Claims
- 1. 9. A method of fabricating a piezoelectric ink-jet print head, comprising the steps of:
providing a substrate; forming a metallic layer over the substrate; forming a lower electrode layer over the metallic layer; forming a patterned piezoelectric layer over the lower electrode layer; forming a patterned upper electrode layer over the piezoelectric layer; forming a patterned thick film layer over the metallic layer, wherein the thick film layer has at least a slot hole that passes through the thick film layer and forms a cavity with the metallic layer, and the cavity encloses the upper electrode layer and the piezoelectric layer; and attaching a nozzle plate to the thick film layer, wherein the nozzle plate, the thick film layer and the metallic layer together form an ink cavity, and the nozzle plate has at least a nozzle continuous with the ink cavity.
- 2. 10. The method of claim 9, wherein after the step of forming the piezoelectric layer, further includes firing the piezoelectric layer.
- 3. 11. The method of claim 9, wherein the substrate includes a silicon wafer.
- 4. 12. The method of claim 9, wherein after the step of attaching a nozzle plate to the thick film layer further includes removing a portion of the substrate to form a position frame.
- 5. 13. The method of claim 12, wherein the step of removing a portion of the substrate includes sandblasting and/or performing photolithography and etching processes.
- 6. 14. The method of claim 9, wherein the step of forming the metallic layer includes electroplating.
- 7. 15. The method of claim 9, wherein material constituting the metallic layer is selected from the group consisting of nickel, copper, palladium and an alloy of various combinations of the metals.
- 8. 16. The method of claim 9, wherein the step of forming the lower electrode includes electroplating or screen printing.
- 9. 17. The method of claim 9, wherein after forming the metallic layer, further includes forming an inert layer over the metallic layer.
- 10. 18. The method of claim 17, wherein material constituting the inert layer is selected from the group consisting of gold, silver, copper, platinum, palladium and an alloy of various combinations of the metals.
- 11. 19. The method of claim 17, wherein material constituting the inert layer is selected from a group consisting of silicon nitride, silicon oxide and tantalum oxide.
- 12. 20. The method of claim 9, wherein the step of forming the piezoelectric layer includes screen-printing.
- 13. 21. The method of claim 9, wherein material constituting the piezoelectric layer includes lead zirconate titanate (PZT) or poly-vinylidene fluoride (PVDF).
- 14. 22. The method of claim 9, wherein the step of forming the upper electrode layer includes screen-printing.
- 15. 23. The method of claim 9, wherein material constituting the thick film layer is selected from a group consisting of dry film photoresist, liquid photoresist, positive photoresist, negative photoresist, light-sensitive polyimide and light-sensitive epoxy.
- 16. 24. The method of claim 9, wherein the step of forming the patterned thick film layer includes performing photolithography and development processes.
Priority Claims (1)
Number |
Date |
Country |
Kind |
90122077 |
Sep 2001 |
TW |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional application of prior US application Ser. No. 10/064,716, filed on Aug. 9, 2002.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10064716 |
Aug 2002 |
US |
Child |
10249939 |
May 2003 |
US |