This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-201876, filed Oct. 18, 2017, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a piezoelectric tactile sensor and a keyboard device.
A piezoelectric material is known to have a direct piezoelectric effect in which a charge (voltage) is generated in proportion to applied mechanical stress, and also have an inverse piezoelectric effect in which the body is deformed when an electric field is applied in contrast.
In the related art, the direct piezoelectric effect is applied to a piezoelectric ultrasonic sensor element to detect vibration using a diaphragm. Such a sensor element includes a substrate having openings and the diaphragm mounted on this substrate such that the openings are covered. In the manufacturing process, the piezoelectric is formed between two electrodes (upper electrode and lower electrode) on one surface side of the diaphragm so as to form a vibration detector. In the operating condition, in response to an ultrasonic wave propagating through a medium such as air, the diaphragm is deflected in the openings, which causes the piezoelectric body to expand and contract in a plane direction of the substrate. As a result, the piezoelectric generates a voltage due to the direct piezoelectric effect and outputs the voltage through the two electrodes.
In general, the ultrasonic sensor element is applicable to a pressure sensor or a tactile sensor. For example, if a pressure is applied to the diaphragm in a downward direction perpendicular to the plane direction, the diaphragm is also deflected toward the downward direction and the piezoelectric body outputs a voltage through the two electrodes, thereby enabling the sensor to detect slight change in pressure.
According to the piezoelectric ultrasonic sensor element using the diaphragm in the related art, in order to draw the upper electrode and the lower electrode outward of the diaphragm, the piezoelectric body located between the upper electrode and the lower electrode extends outward of the opening of the substrate. Accordingly, the piezoelectric body has a cantilevered structure in an extension portion extending outward of the opening portion. Therefore, in response to the deflection, stress is caused by a bending moment in the extension portion of the piezoelectric body. Since the stress affects the deformation of the diaphragm, an output voltage of the ultrasonic sensor element may vary over time.
Embodiments described herein aim to provide a piezoelectric tactile sensor capable of suppressing variations in an output voltage so as to improve long-term reliability, and a keyboard device using this piezoelectric tactile sensor.
A piezoelectric tactile sensor according to an embodiment includes a support body having one or more openings, a diaphragm formed on a surface of the support body, one or more piezoelectric films respectively formed above the openings and on a surface of the diaphragm, and two electrodes that sandwich each of the piezoelectric film. Each of the piezoelectric films has a diameter smaller than a diameter of a corresponding one of the openings and outputs a voltage to the two electrodes in response to a deflection of the diaphragm.
Hereinafter, a configuration of a piezoelectric tactile sensor according to a first embodiment will be described with reference to
As illustrated in
As an example, the substrate 1 is formed of a single crystal silicon wafer having a thickness of 500 μm, for example. An opening portion 3 is formed inside the substrate 1 having a circular hole for detecting pressure. In an embodiment, the opening portions 3 are respectively formed at nine positions as many as the number of the sensor elements 2. As illustrated in
The diaphragm 11 is integrally formed with the substrate 1 so as to cover an upper surface of the opening portion 3. The diaphragm 11 is formed by heating the substrate 1 at high temperature before the opening portion 3. In this manner, the diaphragm 11 is formed of silicon dioxide formed on a surface of the silicon wafer of the substrate 1. It is preferable that a thickness of the diaphragm 11 falls within a range of 1 to 50 μm. As an example, the thickness is set to 4 μm.
In the description, embodiments are described assuming that a direction where the opening portion 3 is formed in the substrate 1 is referred to a downward direction (see
The first electrode 12, the piezoelectric film 13, and the second electrode 14 are stacked on an upper surface of the diaphragm 11. As an example, in the first electrode 12, the piezoelectric film 13, and the second electrode 14, platinum, PZT lead zirconate titanate (PZT), and platinum are respectively deposited using a sputtering method. As an example, the thickness of the first electrode 12 and the second electrode 14 is 0.1 to 0.2 μm. As an example, the thickness of the piezoelectric film 13 is 2 μm. The PZT of the piezoelectric film 13 may also be deposited using a spin coating method.
In order to obtain the piezoelectric film 13 having a high crystal orientation, the piezoelectric film 13 is formed on the polycrystalline first electrode 12 having a strong orientation. The piezoelectric film 13 has an orientation direction (polarization direction) determined when the film is deposited. Polarization is generated in the thickness direction. The piezoelectric film 13 is deposited on the first electrode 12 by using the sputtering method. Accordingly, the polarization direction of the piezoelectric film 13 is aligned with a direction from the first electrode 12 toward the second electrode 14.
The diaphragm 11 is deflected in the downward direction in
In this embodiment, the first electrode 12, the piezoelectric film 13, and the second electrode 14 are formed in a circular shape concentric with the center O of the opening portion 3 having the circular hole. An outer diameter of the circular shape of the first electrode 12, the piezoelectric film 13, and the second electrode 14 is smaller than a diameter D1 of the opening portion 3, e.g., 200 μm. Here, as an example, an outer diameter D2 of the piezoelectric film 13 is set to 140 μm.
As illustrated in
As illustrated in
In a portion of the outer peripheral portion of the piezoelectric film 13, the insulating layer 15 is formed at a position corresponding to the second electrode lead wiring portion 14b. The insulating layer 15 prevents the second electrode lead wiring portion 14b and the first electrode 12 from electrically contacting with each other at the outer peripheral portion of the piezoelectric film 13. As an example, the insulating layer 15 is formed by depositing silicon dioxide through a tetraethoxysilane-chemical vapor deposition (TEOS-CVD) method. As an example, the thickness of the insulating layer 15 is set to 0.5 μm.
The first electrode lead wiring portion 12b and the second electrode lead wiring portion 14b are formed on the insulating layer 15. The first electrode lead wiring portion 12b is connected to the first electrode extension portion 12c of the first electrode 12. The second electrode lead wiring portion 14b is connected to the second electrode 14. As an example, the first electrode lead wiring portion 12b and the second electrode lead wiring portion 14b are formed by depositing gold through a sputtering method. As an example, the thickness is set to 0.1 μm to 0.5 μm.
As illustrated in
The protective layer 16 is formed on the first electrode lead wiring portion 12b and the second electrode lead wiring portion 14b. As an example, the protective layer 16 is formed by depositing a photosensitive polyimide material through a spin coating method. As an example, the thickness is set to 4 μm.
Next, an operation and an advantageous effect of the above-described configuration will be described. The piezoelectric tactile sensor 101 according to this embodiment has the piezoelectric film 13 located in a region smaller than the opening portion 3 of the substrate 1. In the piezoelectric tactile sensor 101, when the diaphragm 11 is deflected due to a minute force or vibration, the piezoelectric film 13 is deflected together with the diaphragm 11. In this manner, the piezoelectric tactile sensor 101 detects the applied force by using a voltage output from the two electrodes (the first electrode 12 and the second electrode 14). In this case, the piezoelectric film 13 is all located inside the opening portion 3 in the plane direction. Accordingly, there is no extension portion of the piezoelectric film 13 from the wall portion around the opening portion 3 to the frame portion 17. Therefore, the piezoelectric film 13 has a free end structure in all directions and has no support portion having a cantilever structure. Accordingly, the piezoelectric film 13 can expand and contract so that a bending moment does not act in all directions. Therefore, long-term reliability can be improved by suppressing variations in an output voltage.
In the above-described first embodiment, the insulating layer 15 is located in only a partial region of the outer peripheral portion of the sensor element 2. However, the insulating layer 15 may cover an entire surface of the sensor element 2. In this case, the insulating layer 15 may be configured to include a contact hole for drawing out the second electrode 14.
According to this embodiment, a voltage output from each of the nine sensor elements 2 can be individually detected.
In the first embodiment, an example has been described in which the sensor element 2 is formed in a circular shape. However, the configuration is not limited thereto. The piezoelectric tactile sensor 301 according to this embodiment has a sensor element 302 having a rectangular shape as illustrated in
A sensor element array 303 of the piezoelectric tactile sensor 301 according to this embodiment is configured so that a plurality of (for example, nine) sensor elements 302 having a square shape are arranged in a 3×3 matrix on the substrate 1 serving as the support body. The substrate 1 internally has nine square opening portions 304 for pressure detection.
In order to form the piezoelectric film 13 having satisfactory crystallinity and orientation, a buffer layer 18 is stacked on the substrate 1 before the piezoelectric film 13 is formed. For example, the buffer layer 18 may be deposited using a single-layer material layer of platinum having the thickness of 0.1 to 0.2 μm or a multilayer material layer of SrTiO3/MgO/TiN. As an example, one side of the opening portion 304 has a length of 200 μm, and an area thereof is 200×200 μm2. As an example, one side of the piezoelectric film 13 has a length of 100 μm, and an area thereof is 100×100 μm2.
In the first embodiment, the first electrode 12 and the second electrode 14 sandwich the piezoelectric film 13 and face each other in an upward-downward direction. In contrast, in this embodiment, the first electrode 312 and the second electrode 314 are formed on the upper surface of the piezoelectric film 13 in a laterally aligned state.
When the buffer layer 18 is formed of a conductive material, in order to electrically insulate the first electrode 312 and the second electrode 314 from the buffer layer 18, an insulating layer 15 is located in a portion of the outer peripheral portion of the sensor element 302. As an example, the thickness of the insulating layer 15 is set to 0.5 μm.
In order to draw out the first electrode 312 and the second electrode 314, a first electrode lead wiring portion 312b and a second electrode lead wiring portion 314b are respectively formed and connected to the first electrode 312 and the second electrode 314. As an example, the first electrode lead wiring portion 312b and the second electrode lead wiring portion 314b are formed by depositing gold through a sputtering method. As an example, the thickness is set to 0.1 μm to 0.5 μm.
The protective layer 16 is formed on the first electrode lead wiring portion 312b and the second electrode lead wiring portion 314b. As an example, the protective layer 16 is formed by depositing a photosensitive polyimide material through a spin coating method. As an example, the thickness is set to 4 μm.
In the first embodiment, a voltage (potential difference) is generated between the first electrode 12 and the second electrode 14 arranged in a direction orthogonal to the plane direction of the piezoelectric film 13. In this embodiment, the voltage (potential difference) is generated between the first electrode 312 and the second electrode 314 in the same direction as the plane direction of the piezoelectric film 13.
Therefore, according to the above-described respective embodiments, it is possible to provide the piezoelectric tactile sensor capable of suppressing variations in the output voltage so as to improve long-term reliability.
Next, an application example of the piezoelectric tactile sensor 101 according to the first embodiment will be described with reference to
In a keyboard device according to this application example, a resin key 110 is located on the substrate 1 including the sensor element array 102. In this embodiment, if the resin key 110 is pressed at time t1, the sensor element array 102 is configured to be pressed.
In an initial state (i.e., a state where the resin key 110 is not pressed), the diaphragm 11 is not deflected. In this state, no voltage is generated by the piezoelectric film 13 (state of (a) in
If the key 110 is kept pressed, piezoelectric strain of the piezoelectric film 13 does not change. Accordingly, no voltage is generated by the piezoelectric film 13 (state of (c) in
As a usage scenario of the keyboard device according to this application example, precise and fine tracking is performed on the generated voltage. In this way, a difference in waveforms generated when each user types using the keyboard device is analyzed. This can be used as one of the biometric authentication methods based on the distinguishable features of a user's typing behavior on the keyboard.
For example, a waveform pattern (time required for pressing and releasing the key 110 or an interval required for typing one character and another character) of the user is pre-registered in a system. In this way, an original communication protocol for authentication is transmitted, thereby enabling the authentication. According to this typing authentication, it is possible to build a low-cost security system that does not require a special device such as a fingerprint reader and an IC card which detects a third party's attempt to perform an illegal operation.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2017-201876 | Oct 2017 | JP | national |