The invention relates to a variable-response magnetic device integrated on a substrate and comprising at least one element made of piezoelectric material associated with actuating electrodes, and at least one magnetic element able to deform under the stress of the piezoelectric material element.
The invention applies in particular to variable inductors, transmission line elements such as resonators, phase shifters or couplers, or again spin oscillators.
Several types of integrated or semi-integrated variable inductors exist, totally or partially achieved by integrated fabrication techniques originating from microelectronics and enabling continuous and reversible inductance variations. However, the different types of components produced up to now present numerous shortcomings, in particular a too small inductance variation, instability according to the frequency, an actuating mode that is costly in terms of power, etc.
A conventional integrated passive component with inductance variation is generally composed of a coil in one or more parts, in most cases having a very high conductivity, and possibly of one or more magnetic parts, called “magnetic cores”, in most cases having a high relative permeability (typically μR>100). There are three known main principles able to be used for inductance variation.
The first principle consists in adjusting the mutual inductances within the coil by modifying the geometry of the latter, as described in particular in U.S. Pat. No. 6,184,755 and in the article “Self-Assembling MEMS Variable and Fixed RF Inductors” by Lubecke et al. (IEEE Trans. Mic. Th. and Tech. Vol. 49 no11, 2001). It is also possible to adjust the coupling with a secondary winding or with any other conducting part. This principle is the simplest to implement in integrated devices, but it only enables small inductance variations to be achieved.
The second principle consists in adjusting the coupling between the coil and the magnetic element by modifying their relative distance, as described in particular in the article “Microassembled Tunable MEMS Inductor” by Sarkar et al. (IEEE MEMS 2005). This principle enables large inductance variations to be achieved, but poses the problem of actuation, as it requires movements of large amplitude in the plane of the substrate on which the component is produced (typically around 10 μm).
The third principle consists in adjusting the permeability of the magnetic material itself. Several known devices (essentially discrete components) use application of a magnetic field to make the permeability vary, as described in particular in the article “Integrated Tunable Magnetic RF Inductor” by Vroubel et al. (IEEE Elec. Dev. Letter vol. 25 no12, 2004). However, application of a magnetic field requires continuous use of currents, which results in a large power consumption.
Another means exists consisting in using the variation of the magnetic permeability of the material according to the mechanical stresses that are applied thereto, as described in particular in the article “Processing and application of magnetoelastic thin films in high-frequency devices” by Frommberger et al. (Microelectronics Engineering 67-68 2003) and in the article “High-Frequency Magnetoelastic Multilayer Thin Films and Applications” by Ludwig et al. (IEEE Trans. Mag. Vol. 39 no5, 2003). This property is due to the magnetomechanical coupling present in all magnetic materials on various scales and known under the name of magnetoelasticity.
In known manner in magnetoelasticity, it is essential to control the amplitude and direction of the stresses applied in a layer of uniaxial magnetic material. The stresses do in fact have a large influence on the dynamic behavior of the magnetic material. If the stresses are too inhomogeneous or are not applied in directions in the plane of the substrate at 0° or 90° from the axis of anisotropy of the magnetic material, it becomes very difficult to forecast the magnetic properties according to the stresses applied. The permeability variation and the dynamic behavior of the magnetic layer are then no longer controllable.
Moreover, it is necessary to determine the actuating mode of the inductor. Piezoelectric materials are generally used on account of their integration capacity and their low power consumption. Devices combining piezoelectric layers and magnetoelastic layers, in the form of stacks or heterostructures, have already been studied and envisaged for achieving resonators or sensors or variable inductors, as described for example in the article “A New Hybrid Device using Magnetostrictive Amorphous Films and Piezoelectric Substrates” by Arai et al. (IEEE Trans. Mag. Vol. 30 no2, 1994).
As represented schematically in
The article “Magnetoelectric Properties of a Heterostructure of Magnetostrictive and Piezoelectric Composites” by Wan et al. (IEEE Trans. Mag. Vol. 40 no4, 2004) also describes another example of a device combining the use of piezoelectric materials and magnetoelastic materials. As represented schematically in
The devices described above are not integrated but are produced in bulk piezoelectric substrates. Moreover, the mechanical stresses are not controlled, as the piezoelectric material applies stresses in all the directions of the plane. Consequently, the inductance variation is difficult to control and the electromagnetic properties at high frequencies are mediocre.
Furthermore, the document WO 2005/064590 describes a magnetic device comprising on a substrate a stack of a piezoelectric layer fully secured to the substrate and means for generating a surface acoustic wave located on the piezoelectric layer on each side of a ferromagnetic element. The piezoelectric layer is designed to participate in generation of the surface wave and to ensure propagation thereof to the ferromagnetic element.
The document WO 2005/064783 describes different possible structures for a spin oscillator. The first structure comprises on a substrate a piezoelectric layer integral to the substrate and in contact with the free ferromagnetic layer of the oscillator. The above structure comprises actuating means located on each side of the ferromagnetic layer. Application of an electric field causes a deformation at the level of the piezoelectric layer that is transmitted to the ferromagnetic layer. This results in a variation of the magnetoelastic properties of the ferromagnetic layer and therefore a modification of the oscillator frequency and of its quality factor.
A second structure comprises a piezoelectric layer locally suspended with respect to the substrate and in contact with the free layer of the oscillator. Unlike the first structure, the piezoelectric effect is not used, i.e. deformation of the suspended membrane is achieved by electrostatic (or capacitive) effect by means of the dielectric nature of the piezoelectric layer.
A third structure comprises a piezoelectric layer that is also suspended, but at a distance from the free layer of the oscillator. The suspended structure comprises another magnetic element and only serves the purpose of modifying the magnetostatic coupling between the two magnetic elements.
For all the structures described above, no control of the direction of the stresses induced on the ferromagnetic material is performed and the suspended structures described do not in any way act so as to control these stresses.
The object of the invention is to remedy all the above-mentioned shortcomings and has the object of providing an integrated variable-response magnetic device enabling large response variations to be achieved, and enabling these variations to be well controlled, even for high frequencies, by mastering the mechanical stresses imposed on the magnetic material, in order in particular to apply a uniaxial, homogeneous stress of great amplitude in the uniaxial magnetic material.
The object of the invention is characterized in that the device is in the form of a beam that is movable with respect to the substrate and comprising two transverse parts of predetermined width, along a reference longitudinal axis, and in that:
Other advantages and features will become more clearly apparent from the following description of particular embodiments of the invention given for non-restrictive example purposes only and represented in the accompanying drawings, in which:
With reference to the figures, the integrated variable-response magnetic device according to the invention will be described in non-restrictive manner as a variable inductor. However, the device according to the invention also concerns other types of magnetic devices, i.e. elements for antennas, filters or phase shifters, spin oscillators, etc.
With reference to the figures, the integrated variable-response magnetic device is a variable inductor 1 integrated on a substrate that is able to be applied to all fields requiring a continuous (or discrete) and reversible inductance or impedance variation with a low actuating power.
In the particular embodiment represented in
The beam 7 is anchored in a substrate (not represented in
The shape of the piezoelectric material beam 7 has been chosen and optimized to generate uniaxial and homogeneous stresses in the associated magnetic element 8.
In
The magnetic element 8 is preferably made from a uniaxial magnetic material composed of an iron- and/or cobalt- and/or nickel-based alloy, for example deposited under a magnetic field to enhance the anisotropy of the material. Advantageously, the direction of anisotropy is substantially parallel or perpendicular to the reference longitudinal axis A1 of the beam 7.
In
The variable inductor 1 preferably comprises a solenoid coil 12 surrounding the central branch 10 and the associated magnetic element 8. The coil 12 acts as electrically conducting element designed to create a magnetic field around the magnetic element 8, with an inductance value varying according to the voltage applied by the electrodes 11 on the beam 7.
In the alternative embodiments of the variable inductor 1 represented in
In
In
In
Each transverse part 9 of the beam 7 is extended by an optional transition zone 18, of length L3 and variable cross-section, extending from the zones 17 of the transverse parts 9 up to the central branch 10 of the beam 7 and preferably presenting an elliptical shape advantageously tangent to the zone 17 of the transverse parts 9 and to the central branch 10 of the beam 7. The central branch 10, of length L4 and width W2, defines a useful zone 19 of the beam 7, corresponding to the zone of the beam 7 in contact with the magnetic element 8. In the case of presence of the transition zones 18, the upper electrodes 11b and lower electrodes 11a preferably do not extend up to the transition zones 18 (
Each transition zone 18 of elliptical shape in particular enables the stresses to be distributed homogeneously, while ensuring a maximum compactness of the variable inductor 1. Moreover, such a beam 7 embedded at its ends only (anchoring zones 16) also enables larger stresses to be applied, enables these stresses to be better controlled and reduces stray capacitances.
In the alternative embodiments represented in
In the alternative embodiment represented in
In another alternative embodiment, not represented, holes can also be made in the transition zones 18 of the beam 7, as a complement to the holes 20 made in the stress generation zones 17 or as a replacement for the latter.
In other alternative embodiments, not represented, the transverse parts 9 can be in the form of parallel strips of material spaced apart at regular intervals, connected to the central branch 10 and to the anchoring zones 16. Likewise, the central branch 10 can also be formed by parallel strips of material connected to the transverse parts 9.
In the particular embodiments represented in
In general manner, in the case of use of a uniaxial magnetic material for the magnetic element 8, the axis of anisotropy of the material has to be parallel or perpendicular to the reference longitudinal axis A1 of the piezoelectric material beam 7 (
For example, for a variable inductor 1 with a beam 7 as described above, a magnetic element 8 of parallelepipedic shape and a coil 12 of solenoid type, the number of turns is for example comprised between 3 and 20. The width of the magnetic element 8 is about 50 to 300 μm, the thickness of the magnetic element 8 is about 100 nm to 2 μm and the length of the magnetic element 8 is about 50 to 300 μm.
Considering the above examples of values, the electromagnetic properties of the coil 12 (inductance, resistance, capacitance, quality factor, etc.) can be calculated finely by means for example of a finite elements simulation software, such as the “HFSS” software from Ansoft. Furthermore, the lower electrodes 11a and upper electrodes 11b have to be as thin as the production method allows, for example about 50 nm to 1 μm.
The thickness of the beam 7 is for example about 100 nm to 2 μm. In general manner, the thickness of the piezoelectric material beam 7 is a trade-off between the actuating voltage, which decreases with the thickness, and transmission of the stress to the magnetic element 8, which is impaired if the beam 7 is too thin.
For example, in
To dimension the lengths L2 and L3, respectively of the zone 17 and of the transition zone 18 of the transverse parts 9, and also the width W1 of the transverse parts 9, a finite elements simulation software can be used, such as the “ANSYS” software. In general manner, an increase of the length L2 and of the width W1 tends to increase the intensity of the stresses applied to the useful zone 19 to the detriment of the overall size, whereas an increase of the length L3, which is typically about 50 μm to 300 μm, improves the uniaxial and homogeneous nature of the stresses.
In general manner, the maximum voltage applied has to generate stresses that are lower than the plasticity threshold of the materials used for the piezoelectric material beam 7, the magnetic element 8 or the actuating electrodes 11. Likewise, in the case of application of a compressive stress, the voltage applied must not cause buckling of the piezoelectric material beam 7.
In
The use of such an inductor 1 including several coils 12 and several magnetic elements 8 governed by the same actuating device, i.e. the same piezoelectric material beam 7, in particular enables the overall dimensions of the variable inductor 1 to be reduced and the total inductance density to be increased.
In other alternative embodiments, not represented, the two central branches 10 of the beam 7 can be associated with other types of electrically conducting elements, as represented in
A method for producing an integrated variable inductor 1 will be described in greater detail with regard to
In
As an alternative, the lateral ends 23 can be deposited for example by electrolysis and can be formed from a different material from that of the bottom part of the coil 12. The part of the sacrificial layer 22 surrounding the lateral ends 23 can be of a different nature from the part surrounding the coil 12 adjacent to the substrate 21.
The method then comprises deposition of a stack of a first conducting metal layer 24 designed to form the lower electrodes 11a of the inductor 1, of a piezoelectric material layer 25 designed to form the beam 7 of the inductor 1, and of a second conducting metal layer 26 designed to form the upper electrodes 11b of the inductor 1 (
For example, the piezoelectric material layer 25 is deposited by a physical vapor deposition (PVD) process, and the lower electrodes can be made of platinum for a lead titanium zirconate (PZT) piezoelectric beam, or of molybdenum for an aluminum nitride (AlN) piezoelectric beam. The upper electrodes can be of a different nature from the lower electrodes, for example made of gold, copper or tungsten, etc. Complementary protective layers (not represented), for example made of gold or tungsten, can be provided, in particular to facilitate subsequent release of the inductor.
In
A layer 27 of uniaxial magnetic material (
In
In
Formation of the top part of the coil 12 can be achieved by etching and contact resumption through the sacrificial layer 28 by a chemical or physical chemical method or by reactive ionic etching. Deposition of the top part of the coil 12 can be performed by electrolysis and can be achieved from a different material from that of the bottom part of the coil 12. Release of the structure can be performed by selective chemical etching of the wet etching or physical chemical etching (RIE) type, of the sacrificial layers 22 and 28.
In
Such an integrated variable inductor 1 according to the different embodiments described above therefore enables a homogeneous and uniaxial stress—either tensile or compressive—to be applied to the magnetic element, and enables the value of these stresses to be maximized for a given actuating voltage, due in particular to the characteristic form and shape of its beam.
Moreover, the use of a released piezoelectric material beam embedded at both ends enables the mechanical and electromagnetic properties of the variable inductor according to the invention to be improved, so as to obtain large, continuous or discontinuous, reversible inductance variations with low actuating voltages, while at the same time keeping good frequency properties, in partial at high frequencies.
The invention is not limited to the different embodiments described above. The values of widths and lengths of the different zones of the beam 7 are non-restrictive and depend in particular on the required size of the variable inductor 1 and on the required inductance value. The electrodes 11 can extend above the transition zones 18 of the beam 7 (
In the alternative embodiment represented in
In another alternative embodiment represented in
In another alternative embodiment, not represented, the piezoelectric material beam 7 and the associated magnetic element 8 can be encapsulated in layers 22 and 28 of sufficiently soft insulating material, for example a polymer resin with a low dielectric constant, to enable a sufficient deformation of the beam 7 with respect to the substrate without having to remove the layers 22 and 28. It is then no longer necessary to perform releasing of the beam 7.
In general manner, the invention applies to any variable-response magnetic device in the form of a beam 7 comprising an element made of piezoelectric material. The piezoelectric material element can be formed by the whole beam 7 or only by parts of the beam, i.e. a part of a transverse part 9, a whole transverse part 9 or both the transverse parts 9, the central branch 10 and the transition zones 18 then being able to be made from another material.
The invention applies in particular to any type of reconfigurable electronic circuit for which a limitation of the number of components is sought for by using adjustable components. The principle used to make the dynamic permeability vary, as well as practical application of this principle, are not limited in terms of inductance or operating frequency values. The invention therefore applies to all the fields where a continuous (or discontinuous) and reversible dynamic permeability variation is necessary, with a very low actuating power, in particular reconfigurable multiband circuits, fine impedance tuning and tunable oscillators.
The invention also applies to other types of variable-response magnetic devices, according to the manner in which the magnetic element 8 is associated with the electrically conducting element (the coil 12 for example). In general manner, the magnetic element has to be mechanically secured to the piezoelectric material beam so that deformations of said beam generate a variation of the magnetic properties of the magnetic element.
Thus, in the case where the electrically conducting element is placed at a distance from the magnetic element on one side of the magnetic element only, for example in the case of the element in serpentine form 13 (
In the case where the electrically conducting element is placed on one side of the magnetic element only, it is also possible to achieve line transmission elements such as resonators, phase shifters, couplers, antennas, filters, etc.
In
Number | Date | Country | Kind |
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06 07966 | Sep 2006 | FR | national |
Number | Name | Date | Kind |
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6184755 | Barber et al. | Feb 2001 | B1 |
20030030527 | Mhani et al. | Feb 2003 | A1 |
20080061916 | Pulskamp | Mar 2008 | A1 |
Number | Date | Country |
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6-97957 | Sep 1992 | JP |
A 8-288143 | Nov 1996 | JP |
A 11-40427 | Feb 1999 | JP |
A 2000-296612 | Oct 2000 | JP |
WO 2005064590 | Jul 2005 | WO |
WO 2005064783 | Jul 2005 | WO |
Number | Date | Country | |
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20080068759 A1 | Mar 2008 | US |