Claims
- 1. A piezoelectric, polymeric material consisting essentially of a copolymer consisting essentially of 65 to 82 mole percent of vinylidene fluoride and 38 to 18 mole percent of ethylene trifluoride, and having a thickness extensional electromechanical coupling factor (K.sub.t) of between about 0.05 and about 0.31.
- 2. A piezoelectric polymeric material as claimed in claim 1 in which the thickness extensional electromechanical coupling factor (K.sub.t) is greater than 0.1.
- 3. A piezoelectric polymeric material as claimed in claim 1 in which the thickness extensional electromechanical coupling factor (K.sub.t) is greater than about 0.2.
- 4. A piezoelectric polymeric material as claimed in claim 1 in which the copolymer consists essentially of 70 to 82 mole percent of vinylidene fluoride and 30 to 18 mole percent of ethylene trifluoride.
- 5. A process for producing a piezoelectric polymeric material which consists essentially of a copolymer consisting essentially of vinylidene fluoride and ethylene trifluoride, said process comprising heat-treating a polymeric material consisting essentially of a copolymer consisting essentially of 65 to 82 mole percent of vinylidene fluoride and 35 to 18 mole percent of ethylene trifluoride at a heat-treating temperature T(.degree.C.) being in the range of from the temperature of 5(.degree.C.) below the crystal phase transition temperature T'm(.degree.C.) to the melting point temperature Tm(.degree.C.) and then poling the heat-treated polymeric material to achieve a thickness extensional electromechanical coupling factor (K.sub.t) of between about 0.05 and about 0.31.
- 6. A process for producing a piezoelectric polymeric material as claimed in claim 5 in which the heat-treating temperature T(.degree.C.) is in the range of from T'm(.degree.C.) to Tm(.degree.C.).
- 7. A process for producing a piezoelectric polymeric material as claimed in claim 5 in which the copolymer consists essentially of 70 to 82 mole percent of vinylidene fluoride and 30 to 18 mole percent of ethylene trifluoride.
- 8. A process for producing a piezoelectric polymeric material which consists essentially of a copolymer consisting essentially of vinylidene fluoride and ethylene trifluoride which process comprises heat-treating a polymeric material consisting essentially of a copolymer consisting essentially of 65 to 82 mole percent of vinylidene fluoride and 35 to 18 mole percent ethylene trifluoride at a heat-treating temperature T(.degree.C.) being in the range of from the temperature of 5(.degree.C.) below the crystal phase transition temperature T'm(.degree.C.) to the melting point temperature Tm(.degree.C.) while poling the polymeric material to achieve a value of the thickness extensional electromechanical coupling factor (K.sub.t) of between about 0.05 and about 0.31.
- 9. A process for producing a piezoelectric polymeric material as claimed in claim 8 in which the heat-treating temperature T(.degree.C.) is in the range of from T'm(.degree.C.) to Tm(.degree.C.).
- 10. A process for producing a piezoelectric polymeric material as claimed in claim 8 in which the copolymer consists essentially of 70 to 82 mole percent of vinylidene fluoride and 30 to 18 mole percent of ethylene trifluoride.
- 11. A process for producing a film having piezoelectric properties comprising the steps of:
- (I.) providing a film of a random copolymer consisting essentially of 65 to 82 mole percent vinylidene fluoride, balance essentially ethylene trifluoride, having a given melting point Tm(.degree.C.), and having a given crystal phase transition temperature T'm(.degree.C.); and then
- (II.) heating the film to a temperature greater than about T'm but less than Tm for 10 minutes to 2 hours to produce a heat-treated film; and then
- (III.) poling the heat-treated film in an electrical field of about 50 to 1500 kV/cm at a temperature of at least 25.degree. C. for a time of from about 1 minute to about 2 hours but sufficient to give the film a thickness extensional electromechanical coupling factor (K.sub.t) of between about 0.05 and 0.31.
Priority Claims (2)
Number |
Date |
Country |
Kind |
55-13839 |
Feb 1980 |
JPX |
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55-15860 |
Feb 1980 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 232,963 filed Feb. 9, 1981, now abandoned.
US Referenced Citations (8)
Continuations (1)
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Number |
Date |
Country |
Parent |
232963 |
Feb 1981 |
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