Patent Application
20170373635
Typical photovoltaic (PV) modules may generate direct current (DC) power based on received solar energy. PV modules may include a plurality of solar or PV cells electrically coupled to one another allowing the PV cells to contribute to a combined output power for a PV module. A typical PV module generally includes a rectangular frame surrounding a PV laminate encapsulating solar cells, and a junction box. The junction box encapsulates electrical connections protruding from a backsheet of the PV laminate which are in electrical connection with the solar cells of the PV module. In many cases, the junction box is glued to the backsheet of the PV laminate.
In particular applications, the DC power generated by a photovoltaic module may be converted to AC power through the use of a power inverter. The power inverter may be electrically coupled to an output of the PV module. Typically, intervening wiring (e.g. Multi-contact MC4 connectors) may be used between the PV module, junction box and the power inverter. The power inverter may be electrically coupled to the DC output of the PV module (i.e., the PV cables). The power inverter may be located physically apart from the PV module, with only the intervening wiring and associated hardware physically coupling the PV module to the power inverter.
The following drawings illustrate by way of example and not limitation. For the sake of brevity and clarity, every feature of a given structure is not always labeled in every figure in which that structure appears. Identical reference numbers do not necessarily indicate an identical structure. Rather, the same reference number may be used to indicate a similar feature or a feature with similar functionality, as may non-identical reference numbers. The figures are not drawn to scale.
The following detailed description is merely illustrative in nature and is not intended to limit the embodiments of the subject matter of the application or uses of such embodiments. As used herein, the word “exemplary” means “serving as an example, instance, or illustration.” Any implementation described herein as exemplary is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the following detailed description.
Certain terminology may be used in the following description for the purpose of reference only, and thus are not intended to be limiting. For example, terms such as “upper”, “lower”, “above”, and “below” refer to directions in the drawings to which reference is made. Terms such as “front”, “back”, “rear”, “side”, “axial”, and “lateral” describe the orientation and/or location of portions of the component within a consistent but arbitrary frame of reference which is made clear by reference to the text and the associated drawings describing the component under discussion. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar import. Similarly, the terms “first”, “second”, and other such numerical terms referring to structures do not imply a sequence or order unless clearly indicated by the context.
Terminology—The following paragraphs provide definitions and/or context for terms found in this disclosure (including the appended claims):
This specification includes references to “one embodiment” or “an embodiment.” The appearances of the phrases “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Particular features, structures, or characteristics can be combined in any suitable manner consistent with this disclosure.
This term “comprising” is open-ended. As used in the appended claims, this term does not foreclose additional structure or steps.
Various units or components may be described or claimed as “configured to” perform a task or tasks. In such contexts, “configured to” is used to connote structure by indicating that the units/components include structure that performs those task or tasks during operation. As such, the unit/component can be said to be configured to perform the task even when the specified unit/component is not currently operational (e.g., is not on/active). Reciting that a unit/circuit/component is “configured to” perform one or more tasks is expressly intended not to invoke 35 U.S.C. §112, sixth paragraph, for that unit/component.
As used herein, the terms “first,” “second,” etc. are used as labels for nouns that they precede, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.). For example, reference to a “first” encapsulant layer does not necessarily imply that this encapsulant layer is the first encapsulant layer in a sequence; instead the term “first” is used to differentiate this encapsulant from another encapsulant (e.g., a “second” encapsulant).
The terms “a” and “an” are defined as one or more unless this disclosure explicitly requires otherwise.
The following description refers to elements or nodes or features being “coupled” together. As used herein, unless expressly stated otherwise, “coupled” means that one element/node/feature is directly or indirectly joined to (or directly or indirectly communicates with) another element/node/feature, and not necessarily mechanically.
As used herein, “inhibit” is used to describe a reducing or minimizing effect. When a component or feature is described as inhibiting an action, motion, or condition it may completely prevent the result or outcome or future state completely. Additionally, “inhibit” can also refer to a reduction or lessening of the outcome, performance, and/or effect which might otherwise occur. Accordingly, when a component, element, or feature is referred to as inhibiting a result or state, it need not completely prevent or eliminate the result or state.
As used herein, the term “substantially” is defined as largely but not necessarily wholly what is specified (and includes what is specified; e.g., substantially 90 degrees includes 90 degrees and substantially parallel includes parallel), as understood by a person of ordinary skill in the art. In any disclosed embodiment, the terms “substantially,” “approximately,” and “about” may be substituted with “within [a percentage] of” what is specified, where the percentage includes 0.1, 1, 5, and 10 percent.
As used herein, “regions” can be used to describe discrete areas, volumes, divisions or locations of an object or material having definable characteristics but not always fixed boundaries.
In the following description, numerous specific details are set forth, such as specific operations, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known techniques are not described in detail in order to not unnecessarily obscure embodiments of the present invention. The feature or features of one embodiment can be applied to other embodiments, even though not described or illustrated, unless expressly prohibited by this disclosure or the nature of the embodiments.
Photovoltaic (PV) assemblies and modules for converting solar radiation to electrical energy are disclosed herein. PV arrays comprising a plurality of PV assemblies or PV modules are also described herein. A PV module can comprise a plurality of PV or solar cells encapsulated within a PV laminate. The PV module can further comprise a junction box or housing for enabling or providing electrical access to the plurality of solar cells. The junction box can comprise a plurality of busbars or conductor ribbons electrically coupled to the plurality of solar cells. The junction box can further comprise a direct current (DC) output connector port for outputting direct current generated by the plurality of solar cells, a conditioned power input connector port for receiving conditioned power; and, a conditioned power output link for outputting conditioned power to an external load. The PV module can further comprise an electronic component housing configured to be removably coupled to the junction housing. The electronic component housing can comprise an electronic component and/or circuitry for conditioning power generated by the plurality of solar cells. The electronic component housing can further comprise a DC input connector port configured to be electrically mated with the DC output connector port of the junction housing; and, a conditioned power output connector port configured to be electrically mated with the power input connector port of the junction housing.
Additionally, alternating current photovoltaic (ACPV) assemblies and modules are described herein. An ACPV module can comprise a plurality of PV or solar cells encapsulated within a PV laminate. The ACPV module can further comprise a junction box or housing for enabling or providing electrical access to the plurality of solar cells. The junction box can comprise a plurality of busbars or conductor ribbons electrically coupled to the plurality of solar cells. The junction housing can comprise a direct current (DC) output connector port for outputting direct current generated by the plurality of solar cells, an alternating current (AC) input connector port for receiving AC power; and, an alternating current (AC) output link or cable for outputting AC power to an external load. The ACPV module can further comprise a power inverter or DC-AC inverter, commonly referred to as a “microinverter,” for converting direct current to alternating current. The microinverter is configured to be removably coupled to the junction box. The microinverter can comprise a housing with a DC input connector port configured to be electrically mated with the DC output connector port of the junction box and an AC output connector port configured to be electrically mated with the AC input connector port of the junction box. The microinverter can convert direct current generated by the plurality of solar cells to alternating current for delivery to an external AC load via the AC output cable of the junction housing.
Photovoltaic docking assemblies are also described herein. A photovoltaic docking assembly comprises a junction box or housing and an electronic component housing configured to be reversibly connected or “docked.” The photovoltaic docking assembly can comprise a junction box comprising a plurality of busbars or conductor ribbons electrically coupled to a plurality of solar cells. The junction housing can further comprise a DC output connector port for outputting direct current generated by the plurality of solar cells, a conditioned power input connector port for receiving conditioned power; and, a conditioned power output link or cable for outputting conditioned power for an external load. The photovoltaic docking assembly further comprises an electronic component for conditioning power generated by the plurality of solar cells. The electronic component housing can comprise a DC input connector port configured to be electrically mated with the DC output connector port of the junction housing; and, a conditioned power output connector port configured to be electrically mated with the power input connector port of the junction housing.
Repair and/or replacement of electronic components of PV assemblies and modules e.g. microinverters of ACPV modules can be challenging. For example, if a microinverter of an ACPV module fails, it may be difficult or impossible to replace just the microinverter, causing the loss of both the microinverter and the PV module. Further, grounding of the microinverter and PV module may pose additional challenges. Various embodiments of both PV and ACPV modules to address these challenges are described herein. The photovoltaic docking assemblies described herein facilitate field replacement or removal of electronic components e.g. microinverters from a corresponding module and/or junction box. Additionally, the photovoltaic docking assemblies described herein enable PV modules and arrays to have minimal cables and wiring for electrical interconnection.
Although many of the examples described herein are alternating current photovoltaic (ACPV) modules, the techniques and structures apply equally to other (e.g., direct current) PV modules as well.
As depicted in
In some embodiments, the electronic component 140 is mounted to the frame 110 of the module 100. The electronic component 140 can comprise mating features for mechanically coupling to a corresponding mating feature of the frame 110. For example as depicted in
The electronic component 140 comprises a housing or enclosure 142 with a cover 144. The electronic component housing 142/144 can be integrally formed or be formed from an assembly of parts. In an embodiment, the electronic component housing 142/144 is composed of a metallic material such as aluminum. In another embodiment, the electronic component housing 142/144 is composed of a heat dissipating polymer. The electronic component housing 142 and cover 144 seal the junction electrical component 140 from moisture, dust and other contaminants, and also dissipates heat that is generated by interior components.
In the embodiment depicted in
In some embodiments, the junction circuit 126 can include bypass diodes, which can provide an alternate current path through the module 100 should one of the solar cells 108 and/or solar cell strings 109 of the module 100 become damaged, shaded, or otherwise inoperable. In some embodiments, the junction box 120 comprises at least one bypass diode for protecting the solar cell cells 108 and/or strings 109 from reverse bias conditions. However, in other embodiments, bypass diodes may be absent.
As depicted in
The junction box 120 further comprises a conditioned power (e.g. AC power) input connector port 132 electrically coupled to the conditioned power (e.g. AC power) output link or cable 160 for outputting conditioned power (e.g. AC power) to an external load, for example through AC wires 138 depicted in
In the exemplary embodiment depicted in
The cross-sectional view of docking assembly 112 in
As depicted in
In embodiments where the electronic component 140 comprises a inverter circuitry at 146, the DC output connector 130 of the junction box 120 outputs direct current generated by the solar cells 108 through the DC input connector port 150 to the inverter circuitry and components at 146 for conversion to alternating current. The AC output connector port 152 is configured to be electrically mated with an AC input connector port 132 of the junction box 120 such that the alternating current produced by inverter 146 is transmitted to the junction box 120 through the AC output connector port 152 and the AC input connector port 132. The AC input connector port 132 of the junction box 120 is electrically coupled to an AC power output cable 160 for outputting AC power to an AC load, for example through AC wires 138 depicted in
In various embodiments, electronic component 140 comprises a potting material to fill voids between the housing 142/144 and interior electrical components including power conditioning circuitry 142 and connector ports 150/152. The potting material can be selected for optimal electrically insulating properties, thermal conductivity properties and/or prevention of moisture ingress.
In an embodiment, the DC output connector port 130 of the junction box 120 is configured to be electrically mated with the DC input connector port 150 of the electronic component 140, for example via male and female spaded connectors. In the exemplary embodiment depicted in
In an embodiment, the power input connector port (e.g. AC input connector port) 132 of the junction box 120 is configured to be electrically mated with the conditioned power output connector port (e.g. AC output connector port) 152 of the electronic component (e.g. microinverter) 140, for example via male and female spaded connectors. Referring again to
In addition to being docked or coupled together electrically, the junction box 120 and the electrical component 140 can be coupled together mechanically through any desired coupling device or feature. For example, junction box 120 can be coupled to electronic component 142 by one or more fasteners, such as screws, bolts, rivets, snap-in features, compressible features, adhesives, or any other desirable mechanism for reversible coupling. In an embodiment, the particular coupling device, feature or mechanism is dictated by the ease of replacement or removal of the electronic component 140 from the junction box 120 and/or module 100.
In one embodiment, at least one gasket (e.g. a polymeric or rubber ring) is provided around connector ports of the docking assembly 112 to improve or create a seal for protection from moisture ingress. For example, a gasket can be provided around the DC output connector port 130, the DC input connector port 150, the power input connector port (e.g. AC input connector port) 132, the conditioned power output connector port (e.g. AC output connector port) 152, or a combination thereof.
In one embodiment, the electronic component 140 can comprise an engagement feature for mechanically coupling to a corresponding engagement feature of the junction box 120. For example, a connector port 152/152 of the electronic component 140 can comprise a guide post which interlocks with a cavity of a connector port 130/132 of the junction box 120. As another example, the electronic component 140 can comprise a compressible feature at one or more interfacial contact planes 170 such that upon docking with the junction box 120, the electronic component 140 and the junction box 120 are mechanically coupled or docked via compressive forces in a reversible manner.
In various embodiments, the junction box 120 and/or electronic component 140 is removably coupled to the frame 110 of module 100. In one embodiment, the junction box 120 and/or electronic component 140 is secured to the frame 110 of module 100 such that the junction box 120 and/or electronic component 140 is substantially centered between two corners of the frame 110 as depicted in
In some embodiments, the module 100 will not include a frame. In such embodiments, the junction box 120 and/or electronic component 140 can be disposed substantially at the center or at a corner of the laminate 106. The junction box 120 and/or electronic component 140 can be coupled to the laminate 106 and/or frame 110 (if present) through any desired coupling device, feature or mechanism. For example, junction box 120 and/or electronic component 140 can be coupled to the laminate 106 and/or frame 110 (if present) by one or more adhesives, one or more fasteners, such as screws, bolts, rivets, snap-in features, compressible features or any other desirable mechanism for reversible or permanent coupling. In an embodiment, the electronic component 140 and/or the junction box 120 is electrically grounded to the frame 110 via a conductive feature of the docking assembly, either internal or external to the junction box 120 and/or electronic component 140.
In some embodiments, the configuration and mechanism for coupling the electronic component 142 to the laminate 106 and/or frame 110 (if present) is dictated by the desired spacing (e.g. for heat dissipation) between the electronic component 140 and the backsheet 105 of the laminate 106, for example to mitigate negative thermal effects relating to heat transfer from the electronic component 140 to the laminate 106. In some embodiments, the backsheet 105 and/or the electronic component 140 can comprise one or more guide features to maintain a desired configuration during docking.
In some embodiments, the electronic component 140 is reversibly mounted to the frame 110 of the module 100. The electronic component 140 can comprise mating features for mechanically coupling to a corresponding mating feature of the frame 110. For example as depicted in
The above specification and examples provide a complete description of the structure and use of illustrative embodiments. Although certain embodiments have been described above with a certain degree of particularity, or with reference to one or more individual embodiments, those skilled in the art could make numerous alterations to the disclosed embodiments without departing from the scope of this invention. As such, the various illustrative embodiments of the methods and systems are not intended to be limited to the particular forms disclosed. Rather, they include all modifications and alternatives falling within the scope of the claims, and embodiments other than the one shown can include some or all of the features of the depicted embodiment. For example, elements can be omitted or combined as a unitary structure, and/or connections can be substituted. Further, where appropriate, aspects of any of the examples described above can be combined with aspects of any of the other examples described to form further examples having comparable or different properties and/or functions, and addressing the same or different problems. Similarly, it will be understood that the benefits and advantages described above can relate to one embodiment or can relate to several embodiments. For example, embodiments of the present methods and systems can be practiced and/or implemented using different structural configurations, materials, and/or control manufacturing steps. The claims are not intended to include, and should not be interpreted to include, means-plus- or step-plus-function limitations, unless such a limitation is explicitly recited in a given claim using the phrase(s) “means for” or “step for,” respectively.
