The invention generally relates to photovoltaic cells and modules/panels and, more particularly, the invention relates to improving efficiency of photovoltaic cells and modules/panels.
Photovoltaic cells convert light into electrical energy. To that end, a photovoltaic cell has a doped substrate that, when exposed to light, generates charge carriers, such as electrons. Conductors (referred to in the art as a “tabs”) coupled with the substrate conduct these electrons to another device, thus producing an electrical current.
One common photovoltaic cell technology collects the charge carriers by forming a plurality of conductive fingers on the substrate. The fingers conduct the collected charge carriers to the bonding site of one or more of the tabs to the substrate. These bonding sites, which are known in the art as “busbars,” provide a large surface for the tab to electrically connect with the fingers.
Problems arise when the physical connection between the tab and discontinuous busbars (i.e., busbars formed from a plurality of pads) inadvertently breaks. For example, in some designs, a solder weld normally secures the tab to the busbar pads. Undesirably, the connection to any one of those pads can be prone to some breakage, consequently reducing or eliminating that important electrical connection. In that case, charge carriers collected by the finger associated with that now disconnected pad can be lost, reducing cell efficiency.
In accordance with one embodiment of the invention, a photovoltaic cell has a photosensitive substrate, a plurality of fingers in ohmic contact with the substrate, and a plurality of pads on the substrate. The plurality of pads effectively form a plurality of discontinuous busbars—sometimes simply referred to herein (e.g., in this Summary and in the Claims) as “busbars.” Two of the fingers extend from a first pad of the plurality of pads. Specifically, a given one of the two fingers (“given finger”) may connect with a second pad in the same busbar. This given finger may have an inter-pad portion between the first and second pads. The cell further has a tab at least partially covering the inter-pad portion of the given finger.
The two fingers may include a first finger that is generally orthogonal to the given finger. The first finger also may connect to a third pad so that the portion of the first finger that is external to the pads (i.e., between the pads) is uncovered (by tabs).
In some embodiments, the tab substantially entirely covers the inter-pad portion of the given finger. The fingers may include any of a variety of types, including continuous and/or discontinuous fingers. In other embodiments, the given finger connects with more pads. For example, the given finger may connect with a third pad, and the tab may cover at least a part of the given finger adjacent to the third pad.
As another example, the plurality of pads are arranged in a two dimensional array. The first pad and second pad are part of a specific busbar having a plurality of additional pads. The given finger electrically connects with the additional pads in the specific busbar. Further, the two-dimensional array may form a plurality of additional busbars that are generally parallel with the specific busbar. The cell also may include a plurality of additional tabs. Each additional busbar is connected to one of the additional tabs. In a manner similar to the specific busbar, each additional busbar may have multiple pads. Each busbar connects with at least one additional finger for connecting at least two of its own multiple pads.
In some embodiments, the plurality of pads may include pads that each have at least four concavities. Moreover, the noted two fingers, which may have substantially the same thicknesses or different thicknesses, illustratively can be not parallel.
In accordance with another embodiment of the invention, a method of forming a photovoltaic apparatus provides a photosensitive substrate, and forms a plurality of pads and first set of fingers on the substrate. The plurality of pads form a plurality of discontinuous busbars. The method also forms a given set of fingers. Each given finger physically and electrically connects with two of the pads; both of the (two) pads are also connected with at least one first finger. The method secures a plurality of tabs to the plurality of busbars so that each busbar is secured to a tab. Each tab covers at least a portion of the given fingers between pads.
In accordance with other embodiments of the invention, a photovoltaic cell has a photosensitive substrate with a top surface, a plurality of pads (forming a plurality of discontinuous busbars) on the top surface of the substrate, and a plurality of fingers in ohmic contact with the top surface of the substrate. The cell also has a plurality of tabs secured to the pads. The plurality of tabs substantially entirely cover the plurality of fingers. Moreover, the top surface of the substrate is substantially free of uncovered fingers
Those skilled in the art should more fully appreciate advantages of various embodiments of the invention from the following “Description of Illustrative Embodiments,” discussed with reference to the drawings summarized immediately below.
Bonds between a tab and busbar in a photovoltaic cell frequently break. It is a reality in the photovoltaic cell industry, and reduces cell efficiency. In illustrative embodiments, a photovoltaic cell with discontinuous busbars (i.e., busbars formed from pads) has conductive fingers configured to reduce carrier loss when the conductive bond between a tab and one or more of its pads breaks. To that end, such fingers interconnect some or all of the pads to one or more other pads in the same discontinuous busbar. Accordingly, if the tab bond breaks at a given pad, then carriers (e.g., electrons) for that pad can flow to another local pad. Consequently, those carriers are not completely lost, thus mitigating efficiency losses that could be caused by that bond break.
In other embodiments, the top face 14A of a photovoltaic cell has one type of fingers only; namely, fingers that are substantially completely covered by tabs. In other words, no finger on the top face 14A of the cell is exposed—all are substantially completely covered by tabs. This should reduce shading, permit thinner tabs and thus, improve cell efficiency. Details of illustrative embodiments are discussed below.
It should be reiterated that the module 6 shown in
Among other things, the photovoltaic cell 10 has a doped substrate 12 with a plurality of conductors on its top and bottom faces/surfaces 14A and 14B to collect and transmit electricity/current to an external device, such as another photovoltaic cell 10 or an external load. More specifically,
Specifically, as shown in
In various embodiments, the fingers 18 are much thinner than those known in the art. For example, some or all of the fingers 18 may have (average) thicknesses that are substantially less than about 120 microns. In fact, some embodiments have finger thicknesses of less than about 60 microns. Details of the finger thicknesses and related benefits are discussed more fully in the parent application (incorporated U.S. patent application Ser. No. 12/331,586). Other embodiments, however, do not require such thin fingers 18.
As shown in the various figures, the discontinuous busbars 20 are generally parallel to each other. In a similar manner, the horizontally oriented fingers 18 are generally parallel to each other. Alternative embodiments also may form the discontinuous busbars 20 and fingers 18 in different orientations. For example, the fingers 18, discontinuous busbars 20, or both could traverse in a random manner across the top face 14A of the substrate 12, at an angle to the fingers 18 and discontinuous busbars 20 shown, or in some other pattern as required by the application.
As noted above, the photovoltaic cell 10 also has a plurality of tab conductors 22 (referred to generally as “tabs 22” and shown in
Conventional processes bond each tab 22 to a plurality of the busbar pads 32 making up a single discontinuous busbar 20. To that end,
Additional fingers 18P, not shown in
More specifically, as noted above, these bond sites sometimes can break, thus eliminating the ohmic contact between the tab 22 and the bond pad 32. When this happens, certain prior art designs suffer from decreased efficiency. In particular, a tab 22 receives carriers from its finger 18 at the pads 32. When the tab/pad connection breaks, that finger 18 transmits the carriers to the next pad/discontinuous busbar along its path. Many such carriers do not survive long enough to be transmitted by that finger 18 due to transmission resistance.
More particularly, to compromise between shading/coverage and conductivity, many cell designers space the bond pads 32 on a single discontinuous busbar 20 closer together than the space between bond pads 32 of adjacent discontinuous busbars 20.
To illustrate this phenomenon,
Illustrative embodiments of the invention compensate for this unintended but not unusual occurrence by positioning additional fingers 18P between the pads 32 of a single discontinuous busbar 20 (as noted above). Specifically,
The combination of pad fingers 18P and pads 32 is distinct from continuous busbars in a number of ways. In particular, the pad fingers 18P are not soldered to the tabs 22. Specifically, the substantial majority of the top facing area of a continuous busbar typically is soldered to a tab 22. For example, solder may reflow to the entire top face of a continuous busbar—as with a discontinuous busbar 20 (i.e., solder on the top faces of the pads only). This is in contrast to the pad fingers 18P, which are not soldered to the tabs 22. Indeed, in practice, some solder may inadvertently flow onto some parts of the pad fingers 18P, but that unintended consequence does not transform them into part of a continuous busbar. One of skill in the art should understand that distinction and thus, design cell fabrication processes to avoid soldering the tabs 22 to the pad fingers 18P.
In addition, continuous busbars have no pads 32. Instead, the pad fingers 18P are much thinner than the largest outer dimension of the pads 32. For example, the pad fingers 18P may have the same thickness as the other fingers 18 on the top face 14A of the cell 10, while the pads 32 may have outer dimensions that are much larger, such as two times, ten times, or fifty times larger. Other embodiments, however, vary the finger thicknesses of the two types of fingers 18 and 18P. In any event, the outer dimension of the pads 32 still are larger than the thickness of the pad fingers 18P. Various embodiments thus permit a designer to take advantage of the benefits of discontinuous busbars 20 while compensating for unintended breaks in the tab/pad bond.
Accordingly, if the bond between a given pad 32 and tab 22 breaks, then carriers merely traverse along the pad fingers 18P to the next adjacent pad 32 in a given discontinuous busbar 20. As noted above, this typically is a much shorter distance than the distance to another pad 32 on another discontinuous busbar 20. Accordingly, due to this disparity in the distance, the carrier may be able to contribute to the overall current of the photovoltaic cell 10.
The inventors took this unexpected approach despite teachings to the contrary. For example, among other things, the inventors understand that those in the art teach away from adding more conductive material to the substrate because it decreases efficiency in the substrate immediately beneath the conductive material. Such decreased efficiency impacts overall cell performance. Moreover, the additional conductive material adds further cost, which is contrary to the photovoltaic industry goal of grid parity. In addition, more conductive material generally shades more of the substrate 12, which prevents light from energizing the carriers on its surface. Consequently, those efficiency reductions, among other things (e.g., added fabrication complexity), teaches away from adding these fingers 18P.
After modeling and testing, however, the inventors nevertheless discovered that those efficiency reductions should be offset by efficiency improvements during real-world cell performance. Specifically, during actual use, it is anticipated that a certain number of tab bonds will break. Accordingly, assuming that such number of pad/tab bonds break, then these pad fingers 18P should improve efficiency. In any event, they represent a safeguard against anticipated breakage of the tab/pad bond.
It should be noted that orthogonal orientation of the pad fingers 18P and other fingers 18 is not necessary in various embodiments, such as those that have fingers 18 and/or 18P in alternative orientations (e.g., curved fingers, fingers at an angle to the longitudinal axis of the cell 10, etc . . . ). In fact, the pad fingers 18P and other fingers 18 can be non-linear and thus, extend outside of the direct line between the busbar pads 32. For example, the discontinuous busbars 20 and pad fingers 18P can be nonlinear, and, correspondingly, the tabs 22 can be non-linear. Illustrative embodiments orient the two different sets of fingers 18 and 18P in a non-parallel arrangement, such as that shown in the figures.
As noted, various embodiments extend the pad fingers 18P between each pad 32 in a given discontinuous busbar 20. This is clearly shown in
In fact, some cells 10 may have some discontinuous busbars 20 with pad fingers 18P, other discontinuous busbars 20 without pad fingers 18P, and other discontinuous busbars 20 with varying numbers and patterns of pad fingers 18P.
As shown more clearly in
The circular pads 32 contrast the generally rectangular pads 32 of the embodiment shown in
To be clear, it should be noted that a finger 18 or 18P is comprised of various portions that extend between different pads 32. For example, in the case of a straight finger 18 (i.e., either continuous or discontinuous finger in which its segments are substantially co-planar), such as those shown in
The process begins at step 1100, which forms a doped substrate 12. To that end, the process may form any kind of doped substrate appropriate for the intended purposes. Illustrative embodiments form a p-type doped string ribbon wafer, such as those produced by Evergreen Solar, Inc. of Marlborough, Massachusetts. As known by those skilled in the art, string ribbon wafers typically are very thin, such as on the order of between about 150 and 300 microns.
After cleaning the surfaces 14A and 14B of the wafer/substrate 12, the process continues to step 1102 by texturing the top face 14A to reduce its shininess. This step should reduce reflections that could minimize the amount of light that excites charged carriers. To that end, conventional processes create a micro-texture on the top substrate surface 14A, giving it a “frosty” appearance.
Next, the process diffuses a junction into the substrate 12 (step 1104). Specifically, embodiments using a P-type string ribbon wafer may form a very thin layer of N-type material to the top face 14A of the substrate 12. For example, this layer may have a thickness of about 0.3 microns. Among other ways, the process may apply this layer by spraying a phosphorous compound onto the top face 14A of the wafer/substrate 12, and then heating the entire substrate 12 in a furnace. Of course, the junctions may be formed by other means and thus, the noted techniques are discussed for illustrative purposes only.
After removing the substrate 12 from the furnace, the process continues to step 1106 by depositing the above noted electrically insulating, antireflective coating to the top face 14A of the substrate 12. In a manner similar to the noted texture, one primary function of the antireflective coating is to increase the amount of light coupled into the photovoltaic cell 10. The antireflective coating may be formed from conventional materials, such as silicon nitride.
The process then continues to step 1108, which processes the bottom face 14B of the substrate 12. To that end, conventional screen-printing processes first form a bottom contact 28 from a silver paste on the substrate 12, and then mask the bottom contact 28 to form the bottom surface metallic covering 26 (e.g., formed from aluminum).
Simultaneously, before, or after processing the bottom surface 14B, the process begins processing the top face 14A by forming the arrays of fingers 18, 18P and discontinuous busbars 20 (step 1110). To that end, illustrative embodiments screen-print a highly conductive paste over a mask on the top face 14A of the substrate 12. The mask has the desired pattern for fingers 18, 18P and discontinuous busbars 20. Illustrative embodiments deposit one layer of conductive material only, although some embodiments can deposit multiple layers. To enhance conductivity, various embodiments use a silver paste to form the fingers 18, 18P, and discontinuous busbars 20.
In continuous finger embodiments, this step may deposit the fingers 18 as substantially continuous lines of the conductive material. Accordingly, fingers 18 formed this way should be free from breaks along their lengths. Despite these efforts, however, during or after processing, any of the fingers 18 may form one or more breaks along their lengths (referred to as “unintentional breaks”). Consequently, the resultant finger(s) 18 in turn often have one or more irregularly spaced breaks. Such breaks also may have irregular shapes.
Fingers 18 formed by processes to have no breaks thus are considered not to be discontinuous even if they have one or more such breaks. In a corresponding manner, fingers 18 engineered with spaces/discontinuities/breaks along their length, whether they are regularly or irregularly spaced, are considered to be discontinuous. The same discontinuous and continuous requirements also apply to discontinuous busbars 20, i.e., a continuous busbar with a non-engineered break is not a discontinuous busbar 20.
Some embodiments do not explicitly form the pads 32. Instead, such embodiments may simply form the pad fingers 18P and intersecting other fingers 18. Specifically, the mask/screen simply has the pattern of intersecting fingers 18 and 18P, such as those shown in the figures having orthogonal fingers 18 and 18P. Removal of the mask causes the material at the intersection to migrate to some extent, thus forming some pattern, such as that shown in
It should be noted that discussion of screen-printing is for illustrative purposes only. Some or all of the various discussed components can be applied using other technologies. Among other technologies, such embodiments may use inkjet printing or aerojet printing.
After screen-printing both surfaces 14A and 14B, the process passes the substrate 12 through a furnace at a high temperature for a short amount of time. For example, the process may pass the substrate 12 through a furnace at 850 degrees C. for approximately 1 second. This short but quick heating effectively solidifies the conductive paste, and causes the conductive paste to “fire through” the antireflective coating. In other words, the conductive paste penetrates through the antireflective coating to make ohmic contact with the substrate 12. Accordingly, the fingers 18 and discontinuous busbars 20 contact the substrate 12 in a manner that causes their respective current-voltage curves to be substantially linear. In other embodiments, the discontinuous busbars 20 are not in ohmic contact with the substrate 12.
Also of significance is the fact that the insulative qualities of the antireflective coating prevent a direct electrical connection between two adjacent pads 32 across the top face 14A (i.e., without the fingers 18, 18P or tabs 22 configured as discussed, there is no electrical connection). Of course, as noted above, adjacent pads 32 may have some electrical connection through the substrate 12, but such a connection is not the type of direct electrical connection provided by a wire, tab 22, or other direct electrical path.
The process then continues to step 1112, which secures the tabs 22 to the discontinuous busbars 20. To that end, conventional processes first may screen-print solder onto each of the pads 32, and then use a hotplate to melt the solder. At this stage, each pad 32 of a discontinuous busbar 20 has a solder ball for receiving a tab 22. A scaffolding holding a row of tabs 22 under tension thus is moved downwardly to contact each solder ball with a tab 22. The solder balls then cool, consequently securing the tabs 22 to the pads 32. One advantage of using solder balls in this process is their ability to connect securely with the tabs 22 despite irregularities in the contour of the pads 32 and substrate 12.
It should be noted that the tabs 22 electrically connect indirectly with the substrate 12 via the pads 32 only. The insulative antireflective coating/layer prevents the tabs 22 from directly electrically connecting with the substrate 12 through any other portion of the top face 14A of the substrate 12.
The process concludes at step 1114 by affixing the metal strip 24 (see
Of course, in other embodiments, the pad fingers also collect some of the charge carriers (as well as the other fingers 18 on the cell 10). Accordingly, the pad fingers in those embodiments also should provide some additional efficiency boost to the extent that they collect the charge carriers.
Although the above discussion discloses various exemplary embodiments of the invention, it should be apparent that those skilled in the art can make various modifications that will achieve some of the advantages of the invention without departing from the true scope of the invention.
This patent application is a continuation-in-part of U.S. patent application Ser. No. 12/331,586, filed Dec. 10, 2008, entitled, “PHOTOVOLATIC PANEL AND CELL WITH FINE FINGERS AND METHOD OF MANUFACTURE OF THE SAME,” assigned attorney docket number 3253/181, and naming Brown Williams, Christopher E. Dube, Stephen Fox, Andrew Gabor, and Michael A. Ralli as joint inventors, the disclosure of which is incorporated herein, in its entirety, by reference. U.S. patent application Ser. No. 12/331,586 claims priority from the following provisional patent applications: Application No. 61/012,795, filed Dec. 11, 2007 entitled, “PHOTOVOLTAIC CELL WITH FINE FINGERS AND METHOD OF MANUFACTURE OF THE SAME,” assigned attorney docket number 3253/135, and naming Brown Williams, Christopher E. Dube, and Andrew Gabor as joint inventors, Application No. 61/046,045, filed Apr. 18, 2008 entitled, “PHOTOVOLTAIC CELL WITH TABS FOR REFLECTING LIGHT TOWARD SUBSTRATE,” assigned attorney docket number 3253/162, and naming Brown Williams as the sole inventor, Application No. 61/079,178, filed Jul. 9, 2008, entitled, “EFFICIENT PHOTOVOLTAIC CELL,” assigned attorney docket number 3253/164, and naming Christopher E. Dube, Stephen Fox, Andrew Gabor, and Brown Williams as joint inventors. The disclosures of these three provisional United States patent applications are incorporated herein, in their entireties, by reference. This patent application also is related to the following United States patent application: U.S. patent application Ser. No. 12/331,522, filed on Dec. 10, 2008, assigned attorney docket number 3253/182, naming Brown Williams as sole inventor, and entitled, “SHAPED TAB CONDUCTORS FOR A PHOTOVOLTAIC CELL,” the disclosure of which is incorporated herein, in its entirety, by reference.
Number | Date | Country | |
---|---|---|---|
61012795 | Dec 2007 | US | |
61046045 | Apr 2008 | US | |
61079178 | Jul 2008 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 12331586 | Dec 2008 | US |
Child | 12511557 | US |