Claims
- 1. A loudspeaker system module comprising:a piezoelectric element subject to displacement by applied electric potential and having a top side and an under side; a panel diaphragm, having a top side, that is driven by the piezoelectric element and to which the under side of the piezoelectric element is joined; damping means for reducing the structural resonances in the panel diaphragm and located in proximity to the piezoelectric element, said damping means being tunable to damp at a fundamental resonance of the loudspeaker system module and said damping means having another function different from said damping means; and electronic means for receiving an input audio signal and amplifying said signal, said electronic means being electrically connected to said piezoelectric element to apply electric potential thereto, said means having an under side and being positioned above the top side of said piezoelectric element; and means for substantially covering said electronic means and the top side of the piezoelectric element, wherein said damping means completely covers the piezoelectric element between the top side of said panel diaphragm and the under side of said electronic means to isolate said piezoelectric element.
- 2. The module of claim 1 further comprising at least one structural coupling transition layer attached to and positioned intermediate the piezoelectric element and the panel diaphragm.
- 3. The module of claim 1 further comprising at least one structural coupling transition layer attached to and positioned intermediate the piezoelectric element and the panel diaphragm.
- 4. The module of claim 1 further comprising two structural coupling transition layers, being a first structural coupling transition layer positioned on top of and coupled to a second structural coupling transition layer, with both structural coupling transition layers positioned intermediate the piezoelectric element and the panel diaphragm.
- 5. The module of claim 1 wherein said piezoelectric element is a first piezoelectric element and the module is part of a loudspeaker system further comprising;dynamic equilization means for sensing resonant vibrations in the panel diaphragm, converting said vibrations to a signal to be amplified and subtracting said amplified signal from said input audio signal.
- 6. The system of claim 5 wherein the dynamic equalization means includes a second piezoelectric element that is attached to the panel diaphragm and which senses resonant vibrations in the panel diaphragm and converts said vibrations to a signal.
- 7. The system of claim 5 wherein the dynamic equalization means includes means to detect any electrical signal created by the first piezoelectric element which is the result of resonant vibrations in the panel diaphragm.
- 8. The system of claim 5 wherein the electronic means includes a pair of linear power amplifiers operating in a push-pull mode for amplifying the input audio signal.
- 9. A flat panel loudspeaker comprising:a support frame having a top side and an underside; two differently sized stretched diaphragms supported by the frame and capable of producing sound when vibrated, with one diaphragm being attached to the top side of the support frame and the other diaphragm being attached to the underside of the support frame, wherein said support frame and said differently sized diaphragms create an acoustic sealed cavity; two piezoelectric elements for driving the diaphragms, with a separate piezoelectric element being attached to each diaphragm; wherein wherein said diaphragms are held in tension by said support frame to increase a modal density of said diaphragms and to provide additional acoustic energy when driven by said piezoelectric elements thereby operating to flatten a frequency response of said flat panel loudspeaker.
- 10. A loudspeaker system module comprising:a piezoelectric element subject to displacement by applied electric potential and having a top side and an under side; a panel diaphragm having a top side, that is driven by the piezoelectric element and to which the under side of the piezoelectric element is joined; damping means for reducing the structural resonances in the panel diaphragm and located in proximity to the piezoelectric element, said damping means being tunable to damp at a fundamental resonance of the loudspeaker system module, wherein said damping means comprises: a container that contains said electronics means; and damping material on which said container is mounted, wherein said container mounted on said damping material functions as a load on a spring; electronic means for receiving an input audio signal and amplifying said signal, said means being electrically connected to said piezoelectric element to apply electric potential thereto, said means having an under side and being positioned above the top side of said piezoelectric element; and means for substantially covering said electronic means and the top side of the piezoelectric element, wherein said damping means completely covers the piezoelectric element between the top side of said panel diaphragm and the under side of said electronic means to isolate said piezoelectric element.
Parent Case Info
This application is a division of application No. 08/533,048, filed Sep. 25, 1995, which is hereby incorporated by reference.
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