Claims
- 1. A method of providing access to a piezoelectric transducer driving circuit through a piezoelectric transducer assembly comprising the steps of:providing one or more printed circuit (PC) boards containing an electrical driving circuit for a piezoelectric transducer; attaching one end of a piezoelectric transducer assembly to the one or more PC boards, the one end including at least one first aperture; and providing at least one second aperture in another end of the assembly, the at least one first aperture being in operative communication with the at least one second aperture.
- 2. The method of claim 1 further comprising the step of providing at least one conductor extending through the at least one first and second apertures to the PC board.
- 3. A method of chaining together multiple piezoelectric transducers comprising the steps of:providing one or more printed circuit (PC) boards containing at least one electrical driving circuit for a piezoelectric transducer; attaching one end of a first piezoelectric transducer assembly to the one or more PC boards, the one end including at least one first aperture; providing at least one second aperture in another end of the assembly, the at least one first aperture being in operative communication with the at least one second aperture; and electrically connecting at least one second piezoelectric transducer to the one or more PC boards at least in part through the second aperture of the first transducer.
- 4. A method of manufacturing a piezoelectric transducer assembly intended for attachment to a PC board comprising the steps of:forming least one aperture in each of (1) a piezoelectric sound producing diaphragm and (2) a portion of a piezoelectric transducer assembly not disposed for attachment to the PC board; placing a conductor through each of the diaphragm and assembly apertures; and forming an aperture around the conductor at a portion of the assembly disposed for attachment to the PC board.
- 5. The method of claim 4 wherein the last forming step further comprises sealing the interior of the assembly around the conductor with potting material.
- 6. The method of claim 5 wherein each forming step further comprises punching or molding.
- 7. The method of claim 5 wherein the specific sequence of manufacturer comprises first forming the apertures in the diaphragm and the assembly portion not disposed for attachment to the PC board; and then subsequently forming the aperture in the assembly portion disposed for attachment to the PC board.
Parent Case Info
This application is a continuation of application Ser. No. 09/007,596, filed Jan. 15, 1998, now U.S. Pat. No. 6,130,618.
US Referenced Citations (16)
Continuations (1)
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Number |
Date |
Country |
Parent |
09/007596 |
Jan 1998 |
US |
Child |
09/678528 |
|
US |