Claims
- 1. A piezoelectric device comprising:
a supporting substrate; a first conductive trace on a first surface of the supporting substrate; a second conductive trace on the first surface of the supporting substrate and spaced from the first conductive trace; a piezoelectric material layer having first and second surfaces, the first surface of the piezoelectric material layer being secured to the first surface of the supporting substrate and electrically connected to the second conductive trace, the second surface of the piezoelectric material layer being electrically connected to the first conductive trace; and a protective coating extending over at least the second surface of the piezoelectric material layer so that at least a portion of the first and second conductive traces are exposed.
- 2. The piezoelectric device as recited in claim 1 wherein the supporting substrate is formed of a flexible insulating material.
- 3. The piezoelectric device as recited in claim 2 wherein the flexible insulating material is a polyester material.
- 4. The piezoelectric device as recited in claim 2 wherein the flexible insulating material is a polyamide material.
- 5. The piezoelectric device as recited in claim 1 wherein the first and second conductive traces are formed of one of a metallic conductive material and a conductive epoxy material.
- 6. The piezoelectric device as recited in claim 1 wherein the first surface of the piezoelectric material layer is secured to the supporting substrate by a conductive bonding film.
- 7. The piezoelectric device as recited in claim 6 wherein the conductive bonding film is an epoxy film.
- 8. The piezoelectric device as recited in claim 1 wherein the second surface of the piezoelectric material layer is connected to the first conductive trace by a conductive strip.
- 9. The piezoelectric device as recited in claim 8 wherein the conductive strip consists of one of a conductive paint and a coated conductive epoxy.
- 10. The piezoelectric device as recited in claim 1 wherein the protective coating is comprised of a spray painted layer.
- 11. The piezoelectric device as recited in claim 1 wherein the protective coating is comprised of a powder coating.
- 12. The piezoelectric device as recited in claim 1 further comprising a bonding substrate secured to a second surface of the supporting substrate.
- 13. The piezoelectric device as recited in claim 12 wherein the bonding substrate consists of one of double sided tape and a heat activated epoxy.
- 14. The piezoelectric device as recited in claim 1 further including:
a third conductive trace on a second surface of the supporting substrate; a fourth conductive trace on the second surface of the supporting substrate and spaced from the third conductive trace; a second piezoelectric material layer having first and second surfaces, the first surface of the piezoelectric material layer being secured to the second surface of the supporting substrate and electrically connected to the fourth conductive trace, the second surface of the second piezoelectric material layer being electrically connected to the third conductive trace; and a protective coating extending over at least the second surface of the second piezoelectric electric material layer so that at least a portion of the third and fourth conductive traces are exposed.
- 15. A method to manufacture a piezoelectric device comprising the steps of:
providing a supporting substrate having a first conductive trace on a first surface and a second conductive trace on the first surface and spaced from the first conductive trace; securing a first surface of a piezoelectric material layer to the first surface of the supporting substrate so that the first surface of the piezoelectric material layer is electrically connected to the second conductive trace; electrically connecting a second surface of the piezoelectric material layer to the first conductive trace; and applying a protective coating over at least the second surface of the piezoelectric material layer so that at least a portion of the first and second conductive traces are exposed.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Patent Application Ser. No. 60/466,664 filed Apr. 30, 2003 and entitled “Manufacturing Method and Construction of Piezoelectric Device” the complete subject matter of which is hereby incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60466664 |
Apr 2003 |
US |