Photovoltaic (PV) cells, commonly known as solar cells, are devices for conversion of solar radiation into electrical energy. Generally, solar radiation impinging on the surface of, and entering into, the substrate of a solar cell creates electron and hole pairs in the bulk of the substrate. The electron and hole pairs migrate to p-doped and n-doped regions in the substrate, thereby creating a voltage differential between the doped regions. The doped regions are connected to the conductive regions on the solar cell to direct an electrical current from the cell to an external circuit. When PV cells are combined in an array such as a PV module, the electrical energy collected from all of the PV cells can be combined in series and parallel arrangements to provide power with a certain voltage and current.
PV modules can include PV laminates typically comprised of glass, PV cells, conductive material for circuit formation and insulating material to encapsulate the circuit and prevent electrical energy from escaping the circuit. PV laminates often utilize support structures, or frames, for maintaining the structural integrity of the PV module. PV module frames can constrain the PV laminate's position relative to the installation surface (e.g., penetrating-type mounting in which bolts are driven through the rooftop to attach the framework and/or auxiliary connectors to the rooftop; non-penetrating mounting in which auxiliary components interconnect PV modules to one another, etc.). Thus, some traditional PV modules employ an extruded aluminum frame that supports the entire perimeter of the corresponding PV laminate. A lip of the aluminum frame can extend over and capture an upper and lower surfaces of the PV laminate. Proper bonding and alignment between frame and laminate during manufacturing can prevent structural defects, stabilize the PV module to environmental conditions and transportation, and improve aesthetic value of the PV module.
The following drawings illustrate by way of example and not limitation. For the sake of brevity and clarity, every feature of a given structure is not always labeled in every figure in which that structure appears. Identical reference numbers do not necessarily indicate an identical structure. Rather, the same reference number may be used to indicate a similar feature or a feature with similar functionality, as may non-identical reference numbers. The figures are not drawn to scale.
The following detailed description is merely illustrative in nature and is not intended to limit the embodiments of the subject matter of the application or uses of such embodiments. As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” Any implementation described herein as exemplary is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description.
Terminology—The following paragraphs provide definitions and/or context for terms found in this disclosure (including the appended claims):
This specification includes references to “one embodiment” or “an embodiment.” The appearances of the phrases “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Particular features, structures, or characteristics can be combined in any suitable manner consistent with this disclosure.
This term “comprising” is open-ended. As used in the appended claims, this term does not foreclose additional structure or steps.
Various units or components may be described or claimed as “configured to” perform a task or tasks. In such contexts, “configured to” is used to connote structure by indicating that the units/components include structure that performs those task or tasks during operation. As such, the unit/component can be said to be configured to perform the task even when the specified unit/component is not currently operational (e.g., is not on/active). Reciting that a unit/circuit/component is “configured to” perform one or more tasks is expressly intended not to invoke 35 U.S.C. §112, sixth paragraph, for that unit/component.
As used herein, the terms “first,” “second,” etc. are used as labels for nouns that they precede, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, reference to a “first” encapsulant layer does not necessarily imply that this encapsulant layer is the first encapsulant layer in a sequence; instead the term “first” is used to differentiate this encapsulant from another encapsulant (e.g., a “second” encapsulant).
The terms “a” and “an” are defined as one or more unless this disclosure explicitly requires otherwise.
The following description refers to elements or nodes or features being “coupled” together. As used herein, unless expressly stated otherwise, “coupled” means that one element/node/feature is directly or indirectly joined to (or directly or indirectly communicates with) another element/node/feature, and not necessarily mechanically.
As used herein, “inhibit” is used to describe a reducing or minimizing effect. When a component or feature is described as inhibiting an action, motion, or condition it may completely prevent the result or outcome or future state completely. Additionally, “inhibit” can also refer to a reduction or lessening of the outcome, performance, and/or effect which might otherwise occur. Accordingly, when a component, element, or feature is referred to as inhibiting a result or state, it need not completely prevent or eliminate the result or state.
As used herein, the term “substantially” is defined as largely but not necessarily wholly what is specified (and includes what is specified; e.g., substantially 90 degrees includes 90 degrees and substantially parallel includes parallel), as understood by a person of ordinary skill in the art. In any disclosed embodiment, the terms “substantially,” “approximately,” and “about” may be substituted with “within [a percentage] of” what is specified, where the percentage includes 0.1, 1, 5, and 10 percent.
In addition, certain terminology may also be used in the following description for the purpose of reference only, and thus are not intended to be limiting. For example, terms such as “upper”, “lower”, “above”, and “below” refer to directions in the drawings to which reference is made. Terms such as “front”, “back”, “rear”, “side”, “outboard”, and “inboard” describe the orientation and/or location of portions of the component within a consistent but arbitrary frame of reference which is made clear by reference to the text and the associated drawings describing the component under discussion. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar import.
As used herein, “regions” can be used to describe discrete areas, volumes, divisions or locations of an object or material having definable characteristics but not always fixed boundaries.
In the following description, numerous specific details are set forth, such as specific operations, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known techniques are not described in detail in order to not unnecessarily obscure embodiments of the present invention. The feature or features of one embodiment can be applied to other embodiments, even though not described or illustrated, unless expressly prohibited by this disclosure or the nature of the embodiments.
To maintain structural integrity of a photovoltaic (PV) module, edges of a PV laminate can be mounted with a support structure or a frame. In the manufacture of a PV module, an adhesive can be used to bond the PV laminate to a frame. Various improved approaches to ensure proper alignment of the PV laminate with the frame, desired bonding characteristics and prevent structural defects are described herein. Laminate-constraining devices, or clips, can inhibit physical deformation of a PV laminate during manufacturing, shipping, and/or installation. Laminate-constraining devices, or clips can direct the adhesive regions into desired locations and/or inhibit displacement of adhesives during manufacturing e.g. bonding a PV laminate to a support structure, or frame. Various embodiments of the present invention will now be disclosed.
In the embodiment depicted in
An exploded cross-sectional view of a section of PV module 100 is depicted in
In one embodiment, a laminate-receiving channel is substantially planar, and in other embodiments the laminate-receiving channel can have surface features. For example, surface features of the laminate-receiving channel can comprise longitudinally extending ridges, longitudinally extending recesses, sinusoidal cross sections, saw-tooth cross sections, or derivatives thereof. In one embodiment, channel surface features comprise. In the example of
In
In an embodiment, laminate-constraining clips comprise a compressible feature. In one embodiment, the compressible feature can be integrally formed with the laminate constraining clip such that the laminate-constraining clip is formed or molded as a single component. In other embodiments, the compressible feature can be formed separately from the laminate-constraining clip and then subsequently coupled to the laminate-constraining clip. Non-limiting examples of the compressible feature include a compressible polymer material, a metallic wire, a spring tensioned structure, a sinusoidal shaped structure, a W-shaped structure, a U-shaped structure, an S-shaped structure, an X-shaped structure, a spiral structure, a coil, a spring, or a combination thereof.
In the illustrated embodiment of
In some embodiments, the clip comprises a projection. In the exemplary embodiment of
In an embodiment, clip projections can extend parallel to a peripheral edge of the PV laminate. For example, in the illustration of
In the embodiment illustrated in
In one embodiment, a clip comprises metallic elements and/or other flexible materials. For example, a clip can comprise a metal wire. In another embodiment, a clip can comprise a metallic wire embedded within a polymeric and/or thermoplastic material.
In the embodiment illustrated in
In an embodiment, the clip can comprise a plurality of ribs for connecting a series of upper clip arms, a series of lower clip arms, a series of clip mid-sections, or a combination thereof. In the embodiment depicted in
In some embodiments, clips can comprise projections originating from a clip mid-section. In the example of
In the embodiment depicted in
In an embodiment, laminate-constraining clips comprise a polymeric material. For example, clips can comprise materials selected from the group of: polyethylene (PE). polypropylene (PP), polystyrene (PS), polyphenylene oxide (PPO), polyvinyl chloride (PVC), polyetherether ketone (PEEK), polyamides, polycarbonates, acetal resins, acrylonitrile butadiene styrene (ABS) resins, their derivatives or combinations thereof. In one embodiment, a clip comprises a thermosetting polymer. In some embodiments, a clip comprises a thermoplastic material. Extrusion and/or injection molding manufacturing processes can be employed for production of the clip.
A cross-sectional view of a section of PV module 100 is depicted in
In an embodiment, an adhesive bonds a PV laminate, a clip and a frame to form a PV module.
In one embodiment, an adhesive comprises a silicone sealant or rubber, for example RTV (room temperature vulcanization) silicone or other silicone-based sealant. In some embodiments, the adhesive can be an epoxy. For example, the adhesive can be a B-stage epoxy. In some embodiments, the adhesive can be an adhesive film or tape. In one embodiment, the adhesive film or tape can be rolled in the channel recess.
In some embodiments, an adhesive can be provided in predetermined regions or sections of a PV laminate and/or frame. The predetermined regions at which adhesive is provided can vary depending on the application, desired degree of adhesion, desired extent of sealing, PV module or laminate design, and/or particular manufacturing approach. In some embodiments, the adhesive extends substantially continuously along a perimeter of the PV laminate within a channel recess of the frame. In the example of
In other embodiments, a plurality of discrete adhesive regions extend along a perimeter of a PV laminate within a channel recess. In one embodiment, adhesive regions can extend in alternating sections of the PV laminate perimeter. For example, a plurality of adhesive regions 1182 can be provided in alternating sections between a series of clips 1140 along a perimeter 1110 of PV laminate 1102 as depicted in
In some embodiments, the adhesive can flow from initial regions at which the adhesive is provided. For example, the adhesive can be dispensed at a first region and flow to form an expanded region, thereby encompassing or retaining a clip, a peripheral edge of a PV laminate, or a combination thereof. In one embodiment, clip projections can direct the adhesive regions into desired locations and or inhibit displacement of adhesives (e.g. emerging, flowing and/or oozing to undesired locations) during a manufacturing stage e.g. bonding a PV laminate to a support structure, or frame. In one embodiment, the adhesive contacts both a frame and a PV laminate. In some embodiments the adhesive contacts a frame, a PV laminate and at least one clip.
In an embodiment, the clip is coupled to a support structure, or frame, by an interference fit such that the external dimension of a clip slightly exceeds the internal dimension of a channel. For example, referring again to
In some embodiments, the clip is coupled to a support structure, or frame, by a snap fit. For example, the frame can comprise a surface feature and the clip can comprise an interlocking feature for coupling the clip to the frame. In the embodiment illustrated in.
In some embodiments, the clip is coupled to a support structure, or frame, by a snap fit. For example, the frame can comprise a surface feature and the clip can comprise an interlocking feature for coupling the clip to the frame. In the embodiment illustrated in
In an embodiment, a clip can be integrally formed with a frame. For example, the frame and clip can be manufactured concurrently as a single piece via extrusion, injection molding, casting, forging or other desired manufacturing method. In other embodiments, the clip is manufactured separately from the frame and the clip is coupled to the frame and/or PV laminate in a separate step. For example, a plurality of clips can be attached to peripheral edges of a PV laminate. Subsequently, the PV laminate comprising the plurality of clips can be mounted into a support structure, or frame.
Laminate-constraining devices, or clips, can inhibit physical deformation (e.g. warping, bending, bowing, cracking, shattering) of a PV laminate, ensure proper alignment of a PV laminate with a mounting structure, and/or facilitate bonding of a PV laminate to a support structure. In addition to the physical characteristics of laminate-constraining clips, PV module manufacturing methods using laminate-constraining clips can ensure proper alignment of PV laminate and frame, direct adhesive regions during a curing stage, and ensure a PV laminate is reinforced during mounting to a support structure.
According to an embodiment illustrated in
In one embodiment, the laminate-constraining clip can be first coupled to the frame, or be integrally formed with the frame. An adhesive can then be provided in at least one predetermined adhesive bonding region within a channel portion of the frame, along a peripheral edge of a PV laminate, at the clip, or a combination thereof. This step can then be followed by pressing a portion of the frame toward the peripheral edge of the laminate to seat the laminate into the channel comprising the nested clip. In another embodiment, the laminate-constraining clip can be coupled to the frame by snapping into the channel, sliding into the frame at a corner edge, or any other desired insertion method. At step 1110, the adhesive can be cured to bond the laminate to the channel portion of the frame such that the laminate constraining clip inhibits displacement of the adhesive during photovoltaic module manufacturing and transportation. In one embodiment, curing the adhesive comprises heating.
The above specification and examples provide a complete description of the structure and use of illustrative embodiments. Although certain embodiments have been described above with a certain degree of particularity, or with reference to one or more individual embodiments, those skilled in the art could make numerous alterations to the disclosed embodiments without departing from the scope of this invention. As such, the various illustrative embodiments of the methods and systems are not intended to be limited to the particular forms disclosed. Rather, they include all modifications and alternatives falling within the scope of the claims, and embodiments other than the one shown can include some or all of the features of the depicted embodiment. For example, elements can be omitted or combined as a unitary structure, and/or connections can be substituted. Further, where appropriate, aspects of any of the examples described above can be combined with aspects of any of the other examples described to form further examples having comparable or different properties and/or functions, and addressing the same or different problems. Similarly, it will be understood that the benefits and advantages described above can relate to one embodiment or can relate to several embodiments. For example, embodiments of the present methods and systems can be practiced and/or implemented using different structural configurations, materials, and/or control manufacturing steps. The claims are not intended to include, and should not be interpreted to include, means-plus- or step-plus-function limitations, unless such a limitation is explicitly recited in a given claim using the phrase(s) “means for” or “step for,” respectively.