Embodiments of the disclosure are in the field of semiconductor packages and, in particular, a pierceable protective cover for photonic connectors.
Fiber optic transmission relies on low loss optical fibers and high fidelity fiber-to-fiber mating between the optical fibers in photonic connectors for acceptable performance. The fiber-to-fiber mating is critical and is typically resolved through precision fiber end geometries as well as precision connector ferrule designs to mitigate alignment tolerances. Both can be resolved through advance design and manufacturing principles, however, there is one factor that is difficult to design out—foreign material. Introduction of foreign material between the optical fibers prevents an optical path from completing.
Foreign material between the fibers requires a user to thoroughly clean the fibers before the connector ferrules are mated. This typically becomes an issue once high volume manufacturing requirements drive automated insertions where extra cleaning steps can require significant investments. In addition, for large datacenter type applications that are increasingly turning to optical transmission, manual cleaning of the fibers in connector ferrules is error prone and could introduce significant serviceability issues in the field. Protective caps attached to tips of the ferrules are effective to prevent foreign material during transport, but the caps need to be removed prior to mating and do not prevent foreign material from entering the ferrules and blocking the mating fibers during mating.
A pierceable protective cover for photonic connectors is described. In the following description, numerous specific details are set forth, such as specific material and tooling regimes, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that embodiments of the present disclosure may be practiced without these specific details. In other instances, well-known features, such as single or dual damascene processing, are not described in detail in order to not unnecessarily obscure embodiments of the present disclosure. Furthermore, it is to be understood that the various embodiments shown in the Figures are illustrative representations and are not necessarily drawn to scale. In some cases, various operations will be described as multiple discrete operations, in turn, in a manner that is most helpful in understanding the present disclosure, however, the order of description should not be construed to imply that these operations are necessarily order dependent. In particular, these operations need not be performed in the order of presentation.
Certain terminology may also be used in the following description for the purpose of reference only, and thus are not intended to be limiting. For example, terms such as “upper”, “lower”, “above”, “below,” “bottom,” and “top” refer to directions in the drawings to which reference is made. Terms such as “front”, “back”, “rear”, and “side” describe the orientation and/or location of portions of the component within a consistent but arbitrary frame of reference which is made clear by reference to the text and the associated drawings describing the component under discussion. Such terminology may include the words specifically mentioned above, derivatives thereof, and words of similar import.
One or more embodiments described herein are directed to a pierceable protective cover for a photonic connector. The photonic connector comprises a first ferrule having a first plurality of optical fibers. A membrane cover is attached to the first ferrule and covers ends of the first plurality of optical fibers. Once the first ferrule is mated with a second ferrule having a second plurality of optical fibers, the membrane cover is pierced by the first plurality of optical fibers, the second plurality of optical fibers, or both to keep the first and second plurality of optical fibers free from debris. Embodiments may include or pertain to one or more of optical cables, mechanical transfer (MT) ferrules, and optoelectronic multi-chip modules (photonic die plus logic die), system-on-chip (SoC), and data center technologies that have integrated photonic connections.
To provide context,
Photonic connectors, such as fiber connectors 100 and 158, are becoming increasingly used in optoelectronic multi-chip modules and in high-density networks and data centers. Unfortunately, uncleanliness of the fiber connectors 100 and 158 have become a common cause of network failure. Even if the ferrules 106, 108 or 158B are cleaned prior to making the connection, improper cleaning may hamper performance. Cleaning of photonic connectors is complicated by the fact that photonic connectors have multiple fibers with a wide contact surface, and any dirt on one fiber can cause signal degradation in the rest of the fibers in the connector. Not only is manual cleaning error prone, it is also time-consuming and can increase cost. Protective dust caps placed over the ends of the ferrules 106, 108 or 158B may be effective to prevent debris during transport, but the dust caps need to be removed prior to mating, allowing debris to access tips of the optical fibers 110A, 110B and 158A in ferrules 106, 108 or 158B, respectively.
In accordance with one or more embodiments described herein, an integrated protective membrane cover is applied to photonic connectors to keep the optical fibers free from debris. The protective membrane cover shields the ends of the optical fibers during and after transport. When a first ferrule is inserted into a second ferrule during mating, the protective membrane is pierced by the optical fibers of one or both of the ferrules and any debris on the optical fibers is wiped clean by the protective membrane cover.
The membrane cover 306 prevents any debris from impinging on the first plurality of optical fibers 304 and the second plurality of optical fibers 312 as piercing of the membrane cover 306 causes any debris to be removed from second plurality of optical fibers 312.
As shown in
In another embodiment, the first plurality of optical fibers 304 may not extend past the front face 308 a sufficient distance to pierce the membrane cover 306. That is, the first plurality of optical fibers 304 may be polished flat so only 1-3 um of the first plurality of optical fibers 304 protrude from the first ferrule 302.
In one embodiment, the membrane cover 306 may comprise a self-healing polymer material for repeated use. In another embodiment, the membrane cover 306 may comprise a traditional polymer material that tears upon being pierced. In another embodiment, the membrane cover 306 may comprise a closed cell foam material. In yet another embodiment, the membrane cover 306 may comprise a melamine foam material.
In one embodiment, the size of the membrane cover 306 is dependent upon size of the ferrule. However, in one embodiment, membrane cover 306 may have a height of approximately 8-10 mm and a width of approximately 20-30 mm. Tear resistance requirements can be defined as a function of allowed deformation, force, and cap thickness. In one embodiment, the displacement/deformation (Delta δ) of the membrane cover 306 may be computed by:
where P=pressure, t=membrane thickness, r=radius of object penetration, D=flexural rigidity, v=Poisson ratio of the material, and E=modulus of the material.
Depending on its applications, computing device 700 may include other components that may or may not be physically and electrically coupled to the board 702. These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, a graphics processor, a digital signal processor, a crypto processor, a chipset, an antenna, a display, a touchscreen display, a touchscreen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, an accelerometer, a gyroscope, a speaker, a camera, and a mass storage device (such as hard disk drive, compact disk (CD), digital versatile disk (DVD), and so forth).
The communication chip 706 enables wireless communications for the transfer of data to and from the computing device 700. The term “wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not. The communication chip 706 may implement any of a number of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond. The computing device 700 may include a plurality of communication chips 706. For instance, a first communication chip 706 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth and a second communication chip 706 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
The processor 704 of the computing device 700 includes an integrated circuit die packaged within the processor 704. In some implementations of the disclosure, the integrated circuit die of the processor includes one or more photonic connectors having a protective membrane cover, in accordance with implementations of embodiments of the disclosure. The term “processor” may refer to any device or portion of a device that processes electronic data from registers and/or memory to transform that electronic data into other electronic data that may be stored in registers and/or memory.
The communication chip 706 also includes an integrated circuit die packaged within the communication chip 706. In accordance with another implementation of embodiments of the disclosure, the integrated circuit die of the communication chip includes one or more photonic connectors having a protective membrane cover, in accordance with implementations of embodiments of the disclosure.
In further implementations, another component housed within the computing device 700 may contain an integrated circuit die that includes one or more photonic connectors having a protective membrane cover, in accordance with implementations of embodiments of the disclosure.
In various implementations, the computing device 700 may be a laptop, a netbook, a notebook, an ultrabook, a smartphone, a tablet, a personal digital assistant (PDA), an ultra mobile PC, a mobile phone, a desktop computer, a server, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a digital camera, a portable music player, or a digital video recorder. In further implementations, the computing device 700 may be any other electronic device that processes data.
Thus, embodiments described herein include photonic connectors having a protective membrane cover.
The above description of illustrated implementations of embodiments of the disclosure, including what is described in the Abstract, is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. While specific implementations of, and examples for, the disclosure are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the disclosure, as those skilled in the relevant art will recognize.
These modifications may be made to the disclosure in light of the above detailed description. The terms used in the following claims should not be construed to limit the disclosure to the specific implementations disclosed in the specification and the claims. Rather, the scope of the disclosure is to be determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation.
Example embodiment 1: A photonic connector comprises a first ferrule having a first plurality of optical fibers. A membrane cover is attached to the first ferrule and covers ends of the first plurality of optical fibers. Once the first ferrule is mated with a second ferrule having a second plurality of optical fibers, the membrane cover is pierced by the first plurality of optical fibers, the second plurality of optical fibers, or both.
Example embodiment 2: The photonic connector of embodiment 1, wherein the first ferrule comprises a male connector and the membrane cover is attached to a front face of the first ferrule over the ends of the first plurality of optical fibers between alignment pins.
Example embodiment 3: The photonic connector of embodiment 1 or 2, wherein the first ferrule comprises a male connector and the membrane cover is attached to a front face of the first ferrule over both the ends of the first plurality of optical fibers and the alignment pins.
Example embodiment 4: The photonic connector of embodiment 1, 2 or 3, wherein the first ferrule comprises a male connector and the first plurality of optical fibers extend past the front face sufficiently to pierce the membrane cover.
Example embodiment 5: The photonic connector of embodiment 1, 2, 3 or 4, wherein the first ferrule comprises a male connector and the first plurality of optical fibers do not extend past the front face sufficiently to pierce the membrane cover.
Example embodiment 6: The photonic connector of embodiment 1, wherein the first ferrule comprises a female connector having a top wall, a back wall, and a bottom wall that form a cavity in the first ferrule, wherein the membrane cover is attached to the back wall of the cavity over the ends of the first plurality of optical fibers.
Example embodiment 7: The photonic connector of embodiment 1, wherein the first ferrule comprises a female connector having a top wall, a back wall, and a bottom wall that form a cavity, wherein the membrane cover is attached to front surfaces of the top, the sides and the bottom walls over the cavity.
Example embodiment 8: The photonic connector of embodiment 7, wherein once the first ferrule is mated with the second ferrule, the second plurality of optical fibers pierce and tear the membrane cover.
Example embodiment 9: The photonic connector of embodiment 1, 2, 3, 4, 5, 6, 7 or 8, wherein the membrane cover comprises a self-healing polymer material.
Example embodiment 10: The photonic connector of embodiment 1, 2, 3, 4, 5, 6, 7, 8 or 9, wherein the membrane cover comprises a traditional polymer material.
Example embodiment 11: The photonic connector of embodiment 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, wherein the membrane cover comprises a closed cell foam material.
Example embodiment 12: The photonic connector of embodiment 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 or 11, wherein the membrane cover comprises a melamine foam material.
Example embodiment 12: The photonic connector of embodiment 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 or 12, wherein the membrane cover membrane cover has a height of approximately 8-10 mm and a width of approximately 20-30 mm.
Example embodiment 14: A photonic connector comprises a first ferrule having a first plurality of optical fibers. A membrane cover is attached to the first ferrule and covers ends of the first plurality of optical fibers. A second ferrule has a second plurality of optical fibers, wherein once the first ferrule is mated with a second ferrule, the membrane cover is pierced by the first plurality of optical fibers, the second plurality of optical fibers, or both.
Example embodiment 15: The photonic connector of embodiment 14, wherein the first ferrule comprises a male connector and the membrane cover is attached to a front face of the first ferrule over the ends of the first plurality of optical fibers.
Example embodiment 16: The photonic connector of embodiment 14 or 15, wherein the first ferrule comprises a male connector and the first plurality of optical fibers extend past the front face sufficiently to pierce the membrane cover.
Example embodiment 17: The photonic connector of embodiment 14, wherein the first ferrule comprises a female connector having a top wall, a back wall, and a bottom wall that form a cavity in the second ferrule, wherein the membrane cover is attached to the back wall of the cavity over the ends of the first plurality of optical fibers.
Example embodiment 18: The photonic connector of embodiment 14, wherein the second ferrule comprises a female connector having a top wall, a back wall, and a bottom wall that form a cavity, wherein the membrane cover is attached to front surfaces of the top, the sides and the bottom walls over the cavity.
Example embodiment 19: The photonic connector of embodiment 18, wherein once the first ferrule is mated with the second ferrule, the second plurality of optical fibers pierce and tear the membrane cover.
Example embodiment 20: The photonic connector of embodiment 14, 15, 16, 17, 18 or 19, wherein the membrane cover comprises a self-healing polymer material.
Example embodiment 21: The photonic connector of embodiment 14, 15, 16, 17, 18, 19 or 20, wherein the membrane cover membrane cover has a height of approximately 8-10 mm and a width of approximately 20-30 mm.
Example embodiment 22: A method of fabricating a photonic connector comprises fabricating a first ferrule having a first plurality of optical fibers. A membrane cover is attached to the first ferrule to cover ends of the first plurality of optical fibers.
Example embodiment 23: The method of embodiment 22, further comprising attaching a membrane cover to the first ferrule with an adhesive membrane.
Example embodiment 24: The method of embodiment 22, further comprising attaching a membrane cover to the first ferrule with thermal welding.
Example embodiment 25: The method of embodiment 22, further comprising attaching a membrane cover to the first ferrule with a clip or press on mechanism.