a first step that utilizes vacuum ultraviolet (VUV) light to generate ozone which is directed to the surface and which is followed by an SC1 (NH4OH/H2O2/H2O) cleaning process. In another embodiment, a two-step cleaning procedure includes a first step used to form MoO3 on the surface of the Mo-containing layer using various methods. The two-step cleaning procedure effectively removes photoresist and other organic and other contaminants, reduces phase-shift loss and increases transmission. In other exemplary embodiments, the multi-step cleaning procedure may include more than two steps and may be used to clean phase-shift or other photomasks after their manufacture is complete, and between uses when the photomasks are used in the production environment.
In addition to finding utility in the illustrated photomask manufacturing sequence, the cleaning operation of the invention may also be used to clean the photomask after it has been manufactured and is being used in a production environment. Furthermore, the multi-step cleaning operation of the invention may be used to clean photomasks formed of other materials.
In one embodiment, the first step of the exemplary two-step cleaning operation involves the generation of ozone using a vacuum ultraviolet (VUV) light radiation source. In one exemplary embodiment, an excimer Xe2 laser may be used to generate 172 nm VUV light. The VUV 172 nm light may be produced by a number of fine wire-like discharge plasmas that are generated between two dielectrics. In these microdischarges, electrons excite some Xe atoms. An excited Xe atom then can react with another Xe atom to form an Xe2 excimer. The discharged plasma excites the gas atoms to instantaneously produce the “excimer” state. The excimer is unstable and decomposes rapidly back into two (2) Xe atoms, releasing a VUV photon at 172 nm. The 172 nm photons can generate atomic oxygen and ozone (O3) according to the following equations:
The ozone is directed or allowed to contact the surface of the photomask to clean the surface. The VUV treatment chamber conditions may include a pressure of about 1 atmosphere or less, and a temperature of about 50-60° C. in one exemplary embodiment, but other temperatures and pressures may be used in other exemplary embodiments. A typical cleaning time may be from 10-30 minutes, but other times may be used. Additionally, it should be pointed out that other wavelengths of radiation may be produced by various techniques and directed to an oxygen source to generate ozone which may then be directed to the photomask surface for cleaning. Various conventional methods may be used to direct the generated ozone to the surface to be cleaned. Applicants have found that this treatment passivates the MoSi surface through oxidation. Applicants believe that this surface oxidation may be the cause for the reduction in phase loss and increase in transmission when the VUV/ozone step is followed by a wet chemical clean according to an exemplary two-step cleaning operation of the present invention, when the two-step cleaning operation is carried out successively on a photomask or other MoSi surface.
In one embodiment in which the photomask includes a Mo-containing layer such as MoSi or MoSiON, the VUV/ozone oxidation step generates a molybdenum oxide such as MoO3 on the Mo-containing layer. In other exemplary embodiments, other techniques may be used to generate MoO3 on the Mo-containing material surface. For example, a plasma treatment or chemical vapor deposition (CVD) process capable of generating MoO3 may be used. Applicants have found that the MoO3 prevents the MoSi or MoSiON layer from being damaged during a subsequent wet chemical cleaning process such as SC1 clean.
After the VUV ozone cleaning process, an SC1 cleaning step follows according to one exemplary embodiment. The SC1 cleaning is a conventional cleaning operation used in semiconductor manufacturing and includes an ammonia hydroxide/hydrogen peroxide/water mixture, which may be 0.25:1:5 and is generally capable of removing particles and some organics from surfaces. The SC1 cleaning operation is typically carried out at a temperature between 40° C. and 70° C. When the VUV/ozone cleaning operation is followed by the SC1 conventional clean, transmission is maximized and particle contamination is minimized. In one advantageous embodiment, when the 172 nm VUV/ozone surface treatment was carried out in conjunction with the SC1 clean, the cleaning sequence provided a reduction in phase loss and transmission increase more than 79% and 70% respectively.
Although described in conjunction with a cleaning operation illustrated in a process sequence of
Another exemplary embodiment of the multi-step cleaning operation of the present invention is a two or more step cleaning operation that provides at least one wet chemical cleaning operation followed by a further physical or wet or dry chemical treatment to reduce chemical residue. This exemplary cleaning sequence may be used during the photolithography operations used to produce the photomask or it may be used on a completed photomask being used in the production environment. According to this exemplary embodiment, the first conventional wet-cleaning operation may be an SC1 cleaning operation as described above or it may be an SPM cleaning operation, either of the cleaning operations advantageously followed by a rinse. An SPM cleaning solution includes an H2SO4:H2O2 mixture typically in a 1:4 ratio but other ratios may be used alternatively. The SPM cleaning solution provides a strong oxidizing clean that removes organic materials including photoresist and other contaminants. It may be carried out at various temperatures. In another exemplary embodiment, the initial wet-cleaning operation may include the sequence of an SPM cleaning, rinse, SC1 cleaning and rinse.
At or near the conclusion of the conventional wet-cleaning operation or operation sequence, a further chemical or physical treatment is carried out to clean any residuals that may result from the conventional wet-cleaning operation or operations. In one exemplary embodiment, the further cleaning operation (i.e., treatment) may be a heating or baking procedure that vaporizes any remaining contaminants on the photomask surface. Various temperatures and times may be used. In one exemplary embodiment, the temperature may be at or near the melting temperature of one of the components used in the wet chemical cleaning operation or operations. For example, the bake temperature may be at or near the melting temperature of NH4OH or at or near the melting point of (NH4)2SO4 but other temperatures may be used in other exemplary embodiments. During the heating or baking operation, the pressure may be controlled at or near vacuum to assist in the vaporization process. The heating or baking procedure may be carried out when the photomask is still wet from the wet chemical clean, or after drying.
In another exemplary embodiment, the further cleaning operation may be the VUV/ozone cleaning operation as described above. The radiation energy and excited oxygen ions assist in the cleaning of defects that may be on the mask surface. In another exemplary embodiment, the further cleaning operation may involve the use of electrically-ionized water. According to this exemplary embodiment, the final rinse step of the wet-cleaning operation or sequence may electrically ionize the water used for rinsing using an anode and a cathode and conventional electrochemical techniques. Applicants have found that this urges chemical ions, i.e., contaminating particles, to emigrate from the photomask surface. The further cleaning operation may also other dry or wet physical or chemical cleaning operations.
In still another exemplary embodiment, a three-step photomask cleaning operation may be used. The three-step cleaning operation may involve the VUV/ozone cleaning operation followed by a wet chemical cleaning sequence including one or more of the previously described wet-cleaning operations which is then followed by one or more of the further cleaning operations, i.e., physical or chemical treatments, described above.
After cleaning, the phase-shift photomask may advantageously be used in a lithographic operation to form a semiconductor device pattern on a semiconductor substrate.
The preceding merely illustrates the principles of the invention. It will thus be appreciated that those skilled in the art will be able to devise various arrangements which, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. For example, other techniques may be used to generate the ozone or to produce MoO3 on the Mo-containing material surface. Furthermore, the cleaning operation may be used to clean attenuated (MoSi-based) PSM's, chrome masks, alternating (Cr-based) PSM's, BIM's (binary masks consisting of Cr-based films and quartz) and other photomasks.
Furthermore, all examples and conditional language recited herein are principally intended expressly to be only for pedagogical purposes and to aid the reader in understanding the principles of the invention and the concepts contributed by the inventors to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents and equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure.
Although the invention has been described in terms of exemplary embodiments, it is not limited thereto. Rather, the appended claims should be construed broadly, to include other variants and embodiments of the invention, which may be made by those skilled in the art without departing from the scope and range of equivalents of the invention.
