Claims
- 1. A photocurable solder resist for use with flexible printed circuit boards comprising from 10 to 20% by weight of a resin selected from the group consisting of epoxy (metha) acrylate and trimethylol propane triacrylate having at least three groups per molecule selected from acryloyl and methacryloyl groups, from 10 to 12% by weight of an ester (metha) acrylate having two groups per molecule selected from acryloyl and methacryloyl groups, and 32 to 42% by weight of 2-hydroxyethyl methacrylate and a sensitizer.
- 2. A photocurable solder resist as claimed in claim 1, wherein said resin having at least three groups per molecule selected from acryloyl and methacryloyl groups is selected from epoxyacrylate, trimethylolpropane triacrylate and mixtures thereof.
Priority Claims (1)
Number |
Date |
Country |
Kind |
54-151214 |
Nov 1979 |
JPX |
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Parent Case Info
This is a continuation, of application Ser. No. 205,011, filed Nov. 7, 1980 abandoned.
US Referenced Citations (6)
Non-Patent Literature Citations (1)
Entry |
Chem. Abst. 84:6651u, Yoshihara et al., Jul. 3, 1975. |
Continuations (1)
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Number |
Date |
Country |
Parent |
205011 |
Nov 1980 |
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