CROSS-REFERENCE TO RELATED APPLICATIONS
The present application claims priority to Chinese Patent Application No. 202310651015.3, filed on Jun. 2, 2023, the content of which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
The present disclosure relates to the technical field of photovoltaic modules and, in particular, to a photovoltaic module and a method for manufacturing photovoltaic module.
BACKGROUND
A photovoltaic module is a device that utilizes clean energy for power generation, which has great application prospect in the market.
The photovoltaic module generally includes a pad and a solder strip electrically connected to each other and configured to conduct a current.
However, in the related art, the connection between the pad and the solder strip of conventional photovoltaic module has poor reliability. Especially there are many cases of dummy bonding between the pad and the solder strip, resulting in poor operational reliability of the photovoltaic module.
SUMMARY
The present disclosure provides a photovoltaic module and a method for manufacturing photovoltaic module, which reduce the possibility of dummy bonding between the pad and the solder strip, thereby improving operational reliability of the photovoltaic module.
In a first aspect of the present disclosure, a photovoltaic module is provided. The photovoltaic module includes at least one solar cell, a solder strip, a pad, fasteners, adhesive films, a light-transmitting member, and a back sheet. The pad is arranged on a surface of the solar cell and including a first part, a second part, and a third part. The first part is connected to the third part through the second part, and along a length direction of the solder strip, a width of the second part is less than a width of the first part and a width of the third part. The fasteners are arranged on a side of the first part facing away from the solar cell and a side of the third part facing away from the solar cell. The solder strip is provided between the fastener in the first part and the fastener in the third part, and the solder strip is connected to the pad through the fastener to form a solar cell string. The adhesive films are arranged on two sides of the solar cell string along a thickness direction of the solar cell string. The light-transmitting member is arranged on a side of one of the adhesive films facing away from the solar cell string. The back sheet is arranged on a side of the other one of the adhesive films facing away from the solar cell string.
In one or more embodiments, a sidewall of the solder strip abuts against a side of the second part facing away from the solar cell.
In one or more embodiments, the fastener has a set height H1, and the solder strip has a set height H2, where 0<H1≤0.5*H2.
In one or more embodiments, the fastener has a set width W1 along the length direction of the solder strip, where 0.10 mm≤W1≤0.20 mm.
In one or more embodiments, a projection of the fastener projected along the length direction of the solder strip is in a shape of a triangle, a fan, or a slope.
In one or more embodiments, a cross section of the solder strip is in a shape of a circle, and at least part of a sidewall of the solder strip facing the pad is connected to the pad through the fastener; or a cross section of the solder strip is in a shape of a triangle, a rectangle, or an ellipse.
In one or more embodiments, the pad has a shape of a dumbbell, a gourd, an hourglass, or a symbol ∞.
In one or more embodiments, at least part of the first part perpendicular to a sidewall of the solar cell and/or at least part of the third part perpendicular to the sidewall of the solar cell is an arc surface.
In one or more embodiments, the photovoltaic module further includes a finger and a busbar arranged on the solar cell, the first part and the third part are respectively connected to the finger, and the finger is arranged along a direction intersecting with the length direction of the solder strip; and the busbar is connected to the second part, and the busbar is arranged along the length direction of the solder strip.
In one or more embodiments, the fastener is made of tin, solder paste, conductive silver paste, or conductive adhesive.
In a second aspect of the present disclosure, a method for manufacturing photovoltaic module is provided. The method includes: step S1: placing the fasteners respectively on the first part and the third part of the pad arranged on the solar cell; step S2: connecting, through the fasteners, the solder strip with the pad arranged on the solar cell; step S3: connecting the solder strip connected to a front surface of the solar cell to a back surface of another solar cell to form a solar cell string; step S4: stacking a back sheet, an adhesive film, the solar cell string, and a light-transmitting member to form a stacking member; step S5: laminating the stacking member to form a laminated structure; and step S6: mounting a frame and a junction box on the laminated structure to form the photovoltaic module.
In one or more embodiments, the connecting, through the fasteners, the solder strip with the pad arranged on the solar cell includes: abutting the solder strip against a side of the second part facing away from the solar cell, and placing the solder strip between the fastener on a side of the first part facing away from the solar cell and the fastener on a side of the third part facing away from the solar cell.
It should be understood that the foregoing general description and the following detailed description are exemplary only and are not intended to limit the present disclosure.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a schematic structural diagram of a photovoltaic module according to one or more embodiments of the present disclosure;
FIG. 2 is a partial enlarged view of Part A in FIG. 1;
FIG. 3 is a schematic diagram of a connection structure of a solar cell, a pad, fasteners, and a solder strip in a perspective view;
FIG. 4 is a schematic diagram of a connection structure of a solar cell, a pad, a finger, and a busbar in a top view;
FIG. 5 is a schematic structural diagram of a photovoltaic module according to one or more embodiments of the present disclosure;
FIG. 6 is a schematic diagram of a connection structure of a solar cell, a pad, and fasteners in a perspective view; and
FIG. 7 is a flowchart of a method for manufacturing photovoltaic module according to one or more embodiments of the present disclosure.
The accompanying drawings herein are incorporated in and constitute a part of this specification, which illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.
DESCRIPTION OF EMBODIMENTS
In order to better understand the technical solutions of the present disclosure, embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
It is to be made clear that the described embodiments are only some rather than all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts fall within the protection scope of the present disclosure.
The terms used in embodiments of the present disclosure are intended only to describe particular embodiments and are not intended to limit the present disclosure. As used in the embodiments of the present disclosure and the appended claims, the singular forms of “a/an”, “the”, and “said” are intended to include plural forms, unless otherwise clearly specified by the context.
It is to be understood that the term “and/or” used herein is merely an association relationship describing associated objects, indicating that three relationships may exist. For example, A and/or B indicates that there are three cases of A alone, A and B together, and B alone. In addition, the character “/” herein generally means that the associated objects are in an “or” relationship.
It is to be noted that the location terms such as “above”, “below”, “left”, and “right” described in the embodiments of the present disclosure are described with reference to the angles shown in the accompanying drawings, and should not be construed as limitations on the embodiments of the present disclosure. In addition, in the context, it is to be further understood that, when one element is referred to as being connected “above” or “below” another element, the one element may be directly connected “above” or “below” another element, or connected “above” or “below” another element via an intermediate element.
In a first aspect, some embodiments of the present disclosure provide a photovoltaic module. Referring to FIG. 1, the photovoltaic module 10 includes a solar cell 1, a pad 2, fasteners 3, and a solder strip 4. Referring to FIG. 2 to FIG. 3, the pad 2 is arranged on a surface of the solar cell 1. Referring to FIG. 4, the pad 2 has a first part 21, a second part 22, and a third part 23, and the first part 21 is connected to the third part 23 through the second part 22. A dotted line in FIG. 4 represents a structural boundary. Referring to FIG. 3 to FIG. 4, along a length direction X of the solder strip 4, a width of the second part 22 is less than a width of the first part 21 and a width of the third part 23. Referring to FIG. 2 to FIG. 3, the fasteners 3 are respectively arranged on a side of the first part 21 facing away from the solar cell 1 and a side of the third part 23 facing away from the solar cell 1. The solder strip 4 is provided between the fastener 3 in the first part 21 and the fastener 3 in the third part 23, and the solder strip 4 is connected to the pad 2 through the fastener 3 to form a solar cell string.
In some embodiments, referring to FIG. 1 to FIG. 4, the solar cell 1 uses a semiconductor photoelectric effect to generate electric energy after receiving solar energy, the electric energy of the solar cell 1 may be conducted sequentially through the pad 2 electrically connected to the solar cell 1, the fastener 3 electrically connected to the pad 2, and the solder strip 4 electrically connected to the fastener 3. An electrical component (not shown in the figures) electrically connected to the solder strip 4 in the photovoltaic module 10 may conduct the electric energy to electrical equipment outside the photovoltaic module 10. The first part 21 of the pad 2 is connected to the solder strip 4 through one fastener 3, and the third part 23 of the pad 2 is connected to the solder strip 4 through the other fastener 3. Compared with the photovoltaic module in the related art, in the photovoltaic module 10 according to the present disclosure, there are more fixed connection positions between the solder strip 4 and the pad 2, and the connection between the solder strip 4 and the pad 2 has higher reliability. As a result, the photovoltaic module 10 has higher operational reliability and a longer service life. In addition, the first part 21 of the pad 2 is connected to the third part 23 through the second part 22, that is, the first part 21 and the third part 23 are arranged apart from each other, and the solder strip 4 is located between the first part 21 and the third part 23. Therefore, it is thus possible that two sides of the sidewall of the solder strip 4 along a direction perpendicular to an length direction X of the solder strip 4 are respectively connected to the first part 21 and the third part 23 through the fasteners 3, and a position where the solder strip 4 is fixedly connected to the first part 21 and a position where the solder strip 4 is fixedly connected to the third part 23 are symmetrical with respect to the length direction X of the solder strip 4, which further improves stability of the connection structure between the solder strip 4 and the pad 2. Moreover, along the length direction X of the solder strip 4, the width of the second part 22 is less than the width of the first part 21 and the width of the third part 23, which can save materials for manufacturing the pad 2. In this way, more fasteners 3 can be placed on the first part 21 and the third part 23 with larger widths, thereby improving reliability of the connection between the pad 2 and the solder strip 4.
The solder strip 4 connected, through the fastener 3, to the pad 2 arranged on one solar cell 1 may be connected, through another fastener 3, to another pad 2 arranged on another solar cell 1, to form a solar cell string. The number of solar cells 1 connected to the solar cell string may be set accordingly according to the requirements of the user on desired power to be generated, and the number of solar cell strings included in the photovoltaic module 10 may be set accordingly according to the requirements of the user on desired power to be generated.
In addition, referring to FIG. 1, the photovoltaic module 10 further includes adhesive films 7, a light-transmitting member 8, and a back sheet 9. The adhesive films 7 are arranged on two sides of the solar cell string along the thickness direction of the solar cell string, the light-transmitting member 8 is arranged on a side of one adhesive film 7 facing away from the solar cell string, and the back sheet 9 is arranged on a side of the other adhesive film 7 facing away from the solar cell string. The solar cell string, the adhesive films 7, the light-transmitting member 8, and the back sheet 9 are stacked on one another and laminated to form a laminated structure. The photovoltaic module 10 further includes a frame (not shown in the figure), and the frame is arranged on an edge of the laminated structure. The adhesive film 7 may be made of an Ethylene-Vinyl Acetate Copolymer (EVA), Polyolefin Elastomer (POE), or Polyvinyl Butyral (PVB) and configured to package and protect the solar cell 1. For different adhesive films 7 in a same photovoltaic module 10, adhesive films 7 made of a same material or adhesive films 7 made of different materials may be selected. In some embodiments, in a same adhesive film 7, different materials are spliced together. For example, EVA adhesive films may be spliced on two sides of a POE adhesive film. In some embodiments, in a same adhesive film 7, different materials are formed by co-extrusion. For example, EVA-POE-EVA may be co-extruded to form an adhesive film or EVA-POE may be co-extruded to form an adhesive film. The light-transmitting member 8 may be a light-transmitting material member such as a glass plate, and the light-transmitting member 8 may be, for example, low-iron tempered and patterned glass. The light-transmitting member 8 has a thickness that may range from 1.6 mm to 4 mm, which has light transmittance of at least 92% for light in a spectral wavelength range of for example 380 nm to 1100 nm, and has high reflectivity for infrared light greater than 1200 nm. The back sheet 9 may be made of a light-transmitting material or an opaque material. When the back sheet 9 is made of the light-transmitting material (e.g., glass), the photovoltaic module 10 in some embodiments of the present disclosure may be a double-glass assembly, a front surface and a back surface of the photovoltaic module 10 may be used to receive solar energy, and the generated power is higher. When the back sheet 9 is made of an opaque material, the photovoltaic module 10 in some embodiments of the present disclosure may be a single-glass assembly. The back sheet 9 may be composed of a multilayer polymer film, including, for example, a polyethylene terephthalate film (PET film), an adhesive layer, and a polyvinyl fluoride film (PVF film). The PET film is used as a base layer, and two sides of the PET film are adhered to the PVF film through the adhesive layer, so that the back sheet 9 has advantages of good electrical insulation, low water vapor permeability, and high operational reliability. It is appreciated that, the back sheet 9 may be a composite of Tedlar, PET, and Tedlar (abbreviated as TPT), a thermoplastic elastomer (TPE), a composite of a fluorine film, a polyester film, and a fluorine film (abbreviated as KPK), a composite of a fluorine film, a polyester film, and EVA (abbreviated as KPE), modified polyamide (AAA), PET, PET-PET, polyphenyl ether (PPE), phenolic foam (FPF), or foamed polyethylene (FPE).
In some embodiments, referring to FIG. 2, the sidewall of the solder strip 4 abuts against a side of the second part 22 facing away from the solar cell 1. With such arrangement, compared with the related art in which the pad supports the solder strip through the fastener, in the present disclosure, a total thickness of the solder strip 4, the pad 2, and the solar cell 1 is smaller, and a total thickness of the solar cell string formed is smaller, so that a total thickness of the photovoltaic module 10 is smaller, which can save materials for assembling the frame of the photovoltaic module 10. In addition, the pad 2 is arranged on the surface of the solar cell 1, and the solder strip 4 is arranged on the side of the pad 2 facing away from the solar cell 1, so that the solar cell string is a non-flat surface assembly. When the sidewall of the solder strip 4 abuts against the side of the second part 22 facing away from the solar cell 1, compared with the related art in which the pad supports the solder strip through the fastener, in the present disclosure, the solder strip 4 has a smaller bulging extent with respect to the solar cell 1. When the adhesive film 7 is pressed and abuts against the solder strip 4, local deformation of the adhesive film 7 is less, the adhesive film 7 is difficult to be torn or damaged otherwise, and thus the service life of the adhesive film 7 is longer. Moreover, when the sidewall of the solder strip 4 abuts against the side of the second part 22 facing away from the solar cell 1, compared with the related art in which reliability of the pad supporting the solder strip through the fastener depends on structural strength of the fastener (there are many factors adversely affecting the structural strength of the fastener, such as reduction of the structural strength of the fastener due to extrusion of the fastener by the solder strip and the pad during the lamination, and reduction of the structural strength of the fastener due to poor manufacture processing of the fastener), in some embodiments of the present disclosure, the solution in which the second part 22 directly supports the solder strip 4 is less affected by the fastener 3. That is, it is more reliable that the second part 22 directly supports the solder strip 4.
In some embodiments, referring to FIG. 2, the fastener 3 has a set height H1, and the solder strip 4 has a set height H2, satisfying 0<H1≤0.5*H2. For example, H1=0.1*H2, H1=0.15*H2, H1=0.2*H2, H1=0.25*H2, H1=0.3*H2, H1=0.35*H2, H1=0.4*H2, H1=0.45*H2, or H1=0.5*H2 may be satisfied.
In some embodiments, referring to FIG. 2, when the height H1 of the fastener 3 is excessively large relative to the height H2 of the solder strip 4 (H1>0.5*H2), the material required for the fastener 3 is excessive, and material consumption is large. Therefore, within the range of 0<H1≤0.5*H2, strength of the connection between the solder strip 4 and the pad 2 can be better satisfied.
The value of H2 ranges from 0.2 mm to 0.4 mm. The value of H2 may be, for example, 0.2 mm, 0.22 mm, 0.25 mm, 0.27 mm, 0.3 mm, 0.32 mm, 0.35 mm, 0.37 mm, or 0.4 mm.
In some embodiments, referring to FIG. 3, the fastener 3 has a set width W1 along the length direction X of the solder strip 4, satisfying 0.10 mm≤W1≤0.20 mm. The width W1 may be, for example, 0.1 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.20 mm.
In some embodiments, referring to FIG. 3, when the width of the fastener 3 is excessively small (W1<0.1 mm), structural strength of the fastener 3 is lower, and it is difficult to reliably connect the solder strip 4 and the pad 2 together. When the width of the fastener 3 is excessively large (W1>0.2 m), the material required for the fastener 3 is excessive, and material consumption is large. Therefore, the width W1 of the fastener 3 is better in the range of 0.1 mm to 0.2 mm.
In some embodiments, referring to FIG. 2, a projection shape of the fastener 3 projected along the length direction X of the solder strip 4 is a triangle, a fan, or a slope. The fastener 3 in the above shapes has reliable structural strength, and the solder strip 4 and the pad 2 can be reliably connected together without excessively consuming the material of the fastener 3.
During the connection of the solder strip 4 and the pad 2 through the fasteners 3, there is a deformation process in the fastener 3. Therefore, after the connection is stable, the projection shape of the fastener 3 projected along the length direction X of the solder strip 4 may be approximately a triangle, a fan, or a slope. Referring to FIG. 2, when viewing from distance, a cross section of the fastener 3 is approximately in a shape of a triangle. When viewing up close, the cross section of the fastener 3 is in a shape composed of three sides, namely, a straight bottom edge connected to a side of the pad 2 facing away from the solar cell 1, a long side edge not abutting against the pad 2 or the solder strip 4, and a short side edge connected to the solder strip 4. After the solder strip 4 is connected to the pad 2 through the fastener 3 by soldering, a side of the long side edge is scaly (as shown in FIG. 3). When a cross section of the solder strip 4 is in the shape of a circle, the short side edge is in a shape of an arc that fits the sidewall of the solder strip 4. A length L3 of the straight bottom edge ranges from 0.1 mm to 0.2 mm. The length L3 may be, for example, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.2 mm. Referring to FIG. 3, an end of the fastener 3 facing away from the solder strip 4 is U-shaped from a top view.
In addition, the first part 21 may be provided with at least two fasteners 3 arranged apart from one another and configured to be connected to the solder strip 4. Similarly, the third part 23 may be provided with at least two fasteners 3 arranged apart from one another and configured to be connected to the solder strip 4.
In some embodiments, referring to FIG. 2, a cross section of the solder strip 4 is in a shape of a circle, and at least part of a sidewall of the solder strip 4 facing the pad 2 is connected to the pad 2 through the fastener 3. With this arrangement, a space is formed between at least part of the sidewall of the solder strip 4 facing the pad 2 and the pad 2. This space may be used to arrange at least part of the fastener 3. On the one hand, this arrangement facilitates a more compact structure, reduces the influence of the fastener 3 on the deformation of the adhesive film 7, and thus prolongs the service life of the adhesive film 7. On the other hand, the fastener 3 can reliably restrict rolling of the circular solder strip 4 relative to the pad 2. Therefore, reliability of the connection between the solder strip 4 and the pad 2 is higher.
Referring to FIG. 2, the sidewall of the circular solder strip 4 is a curved surface, which can reflect sunlight, so that part of the reflected sunlight is reflected to the surface of the solar cell 1. Moreover, the circular solder strip 4 has a smaller shielding area for the solar cell 1, so that solar energy that the solar cell 1 can receive can be increased, and generated power of the solar cell 1 per unit time is higher.
In addition, a diameter D of the circular solder strip 4 is within a range from 0.2 mm to 0.4 mm. The diameter D may be, for example, 0.2 mm, 0.22 mm, 0.25 mm, 0.27 mm, 0.3 mm, 0.32 mm, 0.35 mm, 0.37 mm, or 0.4 mm.
In some other embodiments (not shown in the figures), the cross section of the solder strip 4 may be in a shape of a rectangle, and the solder strip 4 may have a smaller height, which reduces the influence of the solder strip 4 on the deformation of the adhesive film 7 and thus prolongs the service life of the adhesive film 7. The thickness of the adhesive film 7 required may also be smaller, thereby saving the material. In some other embodiments, the cross section of the solder strip 4 is in a shape of a triangle or an ellipse. In some other embodiments, the solder strip 4 is composed of a plurality of parts with cross sections in different shapes, and at least two shapes may be selected from a circle, a rectangle, a triangle, an ellipse, or combinations thereof.
The following content is introduced mainly by taking the circular solder strip 4 as an example.
In some embodiments, referring to FIG. 4, the pad 2 has a structure in a shape of a dumbbell, a gourd, an hourglass, or a symbol “∞”. The above shapes all can meet the structural requirement that the width of the second part 22 is less than the width of the first part 21 and the width of the third part 23, so as to save the material for manufacturing the pad 2 and possible of placing more fasteners 3 on the first part 21 and the third part 23 with larger widths, thereby improving the reliability of the connection between the pad 2 and the solder strip 4.
In the following content, the structure of the pad 2 is introduced mainly by taking the shape of symbol “∞” as an example.
In some embodiments, referring to FIG. 3, at least part of the first part 21 perpendicular to a sidewall of the solar cell 1 and/or at least part of the third part 23 perpendicular to the sidewall of the solar cell 1 is an arc surface. With this arrangement, the material consumption for manufacturing the pad 2 can be reduced.
Referring to FIG. 2, a thickness H3 of the pad 2 ranges from 0.01 mm to 0.03 mm. The thickness H3 may be, for example, 0.01 mm, 0.015 mm, 0.02 mm, 0.025 mm, or 0.03 mm. Heights of the first part 21, the second part 22, and the third part 23 may be the same. Alternatively, the heights of the first part 21 and the third part 23 may be the same, and the height of the first part 21 and the height of the third part 23 may be greater than the height of the second part 22, or a projection shape of the side of the pad 2 facing away from the solar cell 1 projected along the length direction X of the solder strip 4 presents a recess. Referring to FIG. 4, a shape of the first part 21 is a part of a disk, a shape of the third part 23 is also a part of the disk, and two opposite ends of the second part 22 along the length direction X of the solder strip 4 are provided with triangular notches or U-shaped notches. The radius R1 of the first part 21 and a radius R1 of the third part 23 both range from 0.1 mm to 0.2 mm. the radius R1 may be, for example, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.2 mm. The distance L1 between a center of the first part 21 and a center of the third part 23 ranges from 0.25 mm to 0.35 mm. The distance L1 may be, for example, 0.25 mm, 0.26 mm, 0.27 mm, 0.28 mm, 0.29 mm, 0.30 mm, 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, or 0.35 mm. The width W2 of the second part 22 ranges from 0.05 mm to 0.15 mm. The width W2 may be, for example, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm. The shortest length L2 between the two opposite ends of the second part 22 along the length direction X of the solder strip 4 ranges from 0.1 mm to 0.2 mm. The length L2 may be 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.20 mm. An angle α of the triangular notches at the opposite ends of the second part 22 along the length direction X of the solder strip 4 is ranging from 120° to 125°. The angle α may be, for example, 120°, 121°, 122°, 123°, 124°, or 125°.
In some embodiments, referring to FIG. 4, the photovoltaic module 10 further includes a finger 5 and a busbar 6 arranged on the solar cell 1, the first part 21 and the third part 23 are respectively connected to the finger 5, and the finger 5 is arranged along a direction intersecting the length direction X of the solder strip 4. The busbar 6 is connected to the second part 22, and the busbar 6 is arranged along the length direction X of the solder strip 4.
In some embodiments, referring to FIG. 4, the finger 5 is configured to collect the current of the solar cell 1, and part of the finger 5 may conduct the current to the first part 21 and the third part 23 of the pad 2. The other part of the finger 5 may be connected to the busbar 6, so as to transfer the current to the busbar 6, and the current of the busbar 6 may be conducted to the second part 22 of the pad 2. Finally, the current of the pad 2 may be conducted to the solder strip 4 through the fastener 3.
An arrangement direction of part of the finger 5 may be perpendicular to the length direction X of the solder strip 4, and an arrangement direction of the other part of the finger 5 may be inclined relative to the length direction X of the solder strip 4.
In some embodiments, referring to FIG. 4, the fastener 3 is made of tin, solder paste, conductive silver paste, or a conductive adhesive. The above materials are all conductive materials and can better satisfy conductivity and connection properties.
The tin is pure tin metal. The solder paste is a paste mixture including solder powder, flux, a surfactant, and a thixotropic agent. The conductive silver paste is polymer silver conductive paste (dried or cured to form a film, with an organic polymer as a bonding phase). The conductive adhesive is an adhesive with certain conductivity after cured or dried.
In addition, when the fastener 3 is made of the tin, solder paste, or conductive silver paste, the solder strip 4 is soldered to the pad 2 through the fastener 3 by soldering. When the fastener 3 is made of the conductive adhesive, the solder strip 4 is cured and adhered to the pad 2 through the fastener 3 by dispensing. In one or more possible embodiments, the solder strip 4 is cured and adhered to the pad 2 through the fastener 3 by soldering and dispensing. The reliability of the connection is higher in such embodiments.
In some embodiments, the pad 2 may be made of sintered silver conductive paste (sintered to form a film at a sintering temperature greater than 500° C. and with glass powder or oxide as a bonding phase).
In some other embodiments, referring to FIG. 5, two sides of the solar cell 1 each may be provided with the pad 2. The pads 2 on the two sides of the solar cell 1 may be connected to the corresponding solder strips 4 through the corresponding fasteners 3.
The solar cell 1 of the photovoltaic module 10 in the above embodiments may be an Interdigitated Back Contact (IBC) solar cell, a Passivated Emitter Rear Cell (PERC) solar cell, or a Tunnel Oxide Passivated Contact (TOPcon) solar cell.
In a second aspect, some embodiments of the present disclosure provide a method for manufacturing photovoltaic module. Referring to FIG. 6, the pad 2 of the photovoltaic module 10 has a first part 21, a second part 22, and a third part 23, the first part 21 is connected to the third part 23 through the second part 22, and along a length direction X of the solder strip 4 of the photovoltaic module 10, a width of the second part 22 is less than a width of the first part 21 and a width of the third part 23. Referring to FIG. 7, the method includes:
- S1: placing fasteners 3 respectively on the first part 21 and the third part 23 of the pad 2 arranged on a solar cell 1;
- S2: connecting, through the fasteners 3, the solder strip 4 with the pad 2 arranged on the solar cell 1;
- S3: connecting the solder strip 4 connected to a front surface of the solar cell 1 to a back surface of another solar cell 1 to form a solar cell string;
- S4: stacking a back sheet 9, an adhesive film 7, the solar cell string, and a light-transmitting member 8 to form a stacking member;
- S5: laminating the stacking member to form a laminated structure; and
- S6: mounting a frame (not shown in the figure) and a junction box (not shown in the figure) on the laminated structure to form the photovoltaic module 10.
In some embodiments, referring to FIG. 7, in step S1, the fasteners 3 are placed on the first part 21 and the third part 23 of the pad 2 arranged on the solar cell 1 to form the structure as shown in FIG. 6. In step S2, the solder strip 4 is connected, through the fasteners 3, to the pad 2 arranged on the solar cell 1 to form the structure as shown in FIG. 3. Compared with the method for manufacturing photovoltaic module in the related art, in the method according to some embodiments of the present disclosure, there are more fixed connection positions between the solder strip 4 and the pad 2, and the connection between the solder strip 4 and the pad 2 has higher reliability. As a result, the photovoltaic module 10 has higher operational reliability and a longer service life. In step S3, the solder strip 4 connected to the front surface of the solar cell 1 is connected to the back surface of another solar cell 1 to form a solar cell string, so as to implement the following process: the solar cell 1 uses a semiconductor photoelectric effect to generate electric energy after receiving solar energy, and the electric energy of the solar cell 1 may be conducted sequentially through the pad 2 electrically connected to the solar cell 1, the fastener 3 electrically connected to the pad 2, and the solder strip 4 electrically connected to the fastener 3. In step S4, the back sheet 9, the adhesive film 7, the solar cell string, and the light-transmitting member 8 are stacked by using a stacking machine, to form the stacking member. Two sides of the solar cell string are each provided with the adhesive film 7, the light-transmitting member 8 are arranged on a side of one adhesive film 7 facing away from the solar cell string, and the back sheet 9 is arranged on a side of the other adhesive film 7 facing away from the solar cell string. In step S5, the stacking member is laminated by using a laminator, to form the laminated structure. In step S6, the frame (not shown in the figure) and the junction box (not shown in the figure) are mounted on the laminated structure to form the photovoltaic module 10, the frame is configured to protect edges of the laminated structure, and the junction box is configured to receive the current of the solar cell string.
The solar cell 1 in step S1 is an entire solar cell, and the fasteners 3 are placed on the pad 2 arranged on the entire solar cell. Between step S1 and step S2, the entire solar cell is sliced into a natural number of cuts greater than two such as two cuts, three cuts, or four cuts. Compared with the method in the related art in which there is a need to mount, position, place the fastener 3 on, and disassemble each solar cell cut, in the method according to the present disclosure, the entire solar cell is required only to be mounted, positioned, and disassembled once. The method of the present disclosure can save a lot of manufacturing time and has higher production efficiency. After the entire solar cell is sliced into solar cell cuts, the solar cell cuts may be sorted in terms of electrical properties to manufacture the photovoltaic module 10 with different property parameters. Between step S5 and step S6, edges of the laminated structure may be trimmed to cut an exposed part of the adhesive film 7 from the laminated structure. Subsequent to step S6, silica gel (not shown in the figure) located on the frame of the photovoltaic module 10 is cured, the photovoltaic module 10 is cleaned, and structural properties and electrical properties of the photovoltaic module 10 are detected.
In some embodiments, step S2 of connecting, through the fasteners 3, the solder strip 4 with the pad 2 arranged on the solar cell 1 includes: abutting the solder strip 4 against a side of the second part 22 facing away from the solar cell 1, and placing the solder strip 4 between the fastener 3 on a side of the first part 21 facing away from the solar cell 1 and the fastener 3 on a side of the third part 23 facing away from the solar cell 1. Compared with the related art in which the pad supports the solder strip through the fastener, in the method according to some embodiments of the present disclosure, in the manner of abutting the solder strip 4 against the side of the second part 22 facing away from the solar cell 1, the total thickness of the solder strip 4, the pad 2, and the solar cell 1 is smaller, and the total thickness of the solar cell string formed is smaller, so that the total thickness of the photovoltaic module 10 is smaller, which can save materials for assembling the frame of the photovoltaic module 10. In addition, the pad 2 is arranged on the surface of the solar cell 1, and the solder strip 4 is arranged on the side of the pad 2 facing away from the solar cell 1, so that the solar cell string is a non-flat surface assembly. When the sidewall of the solder strip 4 abuts against the side of the second part 22 facing away from the solar cell 1, compared with the related art in which the pad supports the solder strip through the fastener, in the method according to some embodiments of the present disclosure, the solder strip 4 has a smaller bulging height with respect to the solar cell 1. When the adhesive film 7 is pressed and abuts against the solder strip 4, local deformation of the adhesive film 7 is less, the adhesive film 7 is difficult to be torn, or damaged otherwise, and thus the service life of the adhesive film 7 is longer. Moreover, when the sidewall of the solder strip 4 abuts against the side of the second part 22 facing away from the solar cell 1, compared with the related art in which reliability of the pad supporting the solder strip through the fastener depends on structural strength of the fastener (there are many factors adversely affecting the structural strength of the fastener, such as reduction of the structural strength of the fastener due to extrusion of the fastener by the solder strip and the pad during the lamination, and reduction of the structural strength of the fastener due to poor manufacture processing of the fastener), in the method according to some embodiments of the present disclosure, the solution in which the second part 22 directly supports the solder strip 4 is less affected by the fastener 3. That is, it is more reliable that the second part 22 directly supports the solder strip 4. In the method according to some embodiments of the present disclosure, a position where the solder strip 4 is fixedly connected to the first part 21 and a position where the solder strip 4 is fixedly connected to the third part 23 are symmetrical with respect to the length direction X of the solder strip 4, which further improves stability of the connection structure between the solder strip 4 and the pad 2.
The above are merely preferred embodiments of the present disclosure and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may be subject to various changes and variations. Any modification, equivalent replacement, improvement, and the like made within the spirit and principles of the present disclosure shall fall within the protection scope of the present disclosure.
Patent Application
20240405141
