Patent Application
20060175938
This application claims priority is to Japanese Patent Application No. 2005-028688, filed Feb. 4, 2005, the content of which is incorporated herein by reference.
1. Technical Field
The present invention relates to a piezoelectric device and an electronic apparatus.
2. Related Art
Conventionally, piezoelectric devices are used in various types of electronic apparatuses such as acceleration detectors and angular velocity detectors, or digital videos, mobile communication apparatuses, and so on. One widely used type of piezoelectric device includes a piezoelectric module which consists of a piezoelectric element contained in a package and is packaged on a printed circuit board or the like.
Japanese Unexamined Patent Applications No. 2004-96403 and Japanese Unexamined Patent Applications No. H9-27725, disclose examples of techniques relating to a piezoelectric element which is contained in a package.
However, conventional techniques such as the above have the following problems.
In a digital television and a digital camera, two detection axes are set, and a third is set for angular detection. Since, in a conventional piezoelectric module, one piezoelectric element can only detect one detection axis, a plurality of piezoelectric elements must be provided.
However, current reductions in the size and thickness of piezoelectric devices make it difficult to ensure packaging space for a plurality of piezoelectric elements with different detection axis.
Furthermore, when installing a plurality of piezoelectric elements with different detection axis, the detection axis of each piezoelectric element must be precisely positioned, and the positional relationship between a plurality of the detection axes must also be set with high precision. This makes positioning exceptionally complicated.
An advantage of some aspects of the invention is to-provide a piezoelectric device which enables a piezoelectric element to be positioned easily while keeping the device small and thin, and an electronic apparatus which includes this piezoelectric device.
A first aspect of the invention provides a piezoelectric device including: packages, each of which having therein a piezoelectric element having a predetermined direction of detection, wherein the packages are connected to each other so that the directions of detection of the piezoelectric elements intersect each other.
Since the piezoelectric device of this invention forms a module in which a plurality of piezoelectric elements having different axes (detection directions) are combined beforehand, increase in the size and thickness of the device can be suppressed more effectively than when the plurality of piezoelectric elements are mounted individually. In this invention, since the plurality of piezoelectric elements (detection directions) are combined in a single structure beforehand such that they intersect each other, it becomes possible to detect acceleration, angular velocity, and the like, along two or more axes. In addition, the positioning operation which must be performed when mounting the piezoelectric elements can be significantly simplified.
It is preferable that, in the piezoelectric device of the first aspect of the invention, further include a bent flexible substrate, the piezoelectric element of each of the packages is packaged on the bent flexible substrate.
In this configuration, even when the piezoelectric elements intersect each other at a right-angle, their terminals can be easily connected.
It is preferable that, in the piezoelectric device of the first aspect of the invention, further include a frame holding a plurality of the package in a single structure.
Since a plurality of the packages containing the piezoelectric element are firmly attached to and held by the frame, a plurality of the piezoelectric elements can be positioned such that their detection directions intersect each other.
It is preferable that, in the piezoelectric device of the first aspect of the invention, further include a resin material fixing the packages.
It is preferable that, in the piezoelectric device of the first aspect of the invention, further include an adhesive fixing the packages.
It is preferable that, in the piezoelectric device of the first aspect of the invention, a constituent material of the package be any one of: ceramic, glass, metal, or resin.
It is preferable that, in the piezoelectric device of the first aspect of the invention, the packages have connection terminals, a constituent material of a top face of the connection terminal be any one of: copper, gold, or brazing filler metal.
A second aspect of the invention provides an electronic apparatus including the piezoelectric device described above.
According to this configuration, it is possible to provide an electronic apparatus which can detect acceleration, angular velocity, and the like, along two or more axes, and which can be packaged and manufactured easily.
Exemplary embodiments of the piezoelectric device and the electronic apparatus according to this invention will be explained with reference to FIGS. 1 to 7. The piezoelectric device explained here has two axes (detection directions). These embodiments describe a piezoelectric device 100 which is applied in a gyro sensor for detecting angular velocity.
As shown in
The frame 1 is made from a metal such as stainless steel, and is substantially L-shaped so as to form two storage spaces 1a extending in two directions (X direction and Z direction) which intersect each other at a substantial right-angle. The packages 3 are attached in respective storage spaces la and held by joining them to the frame 1 such that the detection directions of the piezoelectric elements 2 (explained later) intersect each other (at a substantial right-angle).
Each package 3 includes a box-like main section 3A which has an open top, and a cap section 3B which closes the open top of the main section 3A. An internal space 4 for containing the piezoelectric element 2 is provided inside each package 3. For example, ceramic, glass, metal, synthetic resin, or the like, or a compound of these, can be used as the material for forming the packages 3.
The piezoelectric element 2 is contained in the internal space 4 of the package 3. The piezoelectric element 2 is made from a piezoelectric material such as crystalline quartz. The piezoelectric element 2 is packaged in the package 3 via a TAB tape 5. The TAB tape 5 is also contained in the internal space 4 inside the package 3. The TAB tape 5 includes an insulating tape 6 of polyimide resin or the like, and conductive interconnection patterns 8 which are disposed on a bottom face 6A of the insulating tape 6. An opening 7 is provided in the center of the insulating tape 6. The overall shape of the insulating tape 6 is therefore ring-like, and so is the bottom face 6A. The interconnection patterns 8 extend from the edges of the insulating tape 6 toward its center, and their center-side ends are arranged in the opening 7. The center-side (opening 7 side) ends of the interconnection patterns 8 rise from the bottom face 6A side of the insulating tape 6 toward the top face side, and form packaging terminals 9 which are electrically connected to the piezoelectric element 2. The piezoelectric element 2 is electrically connected to the packaging terminals 9 of the interconnection patterns 8.
As shown in
As shown in
A control IC 11 is packaged in the package 3 on the bottom face 6A of the TAB tape 5. A wire bonding connects the control IC 11 to the main section 3A. Steps 34 are provided on both sides of the inside of the main section 3A, and connection terminals 35 are disposed on the steps 34. The piezoelectric element 2 is arranged in the main section 3A by placing the ends of the interconnection patterns 8 on the steps 34 and connecting them to the connection terminals 35 of the steps 34.
After the piezoelectric element 2 has been contained, the cap section 3B is attached to the open top of the main section 3A to achieve an airtight seal.
A plurality of electrodes 10 are provided on the rear face (the face on the −Z side) of the main section 3A for electrical connection to various types of apparatuses which incorporate the package 3. Top faces of these electrodes are formed from a material such as copper, metal, and brazing filler metal.
As shown in
When a drive voltage is applied to the excitation electrodes 18 of the piezoelectric element 2, the excitation vibrators 16 vibrate in the Y-axis direction of
The vibration or displacement of the detection vibrators 17 in the Z-axis direction generates an electromagnetic field inside them. This electromagnetic field generated in the detection vibrators 17 is detected by the detection electrodes 19. The detection electrodes 19 output detection signals outside the piezoelectric device 100 via the interconnection patterns 8 of the TAB tape 5, the connection terminals 35, and the electrodes 10. A processor (not shown) is provided outside the piezoelectric device 100, and determines the angular velocity ω based on the detection made by the detection electrodes 19.
To contain the piezoelectric element 2 in the main section 3A of the package 3, the control IC 11 is packaged in the main section 3A by die bonding. The piezoelectric element 2 is then contained in the main section 3A, and the interconnection patterns 8 of the TAB tape 5 are connected to the connection terminals 35 on the steps 34. The cap section 3B is attached to the opening in the main section 3A, and the air inside the main section 3A is vacuumed or substituted with an inert gas such as nitrogen via holes (not shown) which connect to the inside. The package 3 manufactured in this manner is attached via the electrodes 10 to the face 12A of the flexible substrate 12 prior to bending it. While bending the flexible substrate 12, each package 3 is firmly attached in the storage space 1a of the frame 1 and press-fitted therein, thereby completing the piezoelectric device 100.
One of the packages 3 (the package 3 provided along the XY plane at the bottom of
The completed piezoelectric device 100 is packaged on a predetermined circuit substrate which attaches to the other face 12B of the flexible substrate 12.
As described above, according to the piezoelectric device 100 of this embodiment, since the two packages 3 having different detection directions are combined in a module, increase in the size and thickness can be suppressed more effectively than when each package is packaged individually. Furthermore, in this embodiment, since the packages 3 are combined such that the detection directions of the piezoelectric elements 2 intersect each other, i.e. such that there are two detection axes, the detection directions of the piezoelectric elements 2 and the relationship between their detection directions can be positioned beforehand, simplifying the positioning of the piezoelectric device 100. The manufacturing efficiency can also be improved, since the piezoelectric device 100 can be packaged on a circuit substrate or the like in a single operation.
In this embodiment, since a plurality of the packages 3 are combined simply by press-fitting them into the frame 1, the operation of combining them is simplified and the manufacturing efficiency is thereby increased. Moreover, in this embodiment, since two packages 3 are packaged on the bent flexible substrate 12, electrical interconnections between the packages 3 can be formed easily.
While in this embodiment, two packages 3 are packaged on the flexible substrate 12 and then held in the frame, this should not be regarded as limitative of the invention. It would be acceptable to connect the flexible substrate 12 to the packages 3 after they are press-fitted and held in the frame 1.
Subsequently, a second embodiment of the piezoelectric device 100 of this invention will be explained with reference to
While in the first embodiment, two packages 3 are combined in the frame 1, in the second embodiment they are combined by filling with a mold material.
As shown in
In addition to obtaining the same effects and advantages as the first embodiment, this embodiment improves the operability (makes it easier to grasp) and simplifies the packaging operation, since the mold material 20 is filled between the packages 3.
Subsequently, a third embodiment of the piezoelectric device 100 of this invention will be explained with reference to
While in the first and second embodiments, the piezoelectric elements 2 are used to detect two axes, in this embodiment the frame 1 of the first embodiment is used to detect three axes.
As shown in
In this embodiment, increase in the size and thickness of the device can be suppressed more effectively than when each package is packaged individually. In addition, even when detection directions are set along three axes, the detection directions of the piezoelectric elements 2 and the relationship between their detection directions can be positioned beforehand, simplifying the positioning of the piezoelectric device 100.
Electronic Apparatus
The piezoelectric device 100 described above can be incorporated as a gyro sensor in, for example, a digital camera, a GPS, a PDA, or a mobile telephone.
According to the electronic apparatus incorporating the piezoelectric device 100, the apparatus can be made smaller and thinner and productivity can be improved.
While preferred embodiments of the invention have been described and illustrated above, it should be understood that these are exemplary of the invention and are not to be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the spirit or scope of this invention. Accordingly, the invention is not to be considered as being limited by the foregoing description, and is only limited by the scope of the appended claims.
For example, when packaging the piezoelectric element 2 in the package main section 3A, the interconnection patterns 8 may be connected to the connection terminals 35 by an Ag paste of the epoxy-type or silicon type; alternatively, the interconnection patterns 8 may be bonded by single-point bonding or gang bonding using hot pressing or ultrasonic vibration.
The method for packaging the control IC 11 is not limited to wire bonding. Flip-chip packaging may be used instead.
While in the above embodiments, a plurality of packages 3 are combined using the frame 1 and the module material 20, other configurations are acceptable. As for example shown in
This configuration obtains the same effects and advantages as the previous embodiments.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2005-028688 | Feb 2005 | JP | national |
