Picoliter Solder Droplet Dispensing for Electronics Manufacturing

Information

• NSF Award
• 9203071

Owner

• MicroFab Technologies Inc

• Award Id

  9203071

• Award Effective Date

  10/1/1992 - 32 years ago

• Award Expiration Date

  3/31/1995 - 29 years ago

• Award Amount

  $ 242,608.00

• Award Instrument

  Continuing grant

This research addresses a new solder application method, using ink-jet printing technology, to produce and place molten solder droplets onto various substrates. Ink-jet based solder deposition would be low cost (no masks or screens are required), flexible (the image is stored and formed digitally), suitable for manufacturing environment (does not operate in a vacuum like liquid metal ion systems), highly repeatable, and high resolution. Specific applications would include formation of solder bumps on integrated circuits for TAB or flip-chip interconnection, or selective application of top metallization for fine pitch surface mount assembly, chip-on-board (COB), or multichip modules (MCM's). Direct-write solder technology would be ideal for rework, including both chip or package replacement, and metallization or personalization of circuitry for high density interconnection (HDI) substrates.

• Program Officer

  Ritchie B. Coryell

• Min Amd Letter Date

  9/23/1992 - 32 years ago

• Max Amd Letter Date

  5/5/1998 - 26 years ago

• ARRA Amount

• Name

  MicroFab Technologies Inc

• City

  PLANO

• State

  TX

• Country

  United States

• Address

  1104 SUMMIT AVE STE 110

• Postal Code

  750748592

• Phone Number

  9725788076

• First Name

  David

• Last Name

  Wallace

• Email Address

  david.wallace@microfab.com

• Start Date

  12/27/1993 12:00:00 AM

• Name

  Materials Research

• Code

  106000

• Name

  Engineering-Metallurgy & Material

• Code

  57

• Text

  SMALL BUSINESS PHASE II

• Code

  5373

• Text

  UNASSIGNED

• Code

  0

• Text

  MATERIALS PROCESSING AND MANFG

• Code

  1467

• Text

  OTHER RESEARCH OR EDUCATION